The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- Series:
M1A3PE3000L
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Operating Supply Current | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Total RAM Bits | Number of Gates | Speed Grade | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width |
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 | Mfr Part No M1A3PE3000L-FG484M | Microchip Technology | Datasheet | 736 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3PE3000 | 250 MHz | 60 | MICROSEMI CORP | M1A3PE3000L-FG484M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 341 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3PE3000L | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 25 mA | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 23 mm | 23 mm | |||||||||||
| Mfr Part No M1A3PE3000L-1FGG484M | Microchip Technology | Datasheet | 446 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | M1A3PE3000 | 250 MHz | 504 kbit | 60 | MICROSEMI CORP | M1A3PE3000L-1FGG484M | 350 MHz | + 125 C | Microchip Technology | - 55 C | 3 | SMD/SMT | 341 I/O | 3500 LAB | 35000 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3PE3000L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 25 mA | 700 Mb/s | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 23 mm | 23 mm | ||||||||
| Mfr Part No M1A3PE3000L-1FG896M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 896-FBGA (31x31) | 896 | M1A3PE3000 | 250 MHz | 27 | MICROSEMI CORP | M1A3PE3000L-1FG896M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 620 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3PE3000L | e0 | 3A001.A.2.C | TIN LEAD | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 25 mA | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 31 mm | 31 mm | |||||||||||
| Mfr Part No M1A3PE3000L-1PQG208 | Microchip Technology | Datasheet | 484 | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | M1A3PE3000 | 350 MHz | 24 | MICROSEMI CORP | M1A3PE3000L-1PQG208 | 892.86 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 147 I/O | 70 °C | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.6 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M1A3PE3000L | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 147 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 25 mA | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 1 | 75264 | 75264 | 3000000 | 3.4 mm | 28 mm | 28 mm | ||||||||||||
| Mfr Part No M1A3PE3000L-FGG896 | Microchip Technology | Datasheet | 619 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 896-FBGA (31x31) | 896 | M1A3PE3000 | 350 MHz | 27 | MICROSEMI CORP | M1A3PE3000L-FGG896 | 781.25 MHz | 1.26 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 620 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3PE3000L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 896 | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | STD | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm |
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M1A3PE3000L-FG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3PE3000L-1FGG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3PE3000L-1FG896M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3PE3000L-1PQG208
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3PE3000L-FGG896
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire