The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- Clock Frequency-Max (fCLK)
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- Supply Current-Max
- Supply Current-Max:
0.05 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Access Time-Max | Body Orientation | Clock Frequency-Max (fCLK) | Contact Classification | Contact Materials | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Memory Types | Mfr | Moisture Sensitivity Levels | Mounting Styles | Number of Words | Number of Words Code | Operating Temp Range | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Diameter (mm) | Product Status | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shell Size / Insert Arrangement | Supply Voltage-Nom (Vsup) | Termination Method | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Pbfree Code | Part Status | Number of Terminations | ECCN Code | Temperature Coefficient | Type | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Gender | Power (Watts) | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Frequency | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Number of Contacts | Contact Gender | Operating Supply Voltage | Failure Rate | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Programmable Type | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | Number of Ports | Operating Mode | Supply Current-Max | Family | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Max Frequency | Parallel/Serial | I/O Type | Memory IC Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Shell Plating | Features | Total Dose | Strain Relief | Product Length (mm) | Height Seated (Max) | Length | Width | Radiation Hardening | Lead Free |
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 | Mfr Part No XQ18V04CC44M | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 0603 (1608 Metric) | YES | 0603 | 44 | 20 MHz | XILINX INC | Xilinx | XQ18V04CC44M | Vishay Dale Thin Film | 524288 words | 512000 | 125 °C | -55 °C | Tape & Reel (TR) | CERAMIC, METAL-SEALED COFIRED | QCCJ | QCCJ, LDCC44,.7SQ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | Active | NOT SPECIFIED | 5.84 | Non-Compliant | No | 3.3 V | -55°C ~ 155°C | PHP | 0.064 L x 0.032 W (1.63mm x 0.81mm) | ±0.1% | e0 | 2 | 3A001.A.2.C | ±25ppm/°C | NOR TYPE | 4.27 kOhms | TIN LEAD | Thin Film | 0.375W, 3/8W | 8542.39.00.01 | Flash Memories | CMOS | QUAD | J BEND | NOT SPECIFIED | 1 | 1.27 mm | compliant | 44 | S-CQCC-J44 | Not Qualified | - | 3.6 V | 2.5/3.3,3.3 V | MILITARY | 3 V | SYNCHRONOUS | 0.05 mA | 512KX8 | 4.826 mm | 8 | 0.02 A | 4194304 bit | PARALLEL/SERIAL | CONFIGURATION MEMORY | 2000 Write/Erase Cycles | 10 | Flame Proof, Moisture Resistant, Safety | 40k Rad(Si) V | 0.020 (0.51mm) | 16.51 mm | 16.51 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AT17F16A-30CI | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | Straight | 10 MHz | (6/26)Signal | Beryllium Copper | ATMEL CORP | Atmel Corporation | AT17F16A-30CI | 3 | Cable | 16777216 words | 16000000 | -65C to 200C | 85 °C | -40 °C | UNSPECIFIED | SON | SON, SOLCC8,.25 | SOLCC8,.25 | SQUARE | SMALL OUTLINE | Obsolete | SOIC | 41.28(mm) | No | 30 | 5.62 | No | 22-32 | 3.3 V | Crimp | 850VDC/600VAC | e0 | No | EAR99 | Circular | Tin/Lead (Sn/Pb) | PL | 8542.32.00.51 | Flash Memories | CMOS | DUAL | NO LEAD | 240 | 1 | 1.27 mm | compliant | 8 | S-XDSO-N8 | Not Qualified | 32(POS) | PIN | 3.63 V | 3.3 V | INDUSTRIAL | 2.97 V | 1(Port) | SYNCHRONOUS | 0.05 mA | M83723 | 16MX1 | 1.14 mm | 1 | 16777216 bit | SERIAL | CONFIGURATION MEMORY | 0.03 ms | Electroless Nickel | No | 34.8(mm) | 5.99 mm | 5.99 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AT17F32A-30BJI | Atmel | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 10 MHz | ATMEL CORP | Atmel Corporation | AT17F32A-30BJI | 2 | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, MS-018AC, LCC-44 | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | LPCC | 30 | 5.89 | No | 3.3 V | * | e0 | Active | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | Flash Memories | CMOS | QUAD | J BEND | 225 | 1 | 1.27 mm | unknown | 44 | S-PQCC-J44 | Not Qualified | 3.63 V | 3.3 V | INDUSTRIAL | 2.97 V | SYNCHRONOUS | 0.05 mA | 32MX1 | 4.572 mm | 1 | 0.003 A | 33554432 bit | SERIAL | CONFIGURATION MEMORY | 10000 Write/Erase Cycles | 0.03 ms | 16.5862 mm | 16.5862 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XQR18V04CC44V | Xilinx | Datasheet | 1200 | - | Min: 1 Mult: 1 | YES | 44 | 20 MHz | XILINX INC | Xilinx | XQR18V04CC44V | 1 | 512 words | 512 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QCCJ | QCCJ, LDCC44,.7SQ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | NOT SPECIFIED | 5.88 | No | 3.3 V | e0 | No | USML XV(E) | NOR TYPE | TIN LEAD | 8542.32.00.71 | Flash Memories | CMOS | QUAD | J BEND | 225 | 1 | 1.27 mm | unknown | 44 | S-CQCC-J44 | Not Qualified | 3.6 V | 2.5/3.3,3.3 V | MILITARY | 3 V | SYNCHRONOUS | 0.05 mA | 512X8 | 4.826 mm | 8 | 0.02 A | 4096 bit | PARALLEL/SERIAL | CONFIGURATION MEMORY | 2000 Write/Erase Cycles | 10 | 40k Rad(Si) V | 16.51 mm | 16.51 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EPC1LI20 | ALTERA | Datasheet | 4640 | - | Min: 1 Mult: 1 | Surface Mount | 20-LCC (J-Lead) | YES | 20 | 20-PLCC (9x9) | 722.005655 mg | 20 | 75 ns | 8 MHz | INTEL CORP | Intel Corporation | EPC1LI20 | FLASH | 1 | 1046496 words | 1046496 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LCC20,.39SQ | LCC20,.39SQ | SQUARE | CHIP CARRIER | Obsolete | 30 | 8.4 | Compliant | No | 8542320060 | 3.3 V | -40°C ~ 85°C | Tube | EPC | e0 | Obsolete | 3A991.B.2.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | IT CAN ALSO OPERATE AT 5V SUPPLY | 8542.32.00.61 | OTP ROMs | MOS | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | QUAD | J BEND | 220 | 1 | 1.27 mm | compliant | 16.7 MHz | EPC1 | S-PQCC-J20 | Not Qualified | 5 V | 3.6 V | 5 V | INDUSTRIAL | 3 V | OTP | 5.25 V | 3 V | 1Mb | 50 µA | SYNCHRONOUS | 0.05 mA | 1046496X1 | 3-STATE | 4.572 mm | 1 | 0.0001 A | 1046496 bit | 8 MHz | SERIAL | COMMON | CONFIGURATION MEMORY | 8.9662 mm | 8.9662 mm | No | Contains Lead |
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XQ18V04CC44M
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AT17F16A-30CI
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AT17F32A-30BJI
Atmel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XQR18V04CC44V
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EPC1LI20
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire