The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Architecture
- Base Product Number
- Capacitance
- Clock Frequency-Max
- Connectivity
- Core Processor
- ESR (Equivalent Series Resistance)
- Failure Rate
- Features
- Flash Size
- Height Seated (Max)
- Series
- Series:
Military, MIL-PRF-39003/3, CSR23
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Ihs Manufacturer | Lead Free Status / RoHS Status | Lifetime @ Temp. | Manufacturer | Manufacturer Part Number | Mfr | Moisture Sensitivity Levels | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Voltage Rated | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Type | Terminal Finish | HTS Code | Capacitance | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Number of Outputs | Qualification Status | ESR (Equivalent Series Resistance) | Failure Rate | Lead Spacing | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Manufacturer Size Code | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Speed Grade | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Flash Size | Features | Height Seated (Max) | Length | Width |
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 | Mfr Part No A2F200M3F-FG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Axial | YES | 256-FPBGA (17x17) | 256 | A2F200 | 80 MHz | MICROSEMI CORP | -- | -- | Microsemi Corporation | A2F200M3F-FG256I | Microchip Technology | 3 | MCU - 25, FPGA - 66 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 20 | 5.24 | No | 1.575 V | 1.425 V | 1.5 V | 35V | -55°C ~ 125°C | Bulk | Military, MIL-PRF-39003/3, CSR23 | 0.185 Dia x 0.474 L (4.70mm x 12.04mm) | ±20% | e0 | Active | -- | Hermetically Sealed | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 10µF | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 66 | Not Qualified | -- | P (0.1%) | -- | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | B | MCU, FPGA | 66 | 4608 CLBS, 200000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 200000 | 256KB | Military | -- | 17 mm | 17 mm |