The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- Series:
APA300
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | # I/Os (Max) | # Registers | Base Product Number | Clock Frequency-Max | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Usable Gates | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Total RAM Bits | Number of Gates | Speed Grade | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width |
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 | Mfr Part No APA300-BG456 | Microchip Technology | Datasheet | 1987 |
| Min: 1 Mult: 1 | Surface Mount | BGA-456 | YES | 456-PBGA (35x35) | 456 | APA300 | 180 MHz | 24 | MICROSEMI CORP | APA300-BG456 | 180 MHz | 2.7 V | + 70 C | Microchip Technology | 2.3 V | 0 C | Yes | 3 | SMD/SMT | 290 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 2.5000 V | 0 to 70 °C | Tray | APA300 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1.27 mm | unknown | 456 | S-PBGA-B456 | 290 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 290 | 300000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | STD | 8192 | 300000 | 1.73 mm | 35 mm | 35 mm | |||||||||||||||||||||||
| Mfr Part No APA300-CQ208M | Microchip Technology | Datasheet | 580 |
| Min: 1 Mult: 1 | Surface Mount | CQFP-208 | 208-CQFP (75x75) | APA300 | 1 | 5 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 158 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 2.5 V | 2.5 V | Actel | 7.713328 oz | -55°C ~ 125°C (TC) | APA300 | 2.3V ~ 2.7V | 2.5 V | 73728 | 300000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No APA300-BGG456M | Microchip Technology | Datasheet | 544 | - | Min: 1 Mult: 1 | Surface Mount | BGA-456 | YES | 456-PBGA (35x35) | 456 | APA300 | 180 MHz | 24 | MICROSEMI CORP | APA300-BGG456M | 180 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 290 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | -55°C ~ 125°C (TC) | Tray | APA300 | 3A001.A.2.C | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 245 | 1.27 mm | compliant | S-PBGA-B456 | 290 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | MILITARY | 290 | 300000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | 8192 | 300000 | 1.73 mm | 35 mm | 35 mm | |||||||||||||||||||||||||||
| Mfr Part No APA300-FG144 | Microchip Technology | Datasheet | 1696 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 144-FPBGA (13x13) | APA300 | 160 | 180 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 100 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | APA300 | 2.3V ~ 2.7V | 2.5 V | 73728 | 300000 | STD | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No APA300-FGG256I | Microchip Technology | Datasheet | 2354 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | APA300 | 180 MHz | 90 | MICROSEMI CORP | APA300-FGG256I | 180 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 186 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | APA300 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B256 | 186 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 186 | 300000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | STD | 8192 | 300000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||
| Mfr Part No APA300-FGG144I | Microchip Technology | Datasheet | 1838 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | 100 | 8192 | APA300 | 180 MHz | 300000 | 160 | PROASICPLUS | MICROSEMI CORP | APA300-FGG144I | 180 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 100 I/O | 300000 | 2.7(V) | 2.3(V) | 2.5(V) | -40C to 85C | 85C | -40C | Industrial | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | FBGA | Active | 0.22UM | Active | Yes | No | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | APA300 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 260 | 1 mm | compliant | 180(MHz) | 144 | S-PBGA-B144 | 100 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 100 | 300000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | STD | 8192 | 300000 | 1.05 mm | 13 mm | 13 mm | |||||
| Mfr Part No APA300-BGG456I | Microchip Technology | Datasheet | 732 | - | Min: 1 Mult: 1 | Surface Mount | BGA-456 | YES | 456-PBGA (35x35) | 456 | APA300 | 180 MHz | 24 | MICROSEMI CORP | APA300-BGG456I | 180 MHz | 2.7 V | + 85 C | Microchip Technology | 2.3 V | - 40 C | Yes | 3 | SMD/SMT | 290 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 2.5000 V | -40 to 85 °C | Tray | APA300 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 245 | 1.27 mm | compliant | 456 | S-PBGA-B456 | 290 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 290 | 300000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | STD | 8192 | 300000 | 1.73 mm | 35 mm | 35 mm | |||||||||||||||||||||
| Mfr Part No APA300-FGG256A | Microchip Technology | Datasheet | 2332 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | APA300 | 90 | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 186 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA300 | 2.375V ~ 2.625V | 2.5 V | 73728 | 300000 | STD | 1.2 mm | 17 mm | 17 mm |
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APA300-BG456
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
466.235808
-
APA300-CQ208M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
2,514.622559
-
APA300-BGG456M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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APA300-FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
375.091971
-
APA300-FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
502.293725
-
APA300-FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
326.691879
-
APA300-BGG456I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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APA300-FGG256A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
542.826816