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      Home / All Categories / Integrated Circuits (ICs) / Embedded - Microcontroller, Microprocessor, FPGA Modules /

      The category is 'Embedded - Microcontroller, Microprocessor, FPGA Modules'

      • All Manufacturers
      • ECCN Code
      • HTS Code
      • Ihs Manufacturer
      • JESD-30 Code
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      • Moisture Sensitivity Levels
      • Number of Terminals
      • Operating Temperature-Max
      • Package Body Material
      • Package Code
      • Package Description
      • Package Shape
      • ECCN Code:

        5A992.C

      Image

      Part Number

      Manufacturer

      Datasheet

      Availability

      Pricing(USD)

      Quantity

      RoHS

      Factory Lead Time

      Surface Mount

      Number of Terminals

      Date Of Intro

      Ihs Manufacturer

      Moisture Sensitivity Levels

      Operating Temperature-Max

      Operating Temperature-Min

      Package Body Material

      Package Code

      Package Description

      Package Equivalence Code

      Package Shape

      Package Style

      Part Life Cycle Code

      Rohs Code

      Supply Voltage-Max

      Supply Voltage-Min

      Supply Voltage-Nom

      JESD-609 Code

      Pbfree Code

      ECCN Code

      Terminal Finish

      Additional Feature

      HTS Code

      Terminal Position

      Terminal Form

      Peak Reflow Temperature (Cel)

      Terminal Pitch

      Reach Compliance Code

      Time@Peak Reflow Temperature-Max (s)

      JESD-30 Code

      Qualification Status

      Temperature Grade

      Speed

      uPs/uCs/Peripheral ICs Type

      Seated Height-Max

      Address Bus Width

      Boundary Scan

      Low Power Mode

      Screening Level

      External Data Bus Width

      Format

      Integrated Cache

      Length

      Width
      MCIMX258CJM4A

      Mfr Part No

      MCIMX258CJM4A

      		NXP Semiconductors Datasheet

      -

      -

      Min: 1

      Mult: 1

      18 Weeks

      YES

      400

      NXP SEMICONDUCTORS

      3

      85 °C

      -40 °C

      PLASTIC/EPOXY

      LFBGA

      MAPBGA-400

      BGA400,20X20,32

      SQUARE

      GRID ARRAY, LOW PROFILE, FINE PITCH

      Active

      Yes

      1.52 V

      1.38 V

      1.45 V

      e1

      5A992.C

      Tin/Silver/Copper (Sn/Ag/Cu)

      ALSO REQUIRES 3.3 V I/O SUPPLY

      8542.31.00.01

      BOTTOM

      BALL

      260

      0.8 mm

      compliant

      40

      S-PBGA-B400

      Not Qualified

      INDUSTRIAL

      SoC

      1.6 mm

      17 mm

      17 mm

      MCIMX6G2AVM07AB

      Mfr Part No

      MCIMX6G2AVM07AB

      		NXP Semiconductors Datasheet

      -

      -

      Min: 1

      Mult: 1

      4 Weeks

      YES

      289

      2017-05-31

      NXP SEMICONDUCTORS

      3

      125 °C

      -40 °C

      PLASTIC/EPOXY

      LFBGA

      BGA-289

      SQUARE

      GRID ARRAY, LOW PROFILE, FINE PITCH

      Active

      Yes

      1.3 V

      1.25 V

      e2

      5A992.C

      Tin/Silver (Sn/Ag)

      8542.31.00.01

      BOTTOM

      BALL

      260

      0.8 mm

      compliant

      40

      S-PBGA-B289

      AUTOMOTIVE

      696 MHz

      MULTIFUNCTION PERIPHERAL

      1.32 mm

      26

      YES

      YES

      16

      FIXED POINT

      YES

      14 mm

      14 mm

      MCIMX6Y2DVM05AB

      Mfr Part No

      MCIMX6Y2DVM05AB

      		NXP Semiconductors Datasheet

      -

      -

      Min: 1

      Mult: 1

      4 Weeks

      YES

      289

      NXP SEMICONDUCTORS

      3

      95 °C

      PLASTIC/EPOXY

      LFBGA

      MAPBGA-289

      BGA289,17X17,32

      SQUARE

      GRID ARRAY, LOW PROFILE, FINE PITCH

      Active

      Yes

      1.5 V

      1.275 V

      e1

      5A992.C

      Tin/Silver/Copper (Sn/Ag/Cu)

      8542.31.00.01

      BOTTOM

      BALL

      260

      0.8 mm

      compliant

      40

      S-PBGA-B289

      SoC

      1.32 mm

      14 mm

      14 mm

      MIMX8MM6DVTLZAA

      Mfr Part No

      MIMX8MM6DVTLZAA

      		NXP Semiconductors Datasheet

      -

      -

      Min: 1

      Mult: 1

      4 Weeks

      YES

      486

      2019-02-21

      NXP SEMICONDUCTORS

      3

      95 °C

      PLASTIC/EPOXY

      LFBGA

      FCBGA-486

      BGA486,27X27,20

      SQUARE

      GRID ARRAY, LOW PROFILE, FINE PITCH

      Active

      Yes

      1.05 V

      0.95 V

      1 V

      e2

      5A992.C

      Tin/Silver (Sn/Ag)

      8542.31.00.01

      BOTTOM

      BALL

      260

      0.5 mm

      compliant

      40

      S-PBGA-B486

      OTHER

      SoC

      1.25 mm

      14 mm

      14 mm

      MCIMX6S5DVM10AD

      Mfr Part No

      MCIMX6S5DVM10AD

      		NXP Semiconductors Datasheet

      -

      -

      Min: 1

      Mult: 1

      16 Weeks

      YES

      624

      NXP SEMICONDUCTORS

      3

      95 °C

      PLASTIC/EPOXY

      LFBGA

      MABGA-624

      BGA624,25X25,32

      SQUARE

      GRID ARRAY, LOW PROFILE, FINE PITCH

      Active

      Yes

      1.5 V

      1.35 V

      e1

      5A992.C

      Tin/Silver/Copper (Sn/Ag/Cu)

      8542.31.00.01

      BOTTOM

      BALL

      260

      0.8 mm

      compliant

      40

      S-PBGA-B624

      OTHER

      SoC

      1.6 mm

      21 mm

      21 mm

      TDA2PHFUQACDQ1

      Mfr Part No

      TDA2PHFUQACDQ1

      		Texas Instruments Datasheet

      -

      -

      Min: 1

      Mult: 1

      YES

      784

      2018-12-09

      TEXAS INSTRUMENTS INC

      3

      125 °C

      -40 °C

      PLASTIC/EPOXY

      LFBGA

      LFBGA,

      SQUARE

      GRID ARRAY, LOW PROFILE, FINE PITCH

      Active

      Yes

      1.2 V

      1.11 V

      1.15 V

      e1

      Yes

      5A992.C

      TIN SILVER COPPER

      8542.31.00.01

      BOTTOM

      BALL

      250

      0.8 mm

      compliant

      30

      S-PBGA-B784

      AUTOMOTIVE

      SoC

      1.63 mm

      AEC-Q100

      23 mm

      23 mm

      TDA2EGBDQCBDQ1

      Mfr Part No

      TDA2EGBDQCBDQ1

      		Texas Instruments Datasheet

      -

      -

      Min: 1

      Mult: 1

      YES

      538

      2018-08-26

      TEXAS INSTRUMENTS INC

      3

      125 °C

      -40 °C

      PLASTIC/EPOXY

      LFBGA

      LFBGA,

      SQUARE

      GRID ARRAY, LOW PROFILE, FINE PITCH

      Active

      Yes

      1.2 V

      1.11 V

      1.15 V

      e1

      5A992.C

      TIN SILVER COPPER

      8542.31.00.01

      BOTTOM

      BALL

      260

      0.65 mm

      compliant

      30

      S-PBGA-B538

      AUTOMOTIVE

      SoC

      1.298 mm

      AEC-Q100

      17 mm

      17 mm

      MCIMX6Q4AVT10AC

      Mfr Part No

      MCIMX6Q4AVT10AC

      		NXP Semiconductors Datasheet

      -

      -

      Min: 1

      Mult: 1

      4 Weeks

      YES

      624

      NXP SEMICONDUCTORS

      3

      125 °C

      -40 °C

      PLASTIC/EPOXY

      FBGA

      FCBGA-624

      SQUARE

      GRID ARRAY, FINE PITCH

      Not Recommended

      Yes

      1.5 V

      1.35 V

      e1

      5A992.C

      Tin/Silver/Copper (Sn/Ag/Cu)

      24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE

      8542.31.00.01

      BOTTOM

      BALL

      260

      0.8 mm

      compliant

      40

      S-PBGA-B624

      AUTOMOTIVE

      SoC

      2.16 mm

      21 mm

      21 mm

      MCIMX353DJQ5C

      Mfr Part No

      MCIMX353DJQ5C

      		NXP Semiconductors Datasheet

      -

      -

      Min: 1

      Mult: 1

      18 Weeks

      YES

      400

      NXP SEMICONDUCTORS

      3

      70 °C

      -20 °C

      PLASTIC/EPOXY

      LFBGA

      17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

      BGA400,20X20,32

      SQUARE

      GRID ARRAY, LOW PROFILE, FINE PITCH

      Active

      Yes

      1.47 V

      1.33 V

      1.8 V

      e1

      5A992.C

      Tin/Silver/Copper (Sn/Ag/Cu)

      IT ALSO OPERATES AT 1.22 TO 1.47 V

      8542.31.00.01

      BOTTOM

      BALL

      260

      0.8 mm

      compliant

      40

      S-PBGA-B400

      Not Qualified

      OTHER

      SoC

      1.6 mm

      17 mm

      17 mm

      MCIMX6Q5EYM10AD

      Mfr Part No

      MCIMX6Q5EYM10AD

      		NXP Semiconductors Datasheet

      -

      -

      Min: 1

      Mult: 1

      16 Weeks

      YES

      624

      NXP SEMICONDUCTORS

      3

      105 °C

      -20 °C

      PLASTIC/EPOXY

      LFBGA

      FCBGA-624

      SQUARE

      GRID ARRAY, LOW PROFILE, FINE PITCH

      Active

      Yes

      1.5 V

      1.35 V

      e1

      5A992.C

      Tin/Silver/Copper (Sn/Ag/Cu)

      24MHZ NOMINAL FREQ AVAILABLE

      8542.31.00.01

      BOTTOM

      BALL

      260

      0.8 mm

      compliant

      40

      S-PBGA-B624

      OTHER

      SoC

      1.6 mm

      21 mm

      21 mm

      MCIMX6Y2CVM08AB

      Mfr Part No

      MCIMX6Y2CVM08AB

      		NXP Semiconductors Datasheet

      -

      -

      Min: 1

      Mult: 1

      4 Weeks

      YES

      289

      2017-11-21

      NXP SEMICONDUCTORS

      3

      105 °C

      -40 °C

      PLASTIC/EPOXY

      LFBGA

      MAPBGA-289

      BGA289,17X17,32

      SQUARE

      GRID ARRAY, LOW PROFILE, FINE PITCH

      Active

      Yes

      1.5 V

      1.325 V

      e1

      5A992.C

      Tin/Silver/Copper (Sn/Ag/Cu)

      8542.31.00.01

      BOTTOM

      BALL

      260

      0.8 mm

      compliant

      40

      S-PBGA-B289

      SoC

      1.32 mm

      14 mm

      14 mm

      MCIMX6D5EYM10AD

      Mfr Part No

      MCIMX6D5EYM10AD

      		NXP Semiconductors Datasheet

      -

      -

      Min: 1

      Mult: 1

      4 Weeks

      YES

      624

      NXP SEMICONDUCTORS

      3

      105 °C

      -20 °C

      PLASTIC/EPOXY

      LFBGA

      FCBGA-624

      SQUARE

      GRID ARRAY, LOW PROFILE, FINE PITCH

      Active

      Yes

      1.5 V

      1.35 V

      e1

      5A992.C

      Tin/Silver/Copper (Sn/Ag/Cu)

      24MHZ NOMINAL FREQ AVAILABLE

      8542.31.00.01

      BOTTOM

      BALL

      260

      0.8 mm

      compliant

      40

      S-PBGA-B624

      OTHER

      SoC

      1.6 mm

      21 mm

      21 mm

      MIMX8DX5AVLFZAC

      Mfr Part No

      MIMX8DX5AVLFZAC

      		NXP Semiconductors Datasheet

      -

      -

      Min: 1

      Mult: 1

      26 Weeks

      YES

      609

      2020-04-09

      NXP SEMICONDUCTORS

      3

      125 °C

      -40 °C

      PLASTIC/EPOXY

      FBGA

      FCBGA-609

      BGA609,35X35,32

      SQUARE

      GRID ARRAY, FINE PITCH

      Active

      Yes

      1.15 V

      1.05 V

      1.1 V

      5A992.C

      8542.31.00.01

      BOTTOM

      BALL

      260

      0.8 mm

      compliant

      40

      S-PBGA-B609

      AUTOMOTIVE

      SoC

      2.52 mm

      21 mm

      21 mm