The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Applications
- Base Product Number
- Capacitance
- Clock Frequency-Max
- Dielectric Material
- Features
- HTS Code
- Height Seated (Max)
- Ihs Manufacturer
- JESD-30 Code
- Lead Free Status / RoHS Status
- Series
- Series:
MKP338 6
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Dielectric Material | Number of Terminals | Base Product Number | Clock Frequency-Max | Ihs Manufacturer | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Mfr | Moisture Sensitivity Levels | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Usage Level | Voltage Rating AC | Voltage Rating DC | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Termination | Terminal Finish | Applications | HTS Code | Capacitance | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Number of Outputs | Qualification Status | Lead Spacing | Power Supplies | Temperature Grade | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Total RAM Bits | Number of Gates | Screening Level | Speed Grade | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Features | Height Seated (Max) | Length | Width | Ratings |
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![]() | Mfr Part No A3P060-FGG144T | Microchip | Datasheet | 24000 | - | Min: 1 Mult: 1 | Through Hole | Radial | YES | 144-FPBGA (13x13) | Polypropylene (PP), Metallized | 144 | A3P060 | 350 MHz | MICROSEMI CORP | -- | Microsemi Corporation | A3P060-FGG144T | Microchip Technology | 3 | 96 | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 1 MM PITCH, GREEN, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.22 | Yes | 1.575 V | 1.425 V | 1.5 V | Automotive grade | 300V | 1000V (1kV) | -55°C ~ 105°C | Bulk | MKP338 6 | 0.689 L x 0.335 W (17.50mm x 8.50mm) | ±20% | e1 | Active | -- | PC Pins | Tin/Silver/Copper (Sn/Ag/Cu) | Automotive; EMI, RFI Suppression | 8542.39.00.01 | 0.039µF | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 96 | Not Qualified | 0.591 (15.00mm) | 1.5/3.3 V | AUTOMOTIVE | 96 | 1536 CLBS, 60000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | AEC-Q100 | STD | 1536 | 1536 | 60000 | -- | 0.591 (15.00mm) | 13 mm | 13 mm | AEC-Q200, Y2 |

