The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Additional Feature
- Base Product Number
- Clock Frequency-Max
- Combinatorial Delay of a CLB-Max
- Factory Pack QuantityFactory Pack Quantity
- HTS Code
- Height
- Ihs Manufacturer
- JESD-30 Code
- JESD-609 Code
- Manufacturer Part Number
- Series
- Series:
EX256
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Operating Supply Voltage | Temperature Grade | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Number of Gates | Combinatorial Delay of a CLB-Max | Number of Equivalent Gates | Height | Length | Width |
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 | Mfr Part No EX256-TQG100 | Microchip Technology | Datasheet | 88 |
| Min: 1 Mult: 1 | Surface Mount | TQFP-100 | YES | 100-TQFP (14x14) | 100 | EX256 | 250 MHz | 90 | MICROSEMI CORP | EX256-TQG100 | 250 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 81 I/O | - | 512 LE | 70 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.29 | Details | Yes | 2.7 V | 2.3 V | 2.5 V | Actel | 0.023175 oz | 0°C ~ 70°C (TA) | Tray | EX256 | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G100 | 2.5 V | COMMERCIAL | 12000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 512 | 12000 | 1 ns | 12000 | 1.4 mm | 14 mm | 14 mm |