The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- Series:
M1AFS600
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Total RAM Bits | Number of Gates | Max Frequency | Speed Grade | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | Lead Free |
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 | Mfr Part No M1AFS600-2FGG484 | Microchip Technology | Datasheet | 2052 | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | M1AFS600 | 60 | MICROSEMI CORP | M1AFS600-2FGG484 | 1470.59 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 172 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | M1AFS600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | OTHER | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1.47059 GHz | 2 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||
| Mfr Part No M1AFS600-2FG256 | Microchip Technology | Datasheet | 2213 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | M1AFS600 | 90 | MICROSEMI CORP | M1AFS600-2FG256 | 1470.59 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 119 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | M1AFS600 | TIN LEAD/TIN LEAD SILVER | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | OTHER | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1.47059 GHz | 2 | 13824 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | No | |||||||||||
| Mfr Part No M1AFS600-1FG256K | Microchip Technology | Datasheet | 2330 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M1AFS600 | 90 | MICROSEMI CORP | M1AFS600-1FG256K | Microchip Technology | Yes | 3 | 119 | 100 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 20 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | -55°C ~ 100°C (TJ) | Tray | M1AFS600 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | OTHER | 600000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 600000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||
| Mfr Part No M1AFS600-1FGG484K | Microchip Technology | Datasheet | 1724 |
| Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M1AFS600 | 350 MHz | 60 | MICROSEMI CORP | M1AFS600-1FGG484K | Microchip Technology | Yes | 3 | 172 | Tray | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | Fusion | -55°C ~ 100°C (TJ) | Tray | M1AFS600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 172 | Not Qualified | 1.5,3.3 V | 172 | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 13824 | |||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AFS600-FGG484K | Microchip Technology | Datasheet | 634 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 484-BGA | 484-FPBGA (23x23) | M1AFS600 | 60 | Microchip Technology | Yes | 172 | Tray | Active | Details | This product may require additional documentation to export from the United States. | Fusion | -55°C ~ 100°C (TJ) | Tray | M1AFS600 | 100 °C | -55 °C | 1.425V ~ 1.575V | 13.5 kB | 110592 | 600000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AFS600-2FG256I | Microchip Technology | Datasheet | 2292 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | M1AFS600 | 90 | MICROSEMI CORP | M1AFS600-2FG256I | 1470.59 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 119 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | FBGA-256 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1AFS600 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 600000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 2 | 600000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||
| Mfr Part No M1AFS600-FG256 | Microchip Technology | Datasheet | 2375 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | M1AFS600 | 90 | MICROSEMI CORP | M1AFS600-FG256 | 1098.9 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 119 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | M1AFS600 | TIN LEAD/TIN LEAD SILVER | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 1.0989 GHz | S-PBGA-B256 | Not Qualified | 1.5 V | OTHER | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1.0989 GHz | STD | 13824 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||
| Mfr Part No M1AFS600-FGG484 | Microchip Technology | Datasheet | 1916 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1AFS600 | 60 | MICROSEMI CORP | M1AFS600-FGG484 | 1098.9 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 172 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | M1AFS600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | OTHER | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | STD | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||
| Mfr Part No M1AFS600-FGG256 | Microchip Technology | Datasheet | 1653 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | M1AFS600 | 90 | MICROSEMI CORP | M1AFS600-FGG256 | 1098.9 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 119 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | M1AFS600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 1.0989 GHz | S-PBGA-B256 | Not Qualified | 1.5 V | OTHER | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1.0989 GHz | STD | 13824 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | No | Lead Free | ||||||||
| Mfr Part No M1AFS600-1FGG484 | Microchip Technology | Datasheet | 1938 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1AFS600 | 60 | MICROSEMI CORP | M1AFS600-1FGG484 | 1282.05 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 172 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | M1AFS600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | OTHER | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm |
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M1AFS600-2FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M1AFS600-2FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
298.510267
-
M1AFS600-1FG256K
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
367.782461
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M1AFS600-1FGG484K
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
425.076093
-
M1AFS600-FGG484K
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AFS600-2FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
340.244631
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M1AFS600-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
262.508806
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M1AFS600-FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M1AFS600-FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M1AFS600-1FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
318.867626