The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Additional Feature
- Backset Spacing
- Base Product Number
- Clock Frequency-Max
- Color
- Combinatorial Delay of a CLB-Max
- Connector Style
- Connector Type
- Contact Finish
- Contact Finish Thickness
- Contact Materials
- Series
- Series:
MDVB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Housing Material | Number of Terminals | Shell Material, Finish | Base Product Number | Clock Frequency-Max | Contact Materials | Ihs Manufacturer | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Mfr | Moisture Sensitivity Levels | Number of I/Os | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Voltage, Rating | Operating Temperature | Packaging | Series | JESD-609 Code | Part Status | Termination | Connector Type | Number of Positions | Terminal Finish | Color | Number of Rows | Additional Feature | HTS Code | Contact Type | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Current Rating | Contact Finish | JESD-30 Code | Wire Gauge | Temperature Grade | Flange Feature | Connector Style | Contact Form | Shell Size, Connector Layout | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Number of Gates | Backset Spacing | Combinatorial Delay of a CLB-Max | Number of Equivalent Gates | Features | Length | Width | Contact Finish Thickness | Material Flammability Rating |
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 | Mfr Part No EX128-FTQ100 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Panel Mount | 100-LQFP | YES | 100-TQFP (14x14) | Polyester Thermoplastic, Glass Filled | 100 | -- | EX128 | 178 MHz | Copper Alloy | MICROSEMI CORP | -- | Microsemi Corporation | EX128-FTQ100 | Microchip Technology | 3 | 70 | 70 °C | Tray | PLASTIC/EPOXY | LFQFP | TQFP-100 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.59 | No | 2.7 V | 2.3 V | 2.5 V | -- | -65°C ~ 125°C | Bulk | MDVB | e0 | Active | Solder Cup | Receptacle, Female Sockets | 31 | Tin/Lead (Sn/Pb) | -- | 2 | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | Signal | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 225 | -- | 0.5 mm | unknown | 3A | Gold | S-PQFP-G100 | 24-32 AWG | COMMERCIAL | Housing/Shell (Unthreaded) | D-Type, Micro-D | -- | 0.050 Pitch x 0.043 Row to Row | 6000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 256 | 6000 | -- | 1.4 ns | 6000 | -- | 14 mm | 14 mm | -- | -- |