The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Mounting Type
- Number of Gates
- Number of I/Os
- Operating Temperature
- Package / Case
- Series
- Total RAM Bits
- Voltage - Supply
- Length
- Width
- Operating Supply Voltage
- Mount
- Series:
ProASIC3L
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Approvals | Base Product Number | Clock Frequency-Max | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitivity Levels | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Current Rating | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Voltage | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Number of Poles | Protections | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Total RAM Bits | Number of Gates | Max Frequency | Speed Grade | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Connection Type | Height | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No A3P1000L-FG256I | Microchip | Datasheet | 2082 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A3P1000 | 350 MHz | MICROSEMI CORP | Greenlee | A3P1000L-FG256I | Microchip Technology | 3 | 177 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 1.57 | No | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 85 °C | ProASIC3L | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.5/3.3 V | INDUSTRIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 24576 | 1000000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P600L-FGG484 | Microchip | Datasheet | 1940 | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M1A3P600 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | M1A3P600L-FGG484 | 1.26 V | Microchip Technology | 1.14 V | 3 | 235 | 70 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.23 | Yes | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 70 °C | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 235 | Not Qualified | 1.5/3.3 V | COMMERCIAL | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | STD | 13824 | 13824 | 600000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE3000L-1FGG324I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 324-BGA | YES | 324 | 324-FBGA (19x19) | 400.011771 mg | 324 | A3PE3000 | MICROSEMI CORP | Microsemi Corporation | A3PE3000L-1FGG324I | 1.26 V | Microchip Technology | 1.14 V | 3 | 221 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-324 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Compliant | Yes | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 85 °C | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B324 | 221 | Not Qualified | 1.2 V | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 25 mA | 63 kB | 221 | 75264 CLBS, 3000000 GATES | 1.78 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3e+06 | 892.86 MHz | 1 | 75264 | 75264 | 75264 | 3000000 | 1.25 mm | 19 mm | 19 mm | No | |||||||||||||||||||||||
| Mfr Part No A3P600L-FG484I | Microchip | Datasheet | 2102 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3P600 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P600L-FG484I | Microchip Technology | 3 | 235 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 1.54 | Compliant | No | 8542310000/8542310000/8542310000/8542310000/8542310000 | 1.575 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | ProASIC3L | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 235 | Not Qualified | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 5 mA | 13.5 kB | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 781.25 MHz | STD | 13824 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||||
| Mfr Part No A3PE3000L-FGG896M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | UL;CSA | A3PE3000 | 250 MHz | MICROSEMI CORP | Hubbell | VP10487 | Microchip Technology | 3 | 620 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Compliant | Yes | 1.575 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | ProASIC3L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 100 Amps | 50 to 400 Hertz | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 600 | 1.575 V | 1.14 V | 63 kB | 4 | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3e+06 | 75264 | 75264 | 75264 | 3000000 | Plug | 31 mm | 31 mm | No | ||||||||||||||||||||||
| Mfr Part No A3P600L-FGG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | A3P600 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P600L-FGG144I | Microchip Technology | 3 | 97 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 0.78 | Compliant | Yes | 8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000 | 1.575 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 5 mA | 13.5 kB | 97 | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 781.25 MHz | STD | 13824 | 13824 | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | No | ||||||||||||||||||||||||
| Mfr Part No A3PE3000L-1FG896 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 250 MHz | MICROSEMI CORP | Microsemi Corporation | A3PE3000L-1FG896 | Microchip Technology | 3 | 620 | 70 °C | Tray | PLASTIC/EPOXY | BGA | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Compliant | No | 1.575 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | ProASIC3L | e0 | TIN LEAD | 70 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B896 | 620 | Not Qualified | 1.2 V | 1.2/1.5,1.2/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | 63 kB | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3e+06 | 892.86 MHz | 1 | 75264 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||||||||||||
| Mfr Part No A3P1000L-1FG256I | Microchip | Datasheet | 1720 | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A3P1000 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P1000L-1FG256I | 1.26 V | Microchip Technology | 1.14 V | 3 | 177 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 1.55 | No | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 85 °C | ProASIC3L | e0 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.5/3.3 V | INDUSTRIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 24576 | 1000000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000L-FGG256I | Microchip | Datasheet | 1805 | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A3P1000 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P1000L-FGG256I | Microchip Technology | 3 | 177 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 1.38 | Yes | 1.575 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.5/3.3 V | INDUSTRIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 24576 | 1000000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE3000L-FG896 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 250 MHz | MICROSEMI CORP | Microsemi Corporation | A3PE3000L-FG896 | 1.26 V | Microchip Technology | 1.14 V | 3 | 620 | 70 °C | Tray | PLASTIC/EPOXY | BGA | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Compliant | No | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 70 °C | ProASIC3L | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 896 | S-PBGA-B896 | 620 | Not Qualified | 1.2 V | 1.2/1.5,1.2/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | 63 kB | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 781.25 MHz | STD | 75264 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||||||||
| Mfr Part No A3P1000L-1FGG256I | Microchip | Datasheet | 1846 | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A3P1000 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P1000L-1FGG256I | 1.26 V | Microchip Technology | 1.14 V | 3 | 177 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.26 | Yes | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 85 °C | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.5/3.3 V | INDUSTRIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 24576 | 1000000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600L-1FG484I | Microchip | Datasheet | 1634 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3P600 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P600L-1FG484I | 1.26 V | Microchip Technology | 1.14 V | 3 | 235 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | Compliant | No | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 85 °C | ProASIC3L | e0 | TIN LEAD | 85 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 235 | Not Qualified | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 5 mA | 13.5 kB | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 892.86 MHz | 1 | 13824 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||
| Mfr Part No A3P1000L-FGG144 | Microchip | Datasheet | 2067 | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | MICROSEMI CORP | Stego | 02524.0-07 | 1.26 V | Microchip Technology | 1.14 V | 3 | 97 | 70 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 1.38 | Yes | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 70 °C | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.5/3.3 V | COMMERCIAL | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 24576 | 1000000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000L-FG144I | Microchip | Datasheet | 1968 | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | CE, CSA, IEC, UL | A3P1000 | 350 MHz | MICROSEMI CORP | Cutler Hammer, Div of Eaton Co | LGC363039B20ZGG | 1.26 V | Microchip Technology | 1.14 V | 3 | 97 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.26 | No | No | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 85 °C | ProASIC3L | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 630 A | S-PBGA-B144 | 97 | Not Qualified | 1.5/3.3 V | INDUSTRIAL | Ground Fault | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 24576 | 1000000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||
| Mfr Part No A3P600L-1FGG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3P600 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P600L-1FGG484 | Microchip Technology | 3 | 235 | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 1.4 | Compliant | Yes | 8542310000/8542310000/8542310000/8542310000/8542310000 | 1.575 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 235 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | 5 mA | 13.5 kB | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 892.86 MHz | 1 | 13824 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||
 | Mfr Part No A3P600L-FG484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | Surface Mount | 484-BGA | 484 | 400.011771mg | 235 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 225 | 1.2V | 1mm | 30 | A3P600L | 235 | 1.2V | 1.5/3.3V | 5mA | 13.5kB | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 781.25MHz | 13824 | 1.73mm | 23mm | 23mm | No | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No A3P250L-FG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | OBSOLETE (Last Updated: 1 month ago) | Surface Mount | Surface Mount | 256-LBGA | 256 | 400.011771mg | 157 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | Obsolete | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 225 | 1.2V | 1mm | 30 | A3P250L | 157 | 1.2V | 1.5/3.3V | 3mA | 4.5kB | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 781.25MHz | 6144 | 1.2mm | 17mm | 17mm | No | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No A3P250L-FGG144I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | OBSOLETE (Last Updated: 1 month ago) | Surface Mount | Surface Mount | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e1 | Obsolete | 3 (168 Hours) | 144 | TIN SILVER COPPER | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | A3P250L | 97 | 1.2V | 1.5/3.3V | 3mA | 4.5kB | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 781.25MHz | 6144 | 1.05mm | 13mm | 13mm | No | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE3000L-FG484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Surface Mount | Surface Mount | 484-BGA | 484 | 400.011771mg | 341 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 225 | 1.2V | 1mm | 30 | A3PE3000L | 341 | 1.2V | 1.2/1.51.2/3.3V | 63kB | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 781.25MHz | 75264 | 1.73mm | 23mm | 23mm | No | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No A3P1000L-FGG256I | Microsemi Corporation | Datasheet | 7 | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Surface Mount | Surface Mount | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e1 | Active | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | A3P1000L | 177 | 1.2V | 1.5/3.3V | 18kB | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 781.25MHz | 24576 | 1.2mm | 17mm | 17mm | No | RoHS Compliant | Lead Free |
-
A3P1000L-FG256I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
285.317461
-
M1A3P600L-FGG484
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3PE3000L-1FGG324I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P600L-FG484I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
236.103271
-
A3PE3000L-FGG896M
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P600L-FGG144I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3PE3000L-1FG896
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P1000L-1FG256I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P1000L-FGG256I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3PE3000L-FG896
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P1000L-1FGG256I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P600L-1FG484I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P1000L-FGG144
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P1000L-FG144I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P600L-1FGG484
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P600L-FG484I
Microsemi Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P250L-FG256I
Microsemi Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P250L-FGG144I
Microsemi Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3PE3000L-FG484I
Microsemi Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P1000L-FGG256I
Microsemi Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire