The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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M1AGL600V2
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Device Logic Gates | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Screening Level | Speed Grade | Number of Registers | Number of CLBs | Number of Equivalent Gates | Height | Length | Width | Lead Free |
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 | Mfr Part No M1AGL600V2-FGG256I | Microchip Technology | Datasheet | 2030 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | M1AGL600 | 108 MHz | 90 | MICROSEMI CORP | M1AGL600V2-FGG256I | 1.575 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | 0.014110 oz | -40 to 85 °C | Tray | M1AGL600V2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.2 V to 1.5 V | INDUSTRIAL | 1.575 V | 1.14 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||
| Mfr Part No M1AGL600V2-FG256I | Microchip Technology | Datasheet | 1998 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | M1AGL600 | 108 MHz | 90 | MICROSEMI CORP | M1AGL600V2-FG256I | 1.575 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | 0.014110 oz | -40 to 85 °C | Tray | M1AGL600V2 | TIN LEAD/TIN LEAD SILVER | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.2 V to 1.5 V | INDUSTRIAL | 1.575 V | 1.14 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||
| Mfr Part No M1AGL600V2-CS281 | Microchip Technology | Datasheet | 31 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 281-TFBGA, CSBGA | YES | 281 | 281-CSP (10x10) | 281 | M1AGL600 | 108 MHz | 184 | MICROSEMI CORP | M1AGL600V2-CS281 | Microchip Technology | Yes | 215 | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | 10 X 10 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, CSP-281 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 20 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.5 V | 1.2 V | 1.2 V | IGLOOe | 0°C ~ 70°C (TA) | Tray | M1AGL600V2 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 235 | 0.5 mm | compliant | S-PBGA-B281 | Not Qualified | 1.2 V to 1.5 V | OTHER | 13.5 kB | 13824 CLBS, 600000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | 13824 | 600000 | 10 mm | 10 mm | ||||||||||||||||||||||||||
| Mfr Part No M1AGL600V2-FG144 | Microchip Technology | Datasheet | 1702 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | M1AGL600 | 108 MHz | 160 | MICROSEMI CORP | M1AGL600V2-FG144 | 1.575 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | 0.014110 oz | 0 to 70 °C | Tray | M1AGL600V2 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.2 V to 1.5 V | OTHER | 1.575 V | 1.14 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||
| Mfr Part No M1AGL600V2-FG256 | Microchip Technology | Datasheet | 1749 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | M1AGL600 | 108 MHz | 90 | MICROSEMI CORP | M1AGL600V2-FG256 | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | M1AGL600V2 | TIN LEAD/TIN LEAD SILVER | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.2 V to 1.5 V | OTHER | 1.575 V | 1.14 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||
| Mfr Part No M1AGL600V2-FGG256 | Microchip Technology | Datasheet | 1938 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | M1AGL600 | 108 MHz | 90 | MICROSEMI CORP | M1AGL600V2-FGG256 | 1.575 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | 0.014110 oz | 0 to 70 °C | Tray | M1AGL600V2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.2 V to 1.5 V | OTHER | 1.575 V | 1.14 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | Lead Free | ||||||||||||
| Mfr Part No M1AGL600V2-FGG144I | Microchip Technology | Datasheet | 2052 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | M1AGL600 | 108 MHz | 160 | MICROSEMI CORP | M1AGL600V2-FGG144I | 1.575 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | 0.014110 oz | -40 to 85 °C | Tray | M1AGL600V2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.2 V to 1.5 V | INDUSTRIAL | 1.575 V | 1.14 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | Lead Free | |||||||||||
| Mfr Part No M1AGL600V2-CSG281I | Microchip Technology | Datasheet | 1620 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 281-TFBGA, CSBGA | YES | 281 | 281-CSP (10x10) | 281 | M1AGL600 | 108 MHz | 184 | MICROSEMI CORP | M1AGL600V2-CSG281I | 1.5 V | Microchip Technology | 1.2 V | Yes | 3 | 215 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFBGA | 10 X 10 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, CSP-281 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.5 V | 1.2 V | 1.2 V | IGLOOe | 1.2, 1.5 V | -40 to 85 °C | Tray | M1AGL600V2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 0.5 mm | compliant | 30 | S-PBGA-B281 | Not Qualified | 1.2 V to 1.5 V | INDUSTRIAL | 13.5 kB | 13824 CLBS, 600000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 10 mm | 10 mm | ||||||||||||||||||||
| Mfr Part No M1AGL600V2-FGG144 | Microchip Technology | Datasheet | 1660 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | M1AGL600 | 108 MHz | 160 | MICROSEMI CORP | M1AGL600V2-FGG144 | 1.575 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | 0.014110 oz | 0 to 70 °C | Tray | M1AGL600V2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.2 V to 1.5 V | OTHER | 1.575 V | 1.14 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||
| Mfr Part No M1AGL600V2-FG144I | Microchip Technology | Datasheet | 1845 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | M1AGL600 | 108 MHz | 600000 | 600000 | 160 | MICROSEMI CORP | M1AGL600V2-FG144I | 97 | 1.575 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 97 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | FBGA | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | 0.014110 oz | Industrial grade | -40 to 85 °C | Tray | M1AGL600V2 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 144 | S-PBGA-B144 | Not Qualified | 1.2 V to 1.5 V | INDUSTRIAL | 1.575 V | 1.14 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | Industrial | STD | 13824 | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | |||
| Mfr Part No M1AGL600V2-CS281I | Microchip Technology | Datasheet | 1648 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 281-TFBGA, CSBGA | YES | 281 | 281-CSP (10x10) | 281 | M1AGL600 | 108 MHz | 184 | MICROSEMI CORP | M1AGL600V2-CS281I | Microchip Technology | Yes | 215 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 20 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.5 V | 1.2 V | 1.2 V | IGLOOe | -40°C ~ 85°C (TA) | Tray | M1AGL600V2 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 235 | 0.5 mm | compliant | S-PBGA-B281 | Not Qualified | 1.2 V to 1.5 V | INDUSTRIAL | 13.5 kB | 13824 CLBS, 600000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | 13824 | 600000 | 10 mm | 10 mm | |||||||||||||||||||||||||
| Mfr Part No M1AGL600V2-CSG281 | Microchip Technology | Datasheet | 2122 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 281-TFBGA, CSBGA | YES | 281 | 281-CSP (10x10) | 281 | M1AGL600 | 108 MHz | 184 | MICROSEMI CORP | M1AGL600V2-CSG281 | Microchip Technology | Yes | 3 | 215 | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | 10 X 10 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, CSP-281 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.5 V | 1.2 V | 1.2 V | IGLOOe | 0°C ~ 70°C (TA) | Tray | M1AGL600V2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 0.5 mm | compliant | S-PBGA-B281 | Not Qualified | 1.2 V to 1.5 V | OTHER | 13.5 kB | 13824 CLBS, 600000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | 13824 | 600000 | 10 mm | 10 mm |
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M1AGL600V2-FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M1AGL600V2-FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M1AGL600V2-CS281
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL600V2-FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL600V2-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL600V2-FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL600V2-FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
126.269281
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M1AGL600V2-CSG281I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL600V2-FGG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL600V2-FG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL600V2-CS281I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL600V2-CSG281
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire