The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Applications
- Base Product Number
- Clock Frequency-Max
- Connector Type
- Contact Finish - Post
- Contact Finish Mating
- Contact Finish Thickness - Mating
- Contact Finish Thickness - Post
- Contact Length - Post
- Contact Length-Mating
- Contact Shape
- Series
- Series:
Trident Rectangular
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Contact Shape | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Contact Finish Mating | Contact Length-Mating | Contact Materials | Ihs Manufacturer | Insulation Materials | Manufacturer | Manufacturer Part Number | Mated Stacking Heights | Mfr | Moisture Sensitivity Levels | Number of I/Os | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Voltage, Rating | Operating Temperature | Series | JESD-609 Code | Termination | Connector Type | Number of Positions | Terminal Finish | Applications | Number of Rows | HTS Code | Fastening Type | Contact Type | Current Rating (Amps) | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Insulation Height | Style | Number of Positions Loaded | Reach Compliance Code | Pitch - Mating | Insulation Color | JESD-30 Code | Qualification Status | Row Spacing - Mating | Contact Length - Post | Shrouding | Contact Finish - Post | Overall Contact Length | Temperature Grade | Organization | Seated Height-Max | Programmable Logic Type | Total RAM Bits | Number of Gates | Number of CLBs | Number of Equivalent Gates | Features | Length | Width | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No A3P125-2PQ208 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | 208-BFQFP | YES | Circular | 208-PQFP (28x28) | 208 | TST24 | 350 MHz | Tin | - | - | MICROSEMI CORP | Polyamide (PA), Nylon | Microsemi Corporation | A3P125-2PQ208 | - | ITT Cannon, LLC | 3 | 133 | 85 °C | Bulk | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Obsolete | Active | 30 | 5.26 | No | 1.575 V | 1.425 V | 1.5 V | 250V | -40°C ~ 105°C | Trident Rectangular | e0 | Solder | Receptacle | 24 | Tin/Lead (Sn/Pb) | Automotive, Industrial | 4 | 8542.39.00.01 | Latch Holder | Male Pin | 13A | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | - | 0.5 mm | 0.531 (13.50mm) | Board to Cable/Wire | All | compliant | 0.200 (5.08mm) | Black | S-PQFP-G208 | Not Qualified | 0.200 (5.08mm) | 0.224 (5.70mm) | Unshrouded | - | - | COMMERCIAL | 3072 CLBS, 125000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 125000 | 3072 | 125000 | Mounting Flange | 28 mm | 28 mm | - | - | UL94 V-0 |