The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Mounting Type
- Number of Gates
- Number of I/Os
- Number of Logic Elements/Cells
- Operating Temperature
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- Series
- Voltage - Supply
- Length
- Width
- HTS Code
- Programmable Logic Type
- Series:
IGLOO
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Approvals | Base Product Number | Clock Frequency-Max | Contact Materials | Ihs Manufacturer | Insulation Materials | Manufacturer | Manufacturer Part Number | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitivity Levels | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shell Sizes | Shell Style# | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Voltage, Rating | Operating Temperature | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Color | Applications | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | Pin Count | Number of Conductors | JESD-30 Code | Qualification Status | Contact Gender | Operating Supply Voltage | Wire Gauge | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Number of Poles | Jacket Color | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Speed Grade | Number of CLBs | Stranding | Number of Equivalent Gates | Contact Configuration | Outer Diameter | Conductor Type | Height | Length | Width | Insulation Thickness | Lead Free |
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 | Mfr Part No AGL125V5-FG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | AGL125 | 108 MHz | MICROSEMI CORP | Microsemi Corporation | AGL125V5-FG144I | Microchip Technology | 3 | 97 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.28 | No | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 85°C (TA) | IGLOO | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 3072 CLBS, 125000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 3072 | 36864 | 125000 | STD | 3072 | 125000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL125V2-FGG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | AGL125 | 108 MHz | MICROSEMI CORP | Microsemi Corporation | AGL125V2-FGG144 | Microchip Technology | 3 | 97 | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.25 | Yes | 1.575 V | 1.14 V | 1.2 V | 0°C ~ 70°C (TA) | IGLOO | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | OTHER | 3072 CLBS, 125000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 3072 | 36864 | 125000 | STD | 3072 | 125000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL030V2-VQG100I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 100-TQFP | YES | 100-VQFP (14x14) | 100 | AGL030 | 108 MHz | MICROSEMI CORP | AGL030V2-VQG100I | 1.575 V | Microchip Technology | 1.14 V | 3 | 77 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 1.39 | Yes | 1.575 V | 1.14 V | 1.2 V | 1.2, 1.5 V | -40 to 85 °C | IGLOO | e3 | Tin (Sn) | 8542.39.00.01 | 1.14V ~ 1.575V | QUAD | GULL WING | NOT SPECIFIED | 0.5 mm | compliant | S-PQFP-G100 | Not Qualified | INDUSTRIAL | 768 CLBS, 30000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 768 | 30000 | STD | 768 | 30000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL030V5-QNG48 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | YES | 48-QFN (6x6) | 48 | AGL030 | MICROSEMI CORP | AGL030V5-QNG48 | Microchip Technology | 3 | 34 | 85 °C | Tray | UNSPECIFIED | HQCCN | HQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Active | Active | NOT SPECIFIED | 5.23 | Yes | 1.575 V | 1.425 V | 1.5 V | 0°C ~ 70°C (TA) | IGLOO | 8542.39.00.01 | 1.425V ~ 1.575V | QUAD | NO LEAD | NOT SPECIFIED | compliant | S-XQCC-N48 | Not Qualified | OTHER | 768 CLBS, 30000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 768 | 30000 | STD | 768 | 30000 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AGL250V2-VQG100I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 100-TQFP | YES | 100 | 100-VQFP (14x14) | 100 | M1AGL250 | 108 MHz | MICROSEMI CORP | M1AGL250V2-VQG100I | 1.575 V | Microchip Technology | 1.14 V | 3 | 68 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 40 | 1.44 | Compliant | Yes | 8542390000/8542390000/8542390000/8542390000/8542390000 | 1.575 V | 1.14 V | 1.2 V | 1.2, 1.5 V | -40 to 85 °C | IGLOO | e3 | Matte Tin (Sn) | 85 °C | -40 °C | 8542.39.00.01 | 1.14V ~ 1.575V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G100 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.14 V | 4.5 kB | 6144 CLBS, 250000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 6144 | 36864 | 250000 | STD | 6144 | 250000 | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||
| Mfr Part No AGL1000V5-FGG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | AGL1000 | 108 MHz | Silver Plated | MICROSEMI CORP | Joy Cooper Interconnect | C3100A36-9SN | Microchip Technology | 3 | 97 | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 1.37 | No | Yes | 36 | Wall Mounting Receptacle | 1.575 V | 1.425 V | 1.5 V | 0°C ~ 70°C (TA) | IGLOO | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | Socket | OTHER | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | STD | 24576 | 1000000 | https://docs.galco.com/techdoc/coh/c3100a36-9sn_cf.pdf | 2.44 Inches | 13 mm | |||||||||||||||||||||||||||||||||||
