The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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VJ HIFREQ
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Ihs Manufacturer | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Mfr | Moisture Sensitivity Levels | Number of I/Os | Other Names | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Voltage Rated | Operating Temperature | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | ECCN Code | Temperature Coefficient | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Applications | Additional Feature | HTS Code | Capacitance | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Failure Rate | Lead Spacing | Power Supplies | RAM Size | Lead Style | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Number of LABs/CLBs | Number of CLBs | Number of Logic Cells | Features | Height Seated (Max) | Length | Width | Thickness (Max) | Ratings |
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 | Mfr Part No EP2C5Q208I8 | ALTERA | Datasheet | 772 | - | Min: 1 Mult: 1 | Surface Mount, MLCC | 0603 (1608 Metric) | YES | 208-PQFP (28x28) | 208 | VJ0603 | INTEL CORP | Contains lead / RoHS non-compliant | Intel Corporation | EP2C5Q208I8 | Vishay Vitramon | 3 | 142 | 544-2134 | Tape & Reel (TR) | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 30 | 1.58 | No | Cyclone Devices | 1.25 V | 1.15 V | 1.2 V | 50V | -55°C ~ 125°C | VJ HIFREQ | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±10% | e0 | Active | 3 (168 Hours) | EAR99 | C0G, NP0 | Tin/Lead (Sn/Pb) | RF, Microwave, High Frequency | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 91 pF | Field Programmable Gate Arrays | CMOS | 1.15 V ~ 1.25 V | QUAD | GULL WING | 220 | 0.5 mm | compliant | EP2C5 | S-PQFP-G208 | 134 | Not Qualified | - | 1.2,1.5/3.3,3.3 V | - | 142 | 288 CLBS | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 4608 | 119808 | 288 | 288 | 4608 | High Q, Low Loss | - | 28 mm | 28 mm | 0.037 (0.94mm) | - | |||||||||
| Mfr Part No AGL600V2-FGG256T | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount, MLCC | 0805 (2012 Metric) | 256 | VJ0805 | MICROSEMI CORP | Microsemi Corporation | AGL600V2-FGG256T | Vishay Vitramon | 3 | 110592 | Tape & Reel (TR) | Active | Active | 30 | 5.76 | Compliant | Yes | 100V | -55°C ~ 125°C | VJ HIFREQ | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.25pF | e1 | C0G, NP0 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | RF, Microwave, High Frequency | 8542.39.00.01 | 3.3 pF | 250 | compliant | - | - | 13.5 kB | - | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 600000 | High Q, Low Loss | - | 0.057 (1.45mm) | - |