The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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SiT8209
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Mfr | Moisture Sensitivity Levels | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Packaging | Series | Size / Dimension | JESD-609 Code | Part Status | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Frequency Stability | Output | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Current - Supply (Disable) (Max) | Max Supply Voltage | Min Supply Voltage | RAM Size | Propagation Delay | Spread Spectrum Bandwidth | Turn On Delay Time | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Absolute Pull Range (APR) | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Height Seated (Max) | Length | Width | Radiation Hardening | Ratings |
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 | Mfr Part No XCKU095-2FFVA1156I | AMD | Datasheet | 728 | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 1156-FCBGA (35x35) | XCKU095 | AMD | 520 | Tray | Active | -40°C ~ 85°C | Tape & Reel (TR) | SiT8209 | 0.098 L x 0.079 W (2.50mm x 2.00mm) | Active | XO (Standard) | 1.8V | 133.3MHz | ±10ppm | LVCMOS, LVTTL | Standby (Power Down) | MEMS | 33mA | 10µA | 1176000 | 60518400 | 67200 | 2 | -- | 0.032 (0.80mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7S25-1FTGB196I | AMD | Datasheet | 42 | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 196-CSBGA (15x15) | XC7S25 | AMD | 100 | Tray | Active | -40°C ~ 85°C | Tape & Reel (TR) | SiT8209 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | Active | XO (Standard) | 2.5V | 98.304MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 36mA | 31mA | 23360 | 1658880 | 1825 | 1 | -- | 0.039 (1.00mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC3S700AN-4FGG484C | AMD | Datasheet | 2292 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 484-FBGA (23x23) | XC3S700 | SiTime | 372 | Strip | Active | -20°C ~ 70°C | SiT8209 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | XO (Standard) | 2.5V | 166.666 MHz | ±20ppm | LVCMOS, LVTTL | Standby (Power Down) | MEMS | 36mA | - | 13248 | 368640 | 700000 | 1472 | 4 | - | 0.031 (0.80mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX08-2FG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 4-SMD, No Lead | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | A54SX08 | 320 MHz | MICROSEMI CORP | Microsemi Corporation | A54SX08-2FG144 | Microchip Technology | 3 | 111 | 70 °C | Tray | PLASTIC/EPOXY | LBGA | 1 MM PITCH, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | Compliant | No | 3.6 V | 3 V | 3.3 V | -20°C ~ 70°C | Tape & Reel (TR) | SiT8209 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | e0 | Active | XO (Standard) | TIN LEAD SILVER | 70 °C | 0 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.8V | BOTTOM | BALL | 225 | 1 mm | compliant | 106.25MHz | ±10ppm | LVCMOS, LVTTL | S-PBGA-B144 | Standby (Power Down) | MEMS | 33mA | 111 | Not Qualified | 5 V | 3.3,5 V | COMMERCIAL | 10µA | 5.25 V | 4.75 V | 700 ps | 700 ps | 111 | 768 CLBS, 8000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 768 | 12000 | 320 MHz | 768 | 768 | 2 | -- | 256 | 0.7 ns | 768 | 768 | 8000 | 1.05 mm | 0.032 (0.80mm) | 13 mm | 13 mm | No | -- | ||||||
| Mfr Part No M1AFS1500-2FG676I | Microchip | Datasheet | 753 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 4-SMD, No Lead | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | M1AFS1500 | MICROSEMI CORP | Microsemi Corporation | M1AFS1500-2FG676I | Microchip Technology | 3 | 252 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Compliant | No | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 85°C | Tape & Reel (TR) | SiT8209 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | e0 | Active | XO (Standard) | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 2.5V | BOTTOM | BALL | 225 | 1 mm | compliant | 133.3333MHz | ±10ppm | LVCMOS, LVTTL | S-PBGA-B676 | Enable/Disable | MEMS | 36mA | Not Qualified | 1.5 V | INDUSTRIAL | 31mA | 1.575 V | 1.425 V | 33.8 kB | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 1.47059 GHz | 2 | -- | 38400 | 38400 | 1500000 | 1.73 mm | 0.032 (0.80mm) | 27 mm | 27 mm | No | -- | ||||||||||||||||
| Mfr Part No XC7S25-1CSGA324Q | AMD | Datasheet | 706 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 324-CSGA (15x15) | XC7S25 | AMD | 150 | Tray | Active | -40°C ~ 85°C | Tape & Reel (TR) | SiT8209 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | Active | XO (Standard) | 1.8V | 98.304MHz | ±10ppm | LVCMOS, LVTTL | Standby (Power Down) | MEMS | 33mA | 10µA | 23360 | 1658880 | 1 | -- | 0.032 (0.80mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCV300-5FG456C | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 456-FBGA (23x23) | XCV300 | SiTime | 312 | Strip | Active | -40°C ~ 85°C | SiT8209 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | XO (Standard) | 3.3V | 133.333 MHz | ±25ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 36mA | - | 6912 | 65536 | 322970 | 1536 | - | 0.031 (0.80mm) | - |
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XCKU095-2FFVA1156I
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
XC7S25-1FTGB196I
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
XC3S700AN-4FGG484C
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
129.368488
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A54SX08-2FG144
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
M1AFS1500-2FG676I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
643.573293
-
XC7S25-1CSGA324Q
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
44.496340
-
XCV300-5FG456C
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire