The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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IGLOO2
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Contact Shape | Supplier Device Package | Housing Material | Number of Terminals | PCB Mounting Orientation | PCB Mount Retention | PCB Mount Alignment | Base Product Number | Brand | Contact Materials | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tail Length | Tradename | Typical Operating Supply Voltage | Operating Temperature | Packaging | Series | JESD-609 Code | Termination | ECCN Code | Connector Type | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Number of Rows | HTS Code | Subcategory | Pitch | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Depth | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Number of Outputs | Qualification Status | Number of Contacts | Housing Color | Operating Supply Voltage | Power Supplies | Contact Style | Temperature Grade | ELV | Max Supply Voltage | Min Supply Voltage | RAM Size | Data Rate | Number of Inputs | Mating Retention | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Speed Grade | Number of Transceivers | Preloaded | Number of Logic Cells | Product Category | Height | Length | Width | Lead Free |
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 | Mfr Part No M2GL050TS-1FGG896I | Microchip | Datasheet | 1812 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 896-BGA | YES | 896-FBGA (31x31) | 896 | M2GL050 | MICROSEMI CORP | Microsemi Corporation | M2GL050TS-1FGG896I | Microchip Technology | 3 | 377 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | 228.3 kB | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 56340 | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050-FCSG325 | Microchip | Datasheet | 1633 |
| Min: 1 Mult: 1 | Surface Mount | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2GL050 | MICROSEMI CORP | Microsemi Corporation | M2GL050-FCSG325 | Microchip Technology | 3 | 200 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA325,21X21,20 | BGA325,21X21,20 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | OTHER | 200 | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 56340 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL010-1VF256I | Microchip | Datasheet | 24 | - | Min: 1 Mult: 1 | Surface Mount | 256-LFBGA | 256-FPBGA (14x14) | M2GL010 | + 100 C | Microchip Technology | - 40 C | SMD/SMT | 138 | 12084 LE | Tray | Active | 1.2 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | 1.14V ~ 2.625V | 1.2 V | 12084 | 933888 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090TS-1FCS325 | Microchip | Datasheet | 1660 | - | Min: 1 Mult: 1 | Surface Mount | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2GL090 | MICROSEMI CORP | Microsemi Corporation | M2GL090TS-1FCS325 | + 85 C | Microchip Technology | 0 C | SMD/SMT | 180 | 86184 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | 11 X 11 MM, 0.50 MM PITCH, FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | No | 1.2 V | 1.2 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 180 | Not Qualified | 1.2 V | 1.2 V | OTHER | 180 | FIELD PROGRAMMABLE GATE ARRAY | 86184 | 2648064 | 4 Transceiver | 86316 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL060T-FG484 | Microchip | Datasheet | 1808 | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | 484-FPBGA (23x23) | M2GL060 | + 85 C | Microchip Technology | 0 C | SMD/SMT | 267 | 56520 LE | Tray | Active | 1.2 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 1.14V ~ 2.625V | 1.2 V | 56520 | 1869824 | 4 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL025T-FG484 | Microchip | Datasheet | 2039 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2GL025 | MICROSEMI CORP | Miscellaneous | M2GL025T-FG484 | + 85 C | Microchip Technology | 0 C | 3 | SMD/SMT | 267 | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.3 | Non-Compliant | No | 1.2 V | 1.2 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 85 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 1.2 V | OTHER | 138 kB | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 27696 | 1130496 | 4 Transceiver | 27696 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL150-1FC1152 | Microchip | Datasheet | 2117 |
| Min: 1 Mult: 1 | Surface Mount | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2GL150 | MICROSEMI CORP | Microsemi Corporation | M2GL150-1FC1152 | Microchip Technology | 574 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.3 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | Field Programmable Gate Arrays | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | OTHER | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 146124 | 5120000 | 146124 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090-FG676I | Microchip | Datasheet | 2203 | - | Min: 1 Mult: 1 | Surface Mount | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2GL090 | Microchip Technology / Atmel | 40 | MICROSEMI CORP | Microchip | M2GL090-FG676I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 425 | 86316 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | IGLOO2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Programmable Logic ICs | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | 1.2 V | 667 Mb/s | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86184 | SoC FPGA | 2648064 | 4 Transceiver | 86316 | FPGA - Field Programmable Gate Array | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050-FG896 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 896-BGA | YES | 896-FBGA (31x31) | 896 | M2GL050 | MICROSEMI CORP | Microsemi Corporation | M2GL050-FG896 | Microchip Technology | 3 | 377 | 85 °C | Tray | PLASTIC/EPOXY | BGA | 31 X 31 MM, 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.3 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 85 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | OTHER | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 56340 | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090-1FGG484 | Microchip | Datasheet | 1836 | - | Min: 1 Mult: 1 | Production (Last Updated: 10 months ago) | Gold, Lead, Tin | Through Hole | Surface Mount | 484-BGA | YES | 15 | Round | 484-FPBGA (23x23) | Aluminium | 484 | Vertical | Without | Without | M2GL090 | Brass | MICROSEMI CORP | Microsemi Corporation | M2GL090-1FGG484 | + 85 C | Microchip Technology | 0 C | 3 | SMD/SMT | 267 | 86184 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Non-Compliant | Yes | 1.2 V | 1.2 V | 1.2 V | 2.29 mm | 0°C ~ 85°C (TJ) | Bulk | IGLOO2 | Solder | Male Pin, Pin, Plug | 15 | 200 °C | -200 °C | 1 | 8542.39.00.01 | Field Programmable Gate Arrays | 635 µm | 1.14V ~ 2.625V | BOTTOM | Vertical | BALL | 260 | 1 mm | 7.11 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 15 | Natural | 1.2 V | 1.2 V | Pin | OTHER | Non-Compliant | 1.26 V | 1.14 V | 323.3 kB | 267 | With | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86316 | 2648064 | Yes | 86316 | 7.5184 mm | 14.1859 mm | 23 mm | Contains Lead | |||||||||||||||||||||
| Mfr Part No M2GL150TS-1FCG1152M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2GL150 | MICROSEMI CORP | Microsemi Corporation | M2GL150TS-1FCG1152M | Microchip Technology | 4 | 574 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 5.27 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | IGLOO2 | 3A001.A.2.C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | 30 | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | MILITARY | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 146124 | 5120000 | 146124 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL005S-TQ144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LQFP | YES | 144-TQFP (20x20) | 144 | MICROSEMI CORP | Microsemi Corporation | M2GL005S-TQ144I | Microchip Technology | 3 | 84 | Tray | PLASTIC/EPOXY | LFQFP | 20 X 20 MM, 0.50 MM PITCH, TQFP-144 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 20 | 5.57 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | QUAD | GULL WING | 240 | 0.5 mm | compliant | S-PQFP-G144 | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 6060 | 719872 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL005-1TQ144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LQFP | YES | 144-TQFP (20x20) | 144 | MICROSEMI CORP | Microsemi Corporation | M2GL005-1TQ144 | Microchip Technology | 3 | 84 | 85 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 20 | 5.57 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | QUAD | GULL WING | 240 | 0.5 mm | compliant | S-PQFP-G144 | OTHER | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 6060 | 719872 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL005-TQG144 | Microchip | Datasheet | 4000 | - | Min: 1 Mult: 1 | Surface Mount | 144-LQFP | YES | 144-TQFP (20x20) | 144 | M2GL005 | MICROSEMI CORP | M2GL005-TQG144 | + 85 C | Microchip Technology | 0 C | 3 | SMD/SMT | 84 | 6060 LE | 85 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.54 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G144 | 1.2 V | OTHER | - | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 6060 | 719872 | STD | - | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL005S-TQ144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LQFP | YES | 144-TQFP (20x20) | 144 | MICROSEMI CORP | M2GL005S-TQ144 | Microchip Technology | 3 | 84 | 85 °C | Tray | PLASTIC/EPOXY | LFQFP | 20 X 20 MM, 0.50 MM PITCH, TQFP-144 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 20 | 5.57 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | QUAD | GULL WING | 240 | 0.5 mm | compliant | S-PQFP-G144 | OTHER | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 6060 | 719872 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090T-1FGG676I | Microchip | Datasheet | 1861 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 676-BGA | YES | 676 | 676-FBGA (27x27) | 676 | M2GL090 | MICROSEMI CORP | Microsemi Corporation | M2GL090T-1FGG676I | 1.26 V | + 100 C | Microchip Technology | 1.14 V | - 40 C | 3 | SMD/SMT | 425 | 86184 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.27 | Compliant | Yes | 1.2 V | 1.2 V | 1.2 V | 1.2000 V | -40 to 100 °C | IGLOO2 | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | 1.2 V | 323.3 kB | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86316 | 2648064 | 1 | 4 Transceiver | 86316 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL060T-VFG784I | Microchip | Datasheet | 2392 | - | Min: 1 Mult: 1 | Surface Mount | 748-FBGA | 748-FBGA (23x23) | + 100 C | Microchip Technology | - 40 C | 56500 LE | Tray | Active | -40°C ~ 100°C (TJ) | IGLOO2 | 1.14V ~ 1.26V | 56520 | 1869824 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL150T-1FC1152M | Microchip | Datasheet | 192 | - | Min: 1 Mult: 1 | Surface Mount | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2GL150 | MICROSEMI CORP | Microsemi Corporation | M2GL150T-1FC1152M | Microchip Technology | 574 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 35 X 35 MM, 1 MM PITCH, FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | No | 1.26 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | IGLOO2 | 3A001.A.2.C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | MILITARY | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 146124 | 5120000 | 146124 | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090-FG676 | Microchip | Datasheet | 1652 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2GL090 | MICROSEMI CORP | Microsemi Corporation | M2GL090-FG676 | + 85 C | Microchip Technology | 0 C | 3 | SMD/SMT | 425 | 86184 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | Non-Compliant | No | 1.2 V | 1.2 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 85 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | 1.2 V | OTHER | 323.3 kB | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86316 | 2648064 | STD | 86316 | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090-1FGG676I | Microchip | Datasheet | 1915 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 676-BGA | YES | 676 | 676-FBGA (27x27) | 676 | M2GL090 | MICROSEMI CORP | Microsemi Corporation | M2GL090-1FGG676I | + 100 C | Microchip Technology | - 40 C | 3 | SMD/SMT | 425 | 86184 LE | Tray | PLASTIC/EPOXY | BGA | 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 5.25 | Compliant | Yes | 8542390000 | 1.2 V | 1.2 V | 1.2 V | 1.2000 V | -40 to 100 °C | IGLOO2 | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | 30 | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | 1.2 V | 323.3 kB | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86316 | 2648064 | 1 | 86316 | 27 mm | 27 mm |
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M2GL050TS-1FGG896I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL050-FCSG325
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
115.098944
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M2GL010-1VF256I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL090TS-1FCS325
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL060T-FG484
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL025T-FG484
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL150-1FC1152
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
409.970408
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M2GL090-FG676I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL050-FG896
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL090-1FGG484
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL150TS-1FCG1152M
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL005S-TQ144I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL005-1TQ144
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL005-TQG144
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL005S-TQ144
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL090T-1FGG676I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL060T-VFG784I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL150T-1FC1152M
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL090-FG676
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M2GL090-1FGG676I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire