The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- Series:
M2GL090
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | RAM Size | Data Rate | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Speed Grade | Number of Transceivers | Number of Logic Cells | Length | Width | Lead Free |
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 | Mfr Part No M2GL090-FCSG325I | Microchip Technology | Datasheet | 1679 |
| Min: 1 Mult: 1 | Surface Mount | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2GL090 | 176 | MICROSEMI CORP | M2GL090-FCSG325I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 180 I/O | 86184 LE | Tray | PLASTIC | , BGA325,21X21,20 | BGA325,21X21,20 | Active | Active | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | M2GL090 | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | compliant | 180 | Not Qualified | 1.2 V | 1.2 V | 180 | FIELD PROGRAMMABLE GATE ARRAY | 86184 | 2648064 | 86316 | |||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090-FG676I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-676 | 40 | + 100 C | - 40 C | Yes | SMD/SMT | 425 I/O | 86316 | N | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | IGLOO2 | Tray | M2GL090 | 1.2 V | 667 Mb/s | 4 Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090-FG484I | Microchip Technology | Datasheet | 2232 |
| Min: 1 Mult: 1 | Surface Mount | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL090 | 60 | MICROSEMI CORP | M2GL090-FG484I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 267 I/O | 86316 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.25 | N | No | FPGA IGLOOu00ae2 Family 86316 Cells 1.2V 484-Pin FBGA Tray | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0.415307 oz | -40°C ~ 100°C (TJ) | Tray | M2GL090 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 1.2 V | 667 Mb/s | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86184 | 2648064 | 4 Transceiver | 86316 | 23 mm | 23 mm | ||||||||||||||||
| Mfr Part No M2GL090-1FG484I | Microchip Technology | Datasheet | 2265 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | FPBGA-484 | YES | 484 | 484-FPBGA (23x23) | 484 | M2GL090 | 60 | MICROSEMI CORP | M2GL090-1FG484I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 267 I/O | 86184 LE | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.29 | N | No | 8542310000, 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000 | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | -40°C ~ 100°C | Tray | M2GL090 | e0 | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 1.2 V | 323.3 kB | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86316 | 2648064 | 1 | 86316 | 23 mm | 23 mm | Contains Lead | ||||||||||||
| Mfr Part No M2GL090-1FG676 | Microchip Technology | Datasheet | 1684 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | FPBGA-676 | YES | 676-FBGA (27x27) | 676 | M2GL090 | 40 | MICROSEMI CORP | M2GL090-1FG676 | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 425 I/O | 86184 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | 27 X 27 MM, 1 MM PITCH, FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | N | No | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL090 | 85 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | 1.2 V | OTHER | 323.3 kB | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86316 | 2648064 | 86316 | 27 mm | 27 mm | |||||||||||||||
| Mfr Part No M2GL090-FGG676I | Microchip Technology | Datasheet | 2226 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-676 | YES | 676-FBGA (27x27) | 676 | M2GL090 | 40 | MICROSEMI CORP | M2GL090-FGG676I | 1.26 V | + 100 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 425 I/O | 86184 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 5.27 | Details | Yes | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | 1.2000 V | -40 to 100 °C | Tray | M2GL090 | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | 30 | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | 1.2 V | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86184 | 2648064 | STD | 86316 | 27 mm | 27 mm | |||||||||||||||||
| Mfr Part No M2GL090-FG484 | Microchip Technology | Datasheet | 2037 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | FPBGA-484 | 484 | 484-FPBGA (23x23) | M2GL090 | 60 | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 267 I/O | 86184 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL090 | 85 °C | 0 °C | 1.14V ~ 2.625V | 1.2 V | 323.3 kB | 86316 | 2648064 | STD | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090-1FG676I | Microchip Technology | Datasheet | 1631 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | FPBGA-676 | YES | 676-FBGA (27x27) | 676 | M2GL090 | 40 | MICROSEMI CORP | M2GL090-1FG676I | 1.26 V | + 100 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 425 I/O | 86184 LE | Tray | PLASTIC/EPOXY | BGA | 27 X 27 MM, 1 MM PITCH, FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | N | No | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | 1.2000 V | -40 to 100 °C | Tray | M2GL090 | e0 | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | 1.2 V | 323.3 kB | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86316 | 2648064 | 1 | 86316 | 27 mm | 27 mm | Contains Lead | ||||||||||
| Mfr Part No M2GL090-1FCSG325 | Microchip Technology | Datasheet | 2327 |
