The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- Base Product Number
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eX256
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | # I/Os (Max) | # Registers | Base Product Number | Clock Frequency-Max | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Logic Cells | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Blocks/Elements | Number of Logic Elements | Number of Usable Gates | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Operating Supply Voltage | Temperature Grade | Data Rate | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Number of Gates | Speed Grade | Number of Transceivers | Combinatorial Delay of a CLB-Max | Number of Equivalent Gates | Height | Length | Width |
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 | Mfr Part No eX256-PTQG100 | Microchip Technology | Datasheet | 2004 |
| Min: 1 Mult: 1 | Surface Mount | TQFP-100 | YES | 100-TQFP (14x14) | 100 | EX256 | 357 MHz | 90 | MICROSEMI CORP | EX256-PTQG100 | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 81 I/O | 70 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.59 | Details | Yes | 2.7 V | 2.3 V | 2.5 V | Actel | 0.023175 oz | 0°C ~ 70°C (TA) | Tray | eX256 | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G100 | 2.5 V | COMMERCIAL | 12000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 512 | 12000 | 0.7 ns | 12000 | 1.4 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||
| Mfr Part No eX256-FTQG100 | Microchip Technology | Datasheet | 22 |
| Min: 1 Mult: 1 | Surface Mount | TQFP-100 | YES | 100-TQFP (14x14) | 100 | 81 | 512 | EX256 | 178 MHz | 12000 | 90 | eX | MICROSEMI CORP | 512 | EX256-FTQG100 | + 70 C | Microchip Technology | 0 C | Yes | 3 | Surface Mount | SMD/SMT | 81 I/O | - | 512 | 512 LE | 8000 | 2.7(V) | 2.3(V) | 2.5(V) | 0C to 70C | 70C | 0C | Commercial | 70 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | TQFP | Active | 0.22UM | Active | Yes | No | 40 | 2.02 | Details | Yes | 2.7 V | 2.3 V | 2.5 V | Actel | 0.023175 oz | 0°C ~ 70°C (TA) | Tray | eX256 | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 260 | 0.5 mm | compliant | 100 | S-PQFP-G100 | 2.5 V | COMMERCIAL | 12000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 512 | 12000 | 1.4 ns | 12000 | 1.4 mm | 14 mm | 14 mm | ||||||
| Mfr Part No eX256-PTQG100I | Microchip Technology | Datasheet | 2143 |
| Min: 1 Mult: 1 | Surface Mount | TQFP-100 | YES | 100-TQFP (14x14) | 100 | EX256 | 357 MHz | 90 | MICROSEMI CORP | EX256-PTQG100I | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 81 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.59 | Details | Yes | 2.7 V | 2.3 V | 2.5 V | Actel | 0.023175 oz | -40°C ~ 85°C (TA) | Tray | eX256 | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G100 | 2.5 V | INDUSTRIAL | 12000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 512 | 12000 | 0.7 ns | 12000 | 1.4 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||
| Mfr Part No eX256-TQG100I | Microchip Technology | Datasheet | 3 |
| Min: 1 Mult: 1 | Surface Mount | TQFP-100 | YES | 100-TQFP (14x14) | 100 | EX256 | 250 MHz | 90 | MICROSEMI CORP | EX256-TQG100I | 250 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 81 I/O | 512 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.29 | Details | Yes | 2.7 V | 2.3 V | 2.5 V | Actel | 0.023175 oz | -40°C ~ 85°C (TA) | Tray | eX256 | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G100 | 2.5 V | INDUSTRIAL | - | 12000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 512 | 12000 | STD | - | 1 ns | 12000 | 1.4 mm | 14 mm | 14 mm | ||||||||||||||||||||||
| Mfr Part No eX256-TQG100A | Microchip Technology | Datasheet | 2020 |
| Min: 1 Mult: 1 | Surface Mount | TQFP-100 | YES | 100-TQFP (14x14) | 100 | EX256 | 250 MHz | 90 | MICROSEMI CORP | EX256-TQG100A | 250 MHz | + 125 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 81 I/O | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.59 | Details | Yes | 2.7 V | 2.3 V | Actel | 0.023175 oz | -40°C ~ 125°C (TA) | Tray | eX256 | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G100 | 2.5 V | AUTOMOTIVE | 12000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 512 | 12000 | STD | 1 ns | 12000 | 1.4 mm | 14 mm | 14 mm |
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eX256-PTQG100
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
140.203553
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eX256-FTQG100
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
53.575729
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eX256-PTQG100I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
186.762444
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eX256-TQG100I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
92.784281
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eX256-TQG100A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
208.315572