The category is 'Embedded - Microcontroller, Microprocessor, FPGA Modules'

  • All Manufacturers
  • Boundary Scan
  • Bus Compatibility
  • Clock Frequency-Max
  • Date Of Intro
  • Factory Lead Time
  • HTS Code
  • Ihs Manufacturer
  • JESD-30 Code
  • JESD-609 Code
  • Length
  • Number of I/O Lines
  • Supply Current-Max
  • Supply Current-Max:

    5000 mA

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Factory Lead Time

Surface Mount

Number of Terminals

Clock Frequency-Max

Date Of Intro

Ihs Manufacturer

Moisture Sensitivity Levels

Number of I/O Lines

Operating Temperature-Max

Operating Temperature-Min

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Rohs Code

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom

JESD-609 Code

Terminal Finish

HTS Code

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Terminal Pitch

Reach Compliance Code

Time@Peak Reflow Temperature-Max (s)

JESD-30 Code

Temperature Grade

uPs/uCs/Peripheral ICs Type

Supply Current-Max

Seated Height-Max

Boundary Scan

RAM (words)

Bus Compatibility

Length

Width

MIMX8UX5AVLFZAC

Mfr Part No

MIMX8UX5AVLFZAC

NXP Semiconductors Datasheet

-

-

Min: 1

Mult: 1

4 Weeks

YES

609

24 MHz

2020-04-09

NXP SEMICONDUCTORS

3

99

125 °C

-40 °C

PLASTIC/EPOXY

FBGA

FCPBGA-609

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

Active

Yes

1.15 V

1.05 V

1.1 V

e2

TIN SILVER

8542.39.00.01

BOTTOM

BALL

260

0.8 mm

compliant

40

S-PBGA-B609

AUTOMOTIVE

MULTIFUNCTION PERIPHERAL

5000 mA

2.52 mm

YES

512000

CAN(3), SAI(4), SPI(4), UART(6)

21 mm

21 mm