| Min: 1 Mult: 1 | Surface Mount | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2GL090 | 176 | MICROSEMI CORP | M2GL090-1FCSG325 | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 180 I/O | 86184 LE | Tray | PLASTIC | , BGA325,21X21,20 | BGA325,21X21,20 | Active | Active | 5.82 | Details | Yes | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL090 | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | compliant | 180 | Not Qualified | 1.2 V | 1.2 V | 180 | FIELD PROGRAMMABLE GATE ARRAY | 86184 | 2648064 | 86316 | |||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090-FCS325I | Microchip Technology | Datasheet | 1978 | - | Min: 1 Mult: 1 | Surface Mount | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2GL090 | 176 | MICROSEMI CORP | M2GL090-FCS325I | + 100 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 180 I/O | 86184 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA325,21X21,20 | BGA325,21X21,20 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | N | No | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | M2GL090 | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 180 | Not Qualified | 1.2 V | 1.2 V | 180 | FIELD PROGRAMMABLE GATE ARRAY | 86184 | 2648064 | 86316 | ||||||||||||||||||||||||||
| Mfr Part No M2GL090-FCSG325 | Microchip Technology | Datasheet | 1911 |
| Min: 1 Mult: 1 | Surface Mount | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2GL090 | 176 | MICROSEMI CORP | M2GL090-FCSG325 | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 180 I/O | 86184 LE | Tray | PLASTIC | BGA325,21X21,20 | Active | Active | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL090 | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | compliant | 180 | Not Qualified | 1.2 V | 1.2 V | 180 | FIELD PROGRAMMABLE GATE ARRAY | 86184 | 2648064 | 86316 | ||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090-1FG484 | Microchip Technology | Datasheet | 2361 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL090 | 60 | MICROSEMI CORP | M2GL090-1FG484 | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 267 I/O | 86184 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL090 | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 1.2 V | OTHER | 323.3 kB | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86316 | 2648064 | 1 | 86316 | 23 mm | 23 mm | |||||||||||||||
| Mfr Part No M2GL090-FGG484I | Microchip Technology | Datasheet | 1901 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL090 | 60 | MICROSEMI CORP | M2GL090-FGG484I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 267 I/O | 86184 LE | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.27 | Details | Yes | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | 0.630643 oz | -40°C ~ 100°C (TJ) | Tray | M2GL090 | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 1.2 V | 667 Mb/s | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86184 | 2648064 | STD | 4 Transceiver | 86316 | 23 mm | 23 mm | ||||||||||||||||||
| Mfr Part No M2GL090-FGG484 | Microchip Technology | Datasheet | 1675 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL090 | 60 | MICROSEMI CORP | M2GL090-FGG484 | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 267 I/O | 86184 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL090 | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 1.2 V | OTHER | 323.3 kB | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86316 | 2648064 | STD | 86316 | 23 mm | 23 mm | |||||||||||||||
| Mfr Part No M2GL090-FGG676 | Microchip Technology | Datasheet | 2047 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | FPBGA-676 | YES | 676-FBGA (27x27) | 676 | M2GL090 | 40 | MICROSEMI CORP | M2GL090-FGG676 | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 425 I/O | 86184 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.27 | Details | Yes | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL090 | 85 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | 1.2 V | OTHER | 323.3 kB | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86316 | 2648064 | 86316 | 27 mm | 27 mm | |||||||||||||||
| Mfr Part No M2GL090-1FCS325I | Microchip Technology | Datasheet | 2324 | - | Min: 1 Mult: 1 | Surface Mount | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2GL090 | 176 | MICROSEMI CORP | M2GL090-1FCS325I | + 100 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 180 I/O | 86184 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA325,21X21,20 | BGA325,21X21,20 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | N | No | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | M2GL090 | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 180 | Not Qualified | 1.2 V | 1.2 V | 180 | FIELD PROGRAMMABLE GATE ARRAY | 86184 | 2648064 | 86316 |
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M2GL090-FCSG325I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
198.111767
-
M2GL090-FG676I
Atmel (Microchip Technology)
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M2GL090-FG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
312.478806
-
M2GL090-1FG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M2GL090-1FG676
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
346.534186
-
M2GL090-FGG676I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M2GL090-FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M2GL090-1FG676I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M2GL090-1FCSG325
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
170.294042
-
M2GL090-FCS325I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M2GL090-FCSG325
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
189.911787
-
M2GL090-1FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M2GL090-FGG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M2GL090-FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M2GL090-FGG676
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M2GL090-1FCS325I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire