The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- Number of Gates
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ProASIC3L
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Housing Material | Weight | Insert Material | Number of Terminals | Base Product Number | Clock Frequency-Max | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitivity Levels | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shaft Diameter (mm) | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Bearing Type | Total RAM Bits | Number of Gates | Max Frequency | Speed Grade | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Connection Type | Height | Length | Width | Radiation Hardening |
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 | Mfr Part No A3PE3000L-1PQ208 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | A3PE3000L | 250 MHz | MICROSEMI CORP | A3PE3000L-1PQ208 | Microchip Technology | 3 | 147 | 70 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | Obsolete | 30 | 5.61 | Compliant | No | 1.575 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | ProASIC3L | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G208 | 147 | Not Qualified | 1.2 V | 1.2/1.5,1.2/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | 63 kB | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3e+06 | 892.86 MHz | 1 | 75264 | 75264 | 75264 | 3000000 | 3.4 mm | 28 mm | 28 mm | No | ||||||||||||||||||
| Mfr Part No A3P1000L-FGG256 | Microchip | Datasheet | 1676 | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A3P1000 | 350 MHz | MICROSEMI CORP | Murrelektronik | 7000-89561-2410030 | 1.26 V | Microchip Technology | 1.14 V | 3 | 177 | 70 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 1.38 | Yes | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 70 °C | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.5/3.3 V | COMMERCIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 24576 | 1000000 | 17 mm | 17 mm | ||||||||||||||||||||||||||
| Mfr Part No A3PE3000L-FG324I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 324-BGA | YES | 324 | 324-FBGA (19x19) | 400.011771 mg | 324 | A3PE3000 | 250 MHz | MICROSEMI CORP | Entrelec | 023708617 | 1.26 V | Microchip Technology | 1.14 V | 3 | 221 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, FBGA-324 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Compliant | No | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 85 °C | ProASIC3L | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 85 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B324 | 221 | Not Qualified | 1.2 V | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 63 kB | 221 | 75264 CLBS, 3000000 GATES | 1.78 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 781.25 MHz | STD | 75264 | 75264 | 75264 | 3000000 | 1.25 mm | 19 mm | 19 mm | No | ||||||||||
| Mfr Part No A3PE3000L-1FGG896I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 250 MHz | MICROSEMI CORP | Schneider | 139477 | 1.26 V | Microchip Technology | 1.14 V | 3 | 620 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Compliant | Yes | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 85 °C | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 896 | S-PBGA-B896 | 620 | Not Qualified | 1.2 V | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 25 mA | 63 kB | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 892.86 MHz | 1 | 75264 | 75264 | 75264 | 3000000 | Sweat | 1.73 mm | 31 mm | 31 mm | No | |||||||
| Mfr Part No A3PE3000L-1PQG208I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | A3PE3000 | MICROSEMI CORP | Microsemi Corporation | A3PE3000L-1PQG208I | Microchip Technology | 3 | 147 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.59 | Compliant | Yes | 1.575 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | ProASIC3L | e3 | 3A001.A.7.A | Matte Tin (Sn) | 85 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 147 | Not Qualified | 1.2 V | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 25 mA | 63 kB | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3e+06 | 892.86 MHz | 1 | 75264 | 75264 | 75264 | 3000000 | 3.4 mm | 28 mm | 28 mm | No | |||||||||||||
| Mfr Part No M1A3PE3000L-1PQ208 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | M1A3PE3000L | 350 MHz | MICROSEMI CORP | IDEC | ASLD29922N-111-A-12V | Microchip Technology | 3 | 147 | 70 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | Obsolete | 30 | 5.61 | No | 1.575 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | ProASIC3L | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G208 | 147 | Not Qualified | 1.5/3.3 V | COMMERCIAL | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||
| Mfr Part No A3PE3000L-FGG324I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 324-BGA | YES | 324 | 324-FBGA (19x19) | 400.011771 mg | 324 | A3PE3000 | 250 MHz | MICROSEMI CORP | Microsemi Corporation | A3PE3000L-FGG324I | 1.26 V | Microchip Technology | 1.14 V | 3 | 221 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-324 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.29 | Compliant | Yes | 1.575 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B324 | 221 | Not Qualified | 1.2 V | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 63 kB | 221 | 75264 CLBS, 3000000 GATES | 1.78 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 781.25 MHz | STD | 75264 | 75264 | 75264 | 3000000 | 1.25 mm | 19 mm | 19 mm | No | |||||||||||
| Mfr Part No A3PE3000L-FGG896I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 250 MHz | MICROSEMI CORP | Microsemi Corporation | A3PE3000L-FGG896I | 1.26 V | Microchip Technology | 1.14 V | 3 | 620 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.29 | Compliant | Yes | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 85 °C | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 896 | S-PBGA-B896 | 620 | Not Qualified | 1.2 V | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 63 kB | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3e+06 | 781.25 MHz | STD | 75264 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | No | |||||||||
| Mfr Part No A3PE3000L-PQG208I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | A3PE3000 | MICROSEMI CORP | Bussmann | A3PE3000L-PQG208I | Microchip Technology | 3 | 147 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.59 | Compliant | Yes | 1.575 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | ProASIC3L | e3 | Matte Tin (Sn) | 85 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 147 | Not Qualified | 1.2 V | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 63 kB | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3e+06 | 781.25 MHz | STD | 75264 | 75264 | 75264 | 3000000 | 3.4 mm | 28 mm | 28 mm | No | |||||||||||||||
| Mfr Part No M1A3PE3000L-1PQ208I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | M1A3PE3000L | 350 MHz | MICROSEMI CORP | Microsemi Corporation | M1A3PE3000L-1PQ208I | Microchip Technology | 3 | 147 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | Obsolete | 30 | 5.61 | Non-Compliant | No | 1.575 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Bulk | ProASIC3L | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G208 | 147 | Not Qualified | 28 V | 1.5/3.3 V | INDUSTRIAL | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 3 GHz | 75264 | 75264 | 3000000 | 28 mm | 28 mm | No | ||||||||||||||||||||||||
| Mfr Part No A3PE3000L-PQ208I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | A3PE3000L | MICROSEMI CORP | Microsemi Corporation | A3PE3000L-PQ208I | Microchip Technology | 3 | 147 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | Obsolete | 30 | 5.61 | Compliant | No | 1.575 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | ProASIC3L | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G208 | 147 | Not Qualified | 1.2 V | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 63 kB | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3e+06 | 781.25 MHz | 75264 | 75264 | 75264 | 3000000 | 3.4 mm | 28 mm | 28 mm | No | |||||||||||||||
| Mfr Part No M1A3PE3000L-FGG896M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 896-BGA | YES | 896-FBGA (31x31) | 896 | M1A3PE3000 | 250 MHz | MICROSEMI CORP | Microsemi Corporation | M1A3PE3000L-FGG896M | Microchip Technology | 3 | 620 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Yes | 1.575 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | ProASIC3L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | 620 | Not Qualified | 1.2/1.5,1.2/3.3 V | MILITARY | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 31 mm | 31 mm | ||||||||||||||||||||||||||||
| Mfr Part No A3PE3000L-1PQ208I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | A3PE3000L | 250 MHz | MICROSEMI CORP | Microsemi Corporation | A3PE3000L-1PQ208I | Microchip Technology | 3 | 147 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | Obsolete | 30 | 5.6 | Compliant | No | 1.575 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | ProASIC3L | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G208 | 147 | Not Qualified | 1.2 V | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 63 kB | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 892.86 MHz | 1 | 75264 | 75264 | 75264 | 3000000 | 3.4 mm | 28 mm | 28 mm | No | ||||||||||||||
| Mfr Part No M1A3PE3000L-PQ208I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 208-BFQFP | YES | 208-PQFP (28x28) | Cast Iron | Cast Steel;Black Oxide | 208 | M1A3PE3000L | 350 MHz | MICROSEMI CORP | Sealmaster | SFT-210TM | Microchip Technology | 3 | 147 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | Obsolete | 30 | 5.61 | No | 0.05 | 1.575 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | ProASIC3L | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G208 | 147 | Not Qualified | 1.5/3.3 V | INDUSTRIAL | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | Two Bolt Flange | 516096 | 3000000 | 75264 | 75264 | 3000000 | 28 mm | 28 mm | |||||||||||||||||||||||||
| Mfr Part No A3PE3000L-PQ208 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | A3PE3000L | 250 MHz | MICROSEMI CORP | Microsemi Corporation | A3PE3000L-PQ208 | Microchip Technology | 3 | 147 | 70 °C | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | Obsolete | 30 | 5.61 | Non-Compliant | No | 1.575 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | ProASIC3L | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G208 | 147 | Not Qualified | 1.2 V | 1.2/1.5,1.2/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | 63 kB | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3e+06 | 781.25 MHz | 75264 | 75264 | 75264 | 3000000 | 3.4 mm | 28 mm | 28 mm | No | ||||||||||||||||
| Mfr Part No A3PE3000L-1FG896M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 250 MHz | MICROSEMI CORP | Microsemi Corporation | A3PE3000L-1FG896M | Microchip Technology | 3 | 620 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Compliant | No | 1.575 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | ProASIC3L | e0 | 3A001.A.2.C | TIN LEAD | 125 °C | -55 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 1.575 V | 1.14 V | 63 kB | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3e+06 | 1 | 75264 | 75264 | 75264 | 3000000 | 31 mm | 31 mm | No | ||||||||||||||
| Mfr Part No A3PE3000L-1FG324I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 324-BGA | YES | 324 | 324-FBGA (19x19) | 400.011771 mg | 324 | A3PE3000 | 250 MHz | MICROSEMI CORP | Microsemi Corporation | A3PE3000L-1FG324I | 1.26 V | Microchip Technology | 1.14 V | 3 | 221 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA324,18X18,40 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Compliant | No | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 85 °C | ProASIC3L | e0 | 3A001.A.7.A | TIN LEAD SILVER | 85 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B324 | 221 | Not Qualified | 1.2 V | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 63 kB | 221 | 75264 CLBS, 3000000 GATES | 1.78 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3e+06 | 892.86 MHz | 1 | 75264 | 75264 | 75264 | 3000000 | 1.25 mm | 19 mm | 19 mm | No | |||||||||
| Mfr Part No A3P1000L-FG256I | Microchip | Datasheet | 2082 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A3P1000 | 350 MHz | MICROSEMI CORP | Greenlee | A3P1000L-FG256I | Microchip Technology | 3 | 177 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 1.57 | No | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 85 °C | ProASIC3L | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.5/3.3 V | INDUSTRIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 24576 | 1000000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||
| Mfr Part No A3P600L-1FGG144I | Microchip | Datasheet | 1629 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | A3P600 | 350 MHz | MICROSEMI CORP | Arrow Hart - Cooper Wiring Devices | 738B-BOX | 1.26 V | Microchip Technology | 1.14 V | 3 | 97 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Compliant | Yes | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 85 °C | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 5 mA | 13.5 kB | 97 | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 892.86 MHz | 1 | 13824 | 13824 | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | No | |||||||||
| Mfr Part No M1A3P1000L-1FGG256I | Microchip | Datasheet | 2274 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M1A3P1000 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | M1A3P1000L-1FGG256I | 1.26 V | Microchip Technology | 1.14 V | 3 | 177 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.26 | Yes | 1.575 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.5/3.3 V | INDUSTRIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 24576 | 1000000 | 17 mm | 17 mm |
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