The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- Series:
M1AGL1000V2
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Device Logic Gates | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Qualification Status | Operating Supply Voltage | Temperature Grade | Operating Supply Current | RAM Size | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Speed Grade | Number of CLBs | Number of Equivalent Gates | Length | Width | Lead Free |
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 | Mfr Part No M1AGL1000V2-FG256 | Microchip Technology | Datasheet | 1942 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FPBGA-256 | YES | 256 | 256-FPBGA (17x17) | 256 | M1AGL1000 | 108 MHz | 90 | MICROSEMI CORP | M1AGL1000V2-FG256 | Microchip Technology | Yes | 3 | SMD/SMT | 177 | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 0°C ~ 70°C (TA) | Tray | M1AGL1000V2 | TIN LEAD/TIN LEAD SILVER | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | OTHER | 18 kB | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1e+06 | 24576 | 1000000 | 17 mm | 17 mm | |||||||||||||||||
| Mfr Part No M1AGL1000V2-FG484 | Microchip Technology | Datasheet | 1659 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FPBGA-484 | YES | 484 | 484-FPBGA (23x23) | 484 | M1AGL1000 | 108 MHz | 60 | MICROSEMI CORP | M1AGL1000V2-FG484 | Microchip Technology | Yes | 3 | SMD/SMT | 300 | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 0°C ~ 70°C (TA) | Tray | M1AGL1000V2 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | OTHER | 18 kB | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1e+06 | 24576 | 1000000 | 23 mm | 23 mm | ||||||||||||||||
| Mfr Part No M1AGL1000V2-FG144 | Microchip Technology | Datasheet | 2096 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FPBGA-144 | YES | 144 | 144-FPBGA (13x13) | 144 | M1AGL1000 | 108 MHz | 160 | MICROSEMI CORP | M1AGL1000V2-FG144 | Microchip Technology | Yes | 3 | SMD/SMT | 97 | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | -40°C ~ 85°C (TA) | Tray | M1AGL1000V2 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | OTHER | 18 kB | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1e+06 | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||
| Mfr Part No M1AGL1000V2-FG484I | Microchip Technology | Datasheet | 1762 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FPBGA-484 | YES | 484 | 484-FPBGA (23x23) | 484 | M1AGL1000 | 108 MHz | 60 | MICROSEMI CORP | M1AGL1000V2-FG484I | Microchip Technology | Yes | 3 | SMD/SMT | 300 | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | -40°C ~ 85°C (TA) | Tray | M1AGL1000V2 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | INDUSTRIAL | 18 kB | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | 24576 | 1000000 | 23 mm | 23 mm | |||||||||||||||
| Mfr Part No M1AGL1000V2-CS281 | Microchip Technology | Datasheet | 2078 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | CSP-281 | YES | 281 | 281-CSP (10x10) | 281 | M1AGL1000 | 108 MHz | 184 | MICROSEMI CORP | M1AGL1000V2-CS281 | Microchip Technology | Yes | SMD/SMT | 215 | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 20 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 0°C ~ 70°C (TA) | Tray | M1AGL1000V2 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 235 | 0.5 mm | compliant | S-PBGA-B281 | Not Qualified | OTHER | 18 kB | 24576 CLBS, 1000000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1e+06 | 24576 | 1000000 | 10 mm | 10 mm | |||||||||||||||||
| Mfr Part No M1AGL1000V2-FGG256 | Microchip Technology | Datasheet | 2316 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FPBGA-256 | YES | 256 | 256-FPBGA (17x17) | 256 | M1AGL1000 | 108 MHz | 90 | MICROSEMI CORP | M1AGL1000V2-FGG256 | 1.5 V | Microchip Technology | 1.2 V | Yes | 3 | SMD/SMT | 177 | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | 0 to 70 °C | Tray | M1AGL1000V2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | OTHER | 18 kB | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1e+06 | STD | 24576 | 1000000 | 17 mm | 17 mm | Lead Free | |||||||||||
| Mfr Part No M1AGL1000V2-FGG256I | Microchip Technology | Datasheet | 1649 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FPBGA-256 | YES | 256 | 256-FPBGA (17x17) | 256 | M1AGL1000 | 108 MHz | 90 | MICROSEMI CORP | M1AGL1000V2-FGG256I | 250 MHz | 1.5 V | + 85 C | Microchip Technology | 1.2 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | -40 to 85 °C | Tray | M1AGL1000V2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | INDUSTRIAL | 127 uA | 18 kB | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | 250 MHz | STD | 24576 | 1000000 | 17 mm | 17 mm | Lead Free | |||||
| Mfr Part No M1AGL1000V2-FG256I | Microchip Technology | Datasheet | 2400 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FPBGA-256 | YES | 256 | 256-FPBGA (17x17) | 256 | M1AGL1000 | 108 MHz | 90 | MICROSEMI CORP | M1AGL1000V2-FG256I | Microchip Technology | Yes | 3 | SMD/SMT | 177 | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | -40°C ~ 85°C (TA) | Tray | M1AGL1000V2 | TIN LEAD/TIN LEAD SILVER | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | INDUSTRIAL | 18 kB | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1e+06 | 24576 | 1000000 | 17 mm | 17 mm | ||||||||||||||||
| Mfr Part No M1AGL1000V2-FGG144 | Microchip Technology | Datasheet | 1749 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FPBGA-144 | YES | 144 | 144-FPBGA (13x13) | 144 | M1AGL1000 | 108 MHz | 160 | MICROSEMI CORP | M1AGL1000V2-FGG144 | Microchip Technology | Yes | 3 | SMD/SMT | 97 | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 0°C ~ 70°C (TA) | Tray | M1AGL1000V2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | OTHER | 18 kB | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1e+06 | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||
| Mfr Part No M1AGL1000V2-CSG281 | Microchip Technology | Datasheet | 2157 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | CSP-281 | YES | 281 | 281-CSP (10x10) | 281 | M1AGL1000 | 108 MHz | 184 | MICROSEMI CORP | M1AGL1000V2-CSG281 | Microchip Technology | Yes | 3 | SMD/SMT | 215 | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 0°C ~ 70°C (TA) | Tray | M1AGL1000V2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 0.5 mm | compliant | S-PBGA-B281 | Not Qualified | OTHER | 18 kB | 24576 CLBS, 1000000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1e+06 | 24576 | 1000000 | 10 mm | 10 mm | ||||||||||||||||
| Mfr Part No M1AGL1000V2-FGG484I | Microchip Technology | Datasheet | 1716 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FPBGA-484 | YES | 484 | 484-FPBGA (23x23) | 484 | M1AGL1000 | 108 MHz | 60 | MICROSEMI CORP | M1AGL1000V2-FGG484I | 250 MHz | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 300 I/O | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.5 V | 1.2 V | 1.2 V | IGLOOe | 0.396232 oz | -40°C ~ 85°C (TA) | Tray | M1AGL1000V2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.2 V to 1.5 V | INDUSTRIAL | 127 µA | 18 kB | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | 250 MHz | STD | 24576 | 1000000 | 23 mm | 23 mm | |||||||
| Mfr Part No M1AGL1000V2-CS281I | Microchip Technology | Datasheet | 1768 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | CSP-281 | YES | 281 | 281-CSP (10x10) | 281 | M1AGL1000 | 108 MHz | 1000000 | 1000000 | 184 | MICROSEMI CORP | M1AGL1000V2-CS281I | Microchip Technology | Yes | SMD/SMT | 215 | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 20 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | -40°C ~ 85°C (TA) | Tray | M1AGL1000V2 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 235 | 0.5 mm | compliant | S-PBGA-B281 | Not Qualified | INDUSTRIAL | 18 kB | 24576 CLBS, 1000000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | 24576 | 1000000 | 10 mm | 10 mm |
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M1AGL1000V2-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M1AGL1000V2-FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL1000V2-FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL1000V2-FG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL1000V2-CS281
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL1000V2-FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL1000V2-FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL1000V2-FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M1AGL1000V2-FGG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL1000V2-CSG281
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL1000V2-FGG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL1000V2-CS281I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire