The category is 'Embedded - Microcontroller, Microprocessor, FPGA Modules'
- All Manufacturers
- Module/Board Type
- Part Status
- RoHS Status
- Connector Type
- Core Processor
- Flash Size
- Published
- Series
- Operating Temperature
- Size / Dimension
- Factory Lead Time
- Speed
- RoHS Status:
ROHS3 Compliant
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Operating Temperature | Series | Size / Dimension | Part Status | Moisture Sensitivity Level (MSL) | Connector Type | Speed | RAM Size | Core Processor | Module/Board Type | Flash Size | Co-Processor | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No TE0808-04-09EG-1EK | Trenz Electronic GmbH | Datasheet | - | - | Min: 1 Mult: 1 | 0°C~85°C | TE0808 | 2.05 x 2.99 52mmx76mm | Obsolete | 1 (Unlimited) | B2B | 2GB | Zynq UltraScale+ XCZU9EG-1FFVC900E | MPU Core | 128MB | ROHS3 Compliant | ||||
| Mfr Part No TE0745-02-30-2IA | Trenz Electronic GmbH | Datasheet | - | - | Min: 1 Mult: 1 | 14 Weeks | -40°C~85°C | TE0745 | 2.99 x 2.05 76mmx52mm | Obsolete | 1 (Unlimited) | 1GB | ARM® Cortex®-A9 | MCU, FPGA | 64MB | Zynq-7000 (Z-7030) | ROHS3 Compliant | |||
| Mfr Part No TE0745-02-45-1CA | Trenz Electronic GmbH | Datasheet | - | - | Min: 1 Mult: 1 | 14 Weeks | 0°C~70°C | TE0745 | 2.05 x 2.99 52mmx76mm | Obsolete | 1 (Unlimited) | Samtec UFPS | 1GB | ARM® Cortex®-A9 | MCU, FPGA | 32MB | Zynq-7000 (Z-7045) | ROHS3 Compliant | ||
| Mfr Part No TE0808-04-15EG-1EK | Trenz Electronic GmbH | Datasheet | - | - | Min: 1 Mult: 1 | 0°C~85°C | TE0808 | 2.05 x 2.99 52mmx76mm | Obsolete | 1 (Unlimited) | B2B | 4GB | Zynq UltraScale+ XCZU15EG-1FFVC900E | MPU Core | 128MB | ROHS3 Compliant | ||||
| Mfr Part No TEC0850-03-15EG1EA | Trenz Electronic GmbH | Datasheet | - | - | Min: 1 Mult: 1 | TEC0850 | Obsolete | Not Applicable | CompactPCI Serial Backplane | 8GB | Zynq UltraScale+ XCZU15EG-1FFVB1156E | MCU, FPGA | 128MB | ROHS3 Compliant | ||||||
| Mfr Part No TE0841-02-41I21-L | Trenz Electronic GmbH | Datasheet | - | - | Min: 1 Mult: 1 | Active | Not Applicable | ROHS3 Compliant | ||||||||||||
 | Mfr Part No M5485AFE | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | -40°C~85°C | ColdFire® | 3.7 x 4.5 93.4mmx114.3mm | Obsolete | 1 (Unlimited) | 200MHz | 64MB | ColdFire V4e, MCF5485 | MPU Core | 2MB Boot | ROHS3 Compliant | ||||
| Mfr Part No TEC0850-03-015EG1E | Trenz Electronic GmbH | Datasheet | - | - | Min: 1 Mult: 1 | TEC0850 | Obsolete | Not Applicable | CompactPCI Serial Backplane | 8GB | Zynq UltraScale+ XCZU15EG-1FFVB1156E | MCU, FPGA | 128MB | ROHS3 Compliant | ||||||
| Mfr Part No TE0841-02-31I21-A | Trenz Electronic GmbH | Datasheet | 488 |
| Min: 1 Mult: 1 | Active | Not Applicable | ROHS3 Compliant | ||||||||||||
 | Mfr Part No TE0745-02-71I11-A | Trenz Electronic GmbH | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | -40°C~85°C | TE0745 | 2.05 x 2.99 52mmx76mm | Active | 1 (Unlimited) | Samtec ST5 | 1GB | ARM® Cortex®-A9 | MCU, FPGA | 64MB | Zynq-7000 (Z-7030) | ROHS3 Compliant | ||
| Mfr Part No TE0841-02-41C21-A | Trenz Electronic GmbH | Datasheet | 564 |
| Min: 1 Mult: 1 | 12 Weeks | 0°C~70°C | TE0841 | 1.97 x 1.57 50mmx40mm | Active | 1 (Unlimited) | B2B | 2GB | Kintex UltraScale KU40 | MCU, FPGA | 64MB | ROHS3 Compliant | |||
| Mfr Part No TE0745-02-71I11-AK | Trenz Electronic GmbH | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | -40°C~85°C | TE0745 | 2.05 x 2.99 52mmx76mm | Active | 1 (Unlimited) | Samtec ST5 | 1GB | ARM® Cortex®-A9 | MCU, FPGA | 64MB | Zynq-7000 (Z-7030) | ROHS3 Compliant | ||
| Mfr Part No TE0808-04-9GI21-AS | Trenz Electronic GmbH | Datasheet | - | - | Min: 1 Mult: 1 | 14 Weeks | -40°C~85°C | TE0808 | 2.05 x 2.99 52mmx76mm | Active | Not Applicable | B2B | 4GB | Zynq UltraScale+ ZU9 | FPGA Core | 128MB | ROHS3 Compliant | |||
| Mfr Part No TE0808-04-6BE21-AK | Trenz Electronic GmbH | Datasheet | 661 |
| Min: 1 Mult: 1 | 12 Weeks | 0°C~85°C | TE0808 | 2.05 x 2.99 52mmx76mm | Active | 1 (Unlimited) | B2B | 4GB | Zynq UltraScale+ XCZU6EG-1FFVC900E | MPU Core | 128MB | ROHS3 Compliant | |||
| Mfr Part No TE0808-04-9BE21-AK | Trenz Electronic GmbH | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 0°C~85°C | TE0808 | 2.05 x 2.99 52mmx76mm | Active | 1 (Unlimited) | B2B | 2GB | Zynq UltraScale+ XCZU9EG-1FFVC900E | MPU Core | 128MB | ROHS3 Compliant | |||
| Mfr Part No TE0803-03-3BE11-AS | Trenz Electronic GmbH | Datasheet | - | - | Min: 1 Mult: 1 | Active | Not Applicable | ROHS3 Compliant | ||||||||||||
| Mfr Part No TE0841-02-0401IL | Trenz Electronic GmbH | Datasheet | - | - | Min: 1 Mult: 1 | -40°C~85°C | TE0841 | 1.97 x 1.57 50mmx40mm | Obsolete | Not Applicable | B2B | 2GB | Kintex UltraScale KU40 | MCU, FPGA | 64MB | ROHS3 Compliant | ||||
 | Mfr Part No TE0745-02-81C11-A | Trenz Electronic GmbH | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | -40°C~85°C | TE0745 | 2.05 x 2.99 52mmx76mm | Active | 1 (Unlimited) | Samtec ST5 | 1GB | ARM® Cortex®-A9 | MCU, FPGA | 32MB | Zynq-7000 (Z-7035) | ROHS3 Compliant | ||
| Mfr Part No TEC0850-03-BBEX1-A | Trenz Electronic GmbH | Datasheet | 549 |
| Min: 1 Mult: 1 | Active | Not Applicable | ROHS3 Compliant | ||||||||||||
| Mfr Part No M5474GFE | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | ColdFire® | Obsolete | 1 (Unlimited) | ROHS3 Compliant |
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TE0808-04-09EG-1EK
Trenz Electronic GmbH
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
-
TE0745-02-30-2IA
Trenz Electronic GmbH
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
-
TE0745-02-45-1CA
Trenz Electronic GmbH
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
-
TE0808-04-15EG-1EK
Trenz Electronic GmbH
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
-
TEC0850-03-15EG1EA
Trenz Electronic GmbH
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
-
TE0841-02-41I21-L
Trenz Electronic GmbH
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
-
M5485AFE
NXP USA Inc.
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
-
TEC0850-03-015EG1E
Trenz Electronic GmbH
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
-
TE0841-02-31I21-A
Trenz Electronic GmbH
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
1,440.242943
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TE0745-02-71I11-A
Trenz Electronic GmbH
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
-
TE0841-02-41C21-A
Trenz Electronic GmbH
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
1,609.317749
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TE0745-02-71I11-AK
Trenz Electronic GmbH
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
-
TE0808-04-9GI21-AS
Trenz Electronic GmbH
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
-
TE0808-04-6BE21-AK
Trenz Electronic GmbH
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
1,176.561600
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TE0808-04-9BE21-AK
Trenz Electronic GmbH
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
-
TE0803-03-3BE11-AS
Trenz Electronic GmbH
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
-
TE0841-02-0401IL
Trenz Electronic GmbH
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
-
TE0745-02-81C11-A
Trenz Electronic GmbH
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire
-
TEC0850-03-BBEX1-A
Trenz Electronic GmbH
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
3,149.377654
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M5474GFE
NXP USA Inc.
Package:Embedded - Microcontroller, Microprocessor, FPGA Modules
Price: please inquire