The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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ProASIC3
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Manufacturer Package Identifier | Base Product Number | Brand | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | MSL | Number of I/Os | Number of Logic Elements | Number of Macrocells | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Voltage, Rating | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Temperature Coefficient | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Subcategory | Power Rating | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Resistor Type | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Operating Supply Voltage | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | Nominal Supply Current | RAM Size | Data Rate | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Max Frequency | Speed Grade | Number of Transceivers | Resistance Tolerance | Number of Macro Cells | Number of Registers | Number of CLBs | Max Junction Temperature (Tj) | Number of Equivalent Gates | Product Category | Product Length | Product Width | IP Rating | Height | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No A3P250-VQG100I | Microsemi Corporation | Datasheet | 560 | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Surface Mount | Surface Mount | 100-TQFP | 100 | VQFP100 | FLASH | 68 | -40°C~100°C TJ | Tray | 2013 | ProASIC3 | e3 | Active | 3 (168 Hours) | 100 | 3A001.A.7.B | MATTE TIN (SN) | 8542.39.00.01 | 1.425V~1.575V | QUAD | GULL WING | 260 | 1.5V | 0.5mm | 231MHz | 40 | A3P250 | 1.5V | 4.5kB | 30mA | 3mA | 4.5kB | FIELD PROGRAMMABLE GATE ARRAY | 3000 | 36864 | 250000 | 2048 | 6144 | 100°C | 1.2mm | 14mm | 14mm | No | RoHS Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No A3P250-FGG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A3P250 | Microchip Technology / Atmel | 350 MHz | 90 | MICROSEMI CORP | Microchip | A3P250-FGG256I | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | MSL 3 - 168 hours | 157 | 3000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 1.3 | Details | Yes | FPGA - Field Programmable Gate Array ProASIC3 | 1.575 V | 1.425 V | 1.5 V | 36864 bit | ProASIC3 | 1.5000 V | 0.032170 oz | -40 to 85 °C | Tray | ProASIC3 | e1 | 3A001.A.7.B | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Programmable Logic ICs | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 30 mA | - | 6144 CLBS, 250000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 36864 | 250000 | STD | - | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-2FG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A3P250 | Microchip Technology / Atmel | 350 MHz | 90 | MICROSEMI CORP | Microchip | A3P250-2FG256I | 310 MHz | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 157 | 3000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | ProASIC3 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | Programmable Logic ICs | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | - | 6144 CLBS, 250000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 36864 | 250000 | 2 | - | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-FGG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | A3P250 | Microchip Technology / Atmel | 350 MHz | 160 | MICROSEMI CORP | Microchip | A3P250-FGG144 | 350 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 97 | 3000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 1.32 | Details | Yes | FPGA - Field Programmable Gate Array A3P250-FGG144 LEAD FREE | 1.575 V | 1.425 V | 1.5 V | 36864 bit | ProASIC3 | 1.5000 V | 0.013369 oz | 0 to 70 °C | Tray | ProASIC3 | e1 | 100 ppm/K | 470 Ohm | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Programmable Logic ICs | 0.25 W | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | General Purpose | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 3 mA | - | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 36864 | 250000 | STD | - | 1 | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P125-TQ144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LQFP | 144-TQFP (20x20) | A3P125 | Microchip Technology | 100 | Tray | Obsolete | -65 to 200 °C | ProASIC3 | 1.425V ~ 1.575V | 36864 | 125000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-FG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A3P250 | Microchip Technology / Atmel | 350 MHz | 90 | MICROSEMI CORP | Microchip | A3P250-FG256I | 350 MHz | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 157 | 3000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 30 | 1.47 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | ProASIC3 | e0 | 3A001.A.7.B | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Programmable Logic ICs | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | - | 6144 CLBS, 250000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 36864 | 250000 | STD | - | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P400-FGG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A3P400 | Microchip Technology / Atmel | 350 MHz | 90 | MICROSEMI CORP | Microchip | A3P400-FGG256I | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 178 | 5000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.23 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 500 V | -40 to 85 °C | Tray | ProASIC3 | e1 | 3A001.A.7.B | 100 ppm/°C | 150 kOhm | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Programmable Logic ICs | 250 mW | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | Thick Film | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | - | 9216 CLBS, 400000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 55296 | 400000 | STD | - | 1 | 9216 | 400000 | FPGA - Field Programmable Gate Array | 3.2 mm | 1.6 mm | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600-PQ208 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | A3P600 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P600-PQ208 | Microchip Technology | 3 | 154 | 85 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Obsolete | Obsolete | 30 | 5.25 | Compliant | No | 1.575 V | 1.425 V | 1.5 V | 0°C ~ 85°C (TJ) | ProASIC3 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | 231 MHz | S-PQFP-G208 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 231 MHz | 13824 | 13824 | 600000 | 3.4 mm | 28 mm | 28 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600-PQG208I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | A3P600 | Microchip Technology / Atmel | 350 MHz | 24 | MICROSEMI CORP | Microchip | A3P600-PQG208I | 350 MHz | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 154 | 7000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.23 | Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | 110592 bit | ProASIC3 | 1 oz | -40°C ~ 100°C (TJ) | Tray | ProASIC3 | e3 | Matte Tin (Sn) | 85 °C | -40 °C | 8542.39.00.01 | Programmable Logic ICs | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | 231 MHz | S-PQFP-G208 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 45 mA | 13.5 kB | - | 13824 CLBS, 600000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 6500 | FPGA - Field Programmable Gate Array | 110592 | 600000 | 231 MHz | STD | - | 13824 | 13824 | 600000 | FPGA - Field Programmable Gate Array | 3.4 mm | 28 mm | 28 mm | No | Lead Free | ||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-VQG100I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 100-TQFP | YES | 100 | 100-VQFP (14x14) | 100 | VQFP100 | A3P250 | Microchip Technology / Atmel | 350 MHz | 90 | MICROSEMI CORP | Microchip | A3P250-VQG100I | 350 MHz | 1.575 V | + 100 C | FLASH | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | MSL 3 - 168 hours | 68 | 3000 LE | 2048 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 40 | 1.29 | Details | Yes | FPGA - Field Programmable Gate Array ProASIC3 | 1.575 V | 1.425 V | 1.5 V | 36864 bit | ProASIC3 | 1.5000 V | 0.017637 oz | -40 to 85 °C | Tray | ProASIC3 | e3 | 3A001.A.7.B | Matte Tin (Sn) | 85 °C | -40 °C | 8542.39.00.01 | Programmable Logic ICs | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 260 | 0.5 mm | compliant | 231 MHz | S-PQFP-G100 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 4.5 kB | 30 mA | 3 mA | 4.5 kB | - | 6144 CLBS, 250000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 3000 | FPGA - Field Programmable Gate Array | 36864 | 250000 | 231 MHz | STD | - | 6144 | 6144 | 100 °C | 250000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | No | Lead Free | |||||||||||||||||||||||
| Mfr Part No A3P125-1TQ144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LQFP | YES | 144-TQFP (20x20) | 144 | A3P125 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P125-1TQ144 | Microchip Technology | 3 | 100 | 85 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.25 | No | 1.575 V | 1.425 V | 1.5 V | 0°C ~ 85°C (TJ) | ProASIC3 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G144 | Not Qualified | COMMERCIAL | 3072 CLBS, 125000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 125000 | 3072 | 125000 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-2PQ208 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 208-BFQFP | 208-PQFP (28x28) | A3P250 | Microchip Technology | 151 | Tray | Obsolete | 0°C ~ 85°C (TJ) | ProASIC3 | 1.425V ~ 1.575V | 36864 | 250000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P030-QNG48I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | YES | 48-QFN (6x6) | 48 | A3P030 | MICROSEMI CORP | Microsemi Corporation | A3P030-QNG48I | Microchip Technology | 3 | 34 | 100 °C | -40 °C | Tray | UNSPECIFIED | HQCCN | HQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Active | Active | 30 | 5.24 | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | ProASIC3 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N48 | Not Qualified | INDUSTRIAL | 768 CLBS, 30000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 30000 | STD | 768 | 30000 | 6 mm | 6 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P060-TQG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LQFP | YES | 144-TQFP (20x20) | 144 | A3P060 | 350 MHz | MICROSEMI CORP | Stearns | 105623400008 | Microchip Technology | 3 | End Mount | 91 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.24 | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | ProASIC3 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G144 | Not Qualified | INDUSTRIAL | 1536 CLBS, 60000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | STD | 1536 | 60000 | IP57 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-FGG484 | Microchip | Datasheet | 260 | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | A3P1000 | Microchip Technology / Atmel | 350 MHz | 60 | MICROSEMI CORP | General Cable | 02465 | 350 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 300 | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 1.33 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | 147456 bit | ProASIC3 | 1.5000 V | 0.421458 oz | 0 to 70 °C | Tray | ProASIC3 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Programmable Logic ICs | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | COMMERCIAL | 8 mA | - | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 147456 | 1000000 | STD | - | 24576 | 1000000 | FPGA - Field Programmable Gate Array | 2.23 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P600-2PQ208I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | M1A3P600 | MICROSEMI CORP | Microsemi Corporation | M1A3P600-2PQ208I | Microchip Technology | 3 | 154 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Obsolete | Obsolete | 30 | 5.25 | No | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | ProASIC3 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G208 | Not Qualified | INDUSTRIAL | 13824 CLBS, 600000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 13824 | 600000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P400-1PQ208I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | A3P400 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P400-1PQ208I | Microchip Technology | 3 | 151 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Obsolete | Obsolete | 30 | 5.25 | Compliant | No | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | ProASIC3 | e0 | 3A001.A.7.B | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | 272 MHz | S-PQFP-G208 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 6.8 kB | 9216 CLBS, 400000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 272 MHz | 1 | 9216 | 9216 | 400000 | 3.4 mm | 28 mm | 28 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600-2FGG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | A3P600 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P600-2FGG144I | 1.575 V | Microchip Technology | 1.425 V | 3 | 97 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 1.33 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 85 °C | ProASIC3 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 2 | 13824 | 600000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600-1FG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | A3P600 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P600-1FG144I | 1.575 V | Microchip Technology | 1.425 V | 3 | 97 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.25 | No | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 85 °C | ProASIC3 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1 | 13824 | 600000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600-FGG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | A3P600 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P600-FGG144I | Microchip Technology | 3 | 97 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | ProASIC3 | e1 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 231 MHz | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 231 MHz | STD | 13824 | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | No | Lead Free |
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