| Mfr Part No M1AGL1000V2-FGG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 144 | M1AGL1000 | 108 MHz | MICROSEMI CORP | Microsemi Corporation | M1AGL1000V2-FGG144I | Microchip Technology | 3 | 97 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.32 | Compliant | Yes | 1.575 V | 1.14 V | 1.2 V | -40°C ~ 85°C (TA) | IGLOO | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 127 µA | 18 kB | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1e+06 | 250 MHz | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||
| Mfr Part No AGL030V5-UCG81 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 81-WFBGA, CSBGA | YES | 81-UCSP (4x4) | 81 | AGL030 | 108 MHz | MICROSEMI CORP | Microsemi Corporation | AGL030V5-UCG81 | 1.575 V | Microchip Technology | 1.425 V | 66 | 85 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 0.81 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | 0 to 70 °C | IGLOO | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.4 mm | compliant | S-PBGA-B81 | Not Qualified | OTHER | 768 CLBS, 30000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 768 | 30000 | STD | 768 | 30000 | 4 mm | 4 mm | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AGL1000V2-CSG281I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 281-TFBGA, CSBGA | YES | 281 | 281-CSP (10x10) | 281 | M1AGL1000 | 108 MHz | MICROSEMI CORP | Microsemi Corporation | M1AGL1000V2-CSG281I | 1.575 V | Microchip Technology | 1.14 V | 3 | 215 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFBGA | 10 X 10 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, CSP-281 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.32 | Compliant | Yes | 1.575 V | 1.14 V | 1.2 V | 1.5000 V | -40 to 85 °C | IGLOO | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 0.5 mm | compliant | 281 | S-PBGA-B281 | Not Qualified | INDUSTRIAL | 18 kB | 24576 CLBS, 1000000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1e+06 | STD | 24576 | 1000000 | 10 mm | 10 mm | |||||||||||||||||||||||||||||
| Mfr Part No AGL125V5-CS196I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 196-TFBGA, CSBGA | YES | 196-CSP (8x8) | 196 | cULus | AGL125 | 108 MHz | MICROSEMI CORP | Hubbell | PT2X2IGBRS | 1.575 V | Microchip Technology | 1.425 V | 133 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.3 | No | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 85 °C | IGLOO | Brass | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | unknown | 20 A | S-PBGA-B196 | Not Qualified | INDUSTRIAL | 3072 CLBS, 125000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 3072 | 36864 | 125000 | STD | 3072 | 125000 | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL125V5-VQG100 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 100-TQFP | YES | 100-VQFP (14x14) | 100 | AGL125 | 108 MHz | MICROSEMI CORP | Microsemi Corporation | AGL125V5-VQG100 | 1.575 V | Microchip Technology | 1.425 V | 3 | 71 | 85 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 1.58 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | 0 to 70 °C | IGLOO | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | NOT SPECIFIED | 0.5 mm | compliant | S-PQFP-G100 | Not Qualified | OTHER | 3072 CLBS, 125000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 3072 | 36864 | 125000 | STD | 3072 | 125000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL400V2-CSG196 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 196-TFBGA, CSBGA | YES | 196-CSP (8x8) | 196 | AGL400 | MICROSEMI CORP | Microsemi Corporation | AGL400V2-CSG196 | 1.575 V | Microchip Technology | 1.14 V | 3 | 143 | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.25 | Yes | 1.575 V | 1.14 V | 1.2 V | 1.2, 1.5 V | 0 to 70 °C | IGLOO | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | S-PBGA-B196 | Not Qualified | OTHER | 9216 CLBS, 400000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 9216 | 55296 | 400000 | STD | 9216 | 400000 | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL030V2-QNG48 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | YES | 48-QFN (6x6) | 48 | AGL030 | MICROSEMI CORP | Microsemi Corporation | AGL030V2-QNG48 | Microchip Technology | 3 | 34 | 85 °C | Tray | UNSPECIFIED | HQCCN | HQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Active | Active | NOT SPECIFIED | 5.24 | Yes | 1.575 V | 1.14 V | 1.2 V | 0°C ~ 70°C (TA) | IGLOO | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | NO LEAD | NOT SPECIFIED | compliant | S-XQCC-N48 | Not Qualified | OTHER | 768 CLBS, 30000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 768 | 30000 | STD | 768 | 30000 | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL125V5-FGG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | AGL125 | 108 MHz | MICROSEMI CORP | Greenlee | 02446 | 1.575 V | Microchip Technology | 1.425 V | 3 | 97 | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 1.46 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | 0 to 70 °C | IGLOO | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | OTHER | 3072 CLBS, 125000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 3072 | 36864 | 125000 | STD | 3072 | 125000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL125V2-CS196I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 196-TFBGA, CSBGA | 196-CSP (8x8) | AGL125 | Miscellaneous | 1.575 V | Microchip Technology | 1.14 V | 133 | Tray | Active | 1.2, 1.5 V | -40 to 85 °C | IGLOO | 1.14V ~ 1.575V | 3072 | 36864 | 125000 | STD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL030V2-UCG81I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 81-WFBGA, CSBGA | YES | 81-UCSP (4x4) | 81 | CSA, NEC, UL | AGL030 | 108 MHz | MICROSEMI CORP | PVC | General Cable | C0940.21.10 | 1.575 V | Microchip Technology | 1.14 V | 3 | 66 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 1.4 | Yes | 1.575 V | 1.14 V | 1.2 V | 1.2, 1.5 V | 300 V | -40 to 85 °C | IGLOO | Computer Cable | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | Two Layer Overall | NOT SPECIFIED | 0.4 mm | compliant | 4 | S-PBGA-B81 | Not Qualified | 28 AWG | INDUSTRIAL | Gray | 768 CLBS, 30000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 768 | 30000 | STD | 768 | 7/36 | 30000 | 0.176 | Stranded | 4 mm | 4 mm | 0.01 | ||||||||||||||||||||||||||||
| Mfr Part No M1AGL1000V5-FGG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 484 | CSA, UL | M1AGL1000 | 108 MHz | MICROSEMI CORP | Cutler Hammer, Div of Eaton Corp | NGK412KSW | Microchip Technology | 3 | 300 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.29 | Compliant | Yes | 8542390000/8542390000/8542390000/8542390000/8542390000 | 1.575 V | 1.425 V | 1.5 V | 0°C ~ 70°C (TA) | IGLOO | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 1,200 A | S-PBGA-B484 | Not Qualified | OTHER | 127 µA | 18 kB | 4 | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1e+06 | 250 MHz | 24576 | 1000000 | 23 mm | 23 mm | Lead Free | ||||||||||||||||||||||||||||
| Mfr Part No AGL400V5-FGG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | AGL400 | MICROSEMI CORP | GE | CR305X100A | Microchip Technology | 3 | 178 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | 0 to 70 °C | IGLOO | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | OTHER | 9216 CLBS, 400000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 9216 | 55296 | 400000 | STD | 9216 | 400000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL125V2-FG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | AGL125 | 108 MHz | MICROSEMI CORP | Microsemi Corporation | AGL125V2-FG144 | 1.575 V | Microchip Technology | 1.14 V | 3 | 97 | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.28 | No | 1.575 V | 1.14 V | 1.2 V | 1.2, 1.5 V | 0 to 70 °C | IGLOO | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B144 | Not Qualified | OTHER | 3072 CLBS, 125000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 3072 | 36864 | 125000 | STD | 3072 | 125000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL060V5-VQG100 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 100-TQFP | YES | 100-VQFP (14x14) | 100 | AGL060 | 108 MHz | MICROSEMI CORP | Microsemi Corporation | AGL060V5-VQG100 | 1.575 V | Microchip Technology | 1.425 V | 3 | 71 | 85 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 1.62 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | 0 to 70 °C | IGLOO | e3 | Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | NOT SPECIFIED | 0.5 mm | compliant | S-PQFP-G100 | Not Qualified | OTHER | 1536 CLBS, 60000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 18432 | 60000 | STD | 1536 | 60000 | 14 mm | 14 mm |
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AGL125V5-FG144I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL125V2-FGG144
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL030V2-VQG100I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL030V5-QNG48
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL250V2-VQG100I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL1000V5-FGG144
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL1000V2-FGG144I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL030V5-UCG81
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL1000V2-CSG281I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL125V5-CS196I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL125V5-VQG100
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL400V2-CSG196
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL030V2-QNG48
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL125V5-FGG144
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL125V2-CS196I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL030V2-UCG81I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL1000V5-FGG484
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL400V5-FGG256
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL125V2-FG144
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL060V5-VQG100
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire