The category is 'Embedded - Microcontrollers'
- All Manufacturers
- Base Part Number
- Bit Size
- Clock Frequency
- Connectivity
- Core Processor
- Core Size
- DAC Channels
- DMA Channels
- Data Converters
- Factory Lead Time
- Has ADC
- Height Seated (Max)
- Base Part Number:
LPC314*
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | ROM(word) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Connectivity | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | ROM Programmability | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No LPC3143FET180,551 | NXP USA Inc. | Datasheet | 1600 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 180-TFBGA | YES | A/D 4x10b | 20 | 0 | -40°C~85°C TA | Tray | 2009 | LPC3100 | e1 | Not For New Designs | 3 (168 Hours) | 180 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | LPC314* | 180 | S-PBGA-B180 | Not Qualified | 1.3V | 1.21.8/3.3V | 1.1V | External | 270MHz | 192K x 8 | 1.1V~3.6V | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, I2S, LCD, PWM, WDT | 25MHz | ROMless | 16/32-Bit | EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG | 32 | YES | YES | YES | NO | FLASH | 1.2mm | 12mm | 12mm | ROHS3 Compliant | |
| Mfr Part No LPC3141FET180,551 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 180-TFBGA | YES | A/D 4x10b | 20 | 0 | -40°C~85°C TA | Tray | 2009 | LPC3100 | e1 | Obsolete | 3 (168 Hours) | 180 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | LPC314* | 180 | S-PBGA-B180 | Not Qualified | 1.3V | 1.21.8/3.3V | 1.1V | External | 270MHz | 192K x 8 | 1.1V~3.6V | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, I2S, LCD, PWM, WDT | 25MHz | ROMless | 16/32-Bit | EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG | 32 | YES | YES | YES | NO | FLASH | 1.2mm | 12mm | 12mm | ROHS3 Compliant |