The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Applications
- Base Product Number
- Capacitance
- Dielectric Material
- Features
- Height Seated (Max)
- Lead Free Status / RoHS Status
- Lead Spacing
- Mfr
- Moisture Sensitivity Level (MSL)
- Number of I/Os
- Series
- Series:
MMKP383
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Dielectric Material | Number of Terminals | Base Product Number | Clock Frequency-Max | Ihs Manufacturer | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Voltage Rating AC | Voltage Rating DC | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Termination | Terminal Finish | Applications | Additional Feature | HTS Code | Capacitance | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Lead Spacing | Temperature Grade | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Number of LABs/CLBs | Speed Grade | Number of Transceivers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Equivalent Gates | Features | Height Seated (Max) | Length | Width | Ratings |
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 | Mfr Part No M2GL025TS-1FCSG325 | Microchip | Datasheet | 2081 | - | Min: 1 Mult: 1 | Through Hole | Radial | 325-FCBGA (11x11) | Polypropylene (PP), Metallized | M2GL025 | -- | + 85 C | Microchip Technology | 0 C | SMD/SMT | 180 | 27696 LE | Tray | Active | 1.2 V | 1.2 V | 900V | 2500V (2.5kV) | -55°C ~ 105°C | Bulk | MMKP383 | 1.024 L x 0.276 W (26.00mm x 7.00mm) | ±5% | Active | -- | PC Pins | High Pulse, DV/DT | 6800pF | 1.14V ~ 2.625V | 1.2 V | 0.886 (22.50mm) | 27696 | 1130496 | 2 Transceiver | -- | 0.650 (16.50mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A40MX04-PL84A | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Radial | YES | 84-PLCC (29.31x29.31) | Polypropylene (PP), Metallized | 84 | A40MX04 | 116 MHz | MICROSEMI CORP | -- | Microsemi Corporation | A40MX04-PL84A | Microchip Technology | 3 | 69 | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Obsolete | LCC | Obsolete | 30 | 5.53 | No | 5.25 V | 4.75 V | 5 V | 350V | 1000V (1kV) | -55°C ~ 105°C | Bulk | MMKP383 | 0.689 L x 0.394 W (17.50mm x 10.00mm) | ±5% | e0 | Active | -- | PC Pins | Tin/Lead (Sn/Pb) | High Pulse, DV/DT | CAN ALSO BE OPERATED AT 3V SUPPLY | 8542.39.00.01 | 0.56µF | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | 84 | S-PQCC-J84 | Not Qualified | 0.591 (15.00mm) | AUTOMOTIVE | 547 CLBS, 6000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 6000 | 2.2 ns | 547 | 6000 | -- | 0.650 (16.50mm) | 29.3116 mm | 29.3116 mm | -- | |||||||||||
| Mfr Part No XC3S1400A-5FTG256C | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Radial | 256-FTBGA (17x17) | Polypropylene (PP), Metallized | XC3S1400 | -- | AMD | 161 | Tray | Active | 900V | 2500V (2.5kV) | -55°C ~ 105°C | Bulk | MMKP383 | 1.220 L x 0.512 W (31.00mm x 13.00mm) | ±5% | Active | -- | PC Pins | High Pulse, DV/DT | 0.027µF | 1.14V ~ 1.26V | 1.083 (27.50mm) | 25344 | 589824 | 1400000 | 2816 | 5 | -- | 0.906 (23.00mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVU9P-L2FLGA2104E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Radial | 2104-FCBGA (47.5x47.5) | Polypropylene (PP), Metallized | XCVU9 | -- | AMD | 832 | Tray | Active | 700V | 2000V (2kV) | -55°C ~ 105°C | Bulk | MMKP383 | 0.689 L x 0.236 W (17.50mm x 6.00mm) | ±5% | Active | -- | PC Pins | High Pulse, DV/DT | 3300pF | 0.698V ~ 0.742V | 0.591 (15.00mm) | 2586150 | 391168000 | 147780 | L2 | -- | 0.472 (12.00mm) | -- |
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M2GL025TS-1FCSG325
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A40MX04-PL84A
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC3S1400A-5FTG256C
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XCVU9P-L2FLGA2104E
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire