The category is 'Embedded - FPGAs (Field Programmable Gate Array)'

  • All Manufacturers
  • Applications
  • Backshell Material, Plating
  • Base Product Number
  • Cable Opening
  • Color
  • Connector Type
  • Contact Finish Mating
  • Contact Finish Thickness - Mating
  • Contact Materials
  • Current Rating (Amps)
  • Features
  • Series
  • Series:

    Standard

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Mounting Type

Mounting Feature

Shell Material

Insert Material

Backshell Material, Plating

Base Product Number

Contact Finish Mating

Contact Materials

Mfr

Package

Primary Material

Product Status

Voltage, Rating

Operating Temperature

Series

Termination

Connector Type

Number of Positions

Color

Applications

Fastening Type

Current Rating (Amps)

Orientation

Shielding

Ingress Protection

Shell Finish

Shell Size - Insert

Shell Size, MIL

Cable Opening

Features

Contact Finish Thickness - Mating

Material Flammability Rating

XC2S100EFTG256

Mfr Part No

XC2S100EFTG256

Xilinx Datasheet

-

-

Min: 1

Mult: 1

Free Hanging (In-Line)

-

Polyamide (PA), Nylon, Glass Filled

Polyamide (PA), Nylon, Glass Filled

Polyamide (PA), Nylon, Glass Filled

BD-03BFFA

Gold

Copper Alloy

Amphenol LTW

Bulk

Plastic

Active

-

-40°C ~ 105°C

Standard

Solder Cup

Plug, Female Sockets

3

Black

-

Threaded

5A

Keyed

Unshielded

IP67 - Dust Tight, Waterproof

-

B

-

-

Backshell, Coupling Nut

-

-