The category is 'Embedded - Microcontrollers'
- All Manufacturers
- Base Part Number
- Connectivity
- Core Processor
- Core Size
- ECCN Code
- HTS Code
- JESD-609 Code
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Number of I/Os
- Operating Temperature
- Oscillator Type
- Base Part Number:
MCF5475
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Connectivity | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No MCF5475ZP266 | NXP USA Inc. | Datasheet | 25 | - | Min: 1 Mult: 1 | Surface Mount | 388-BBGA | YES | 99 | 0°C~70°C TA | Tray | 2001 | MCF547x | e0 | Not For New Designs | 3 (168 Hours) | 388 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | unknown | 40 | MCF5475 | S-PBGA-B388 | Not Qualified | 1.58V | 1.43V | External | 266MHz | 32K x 8 | 1.43V~1.58V | MICROPROCESSOR, RISC | Coldfire V4E | DMA, PWM, WDT | 66.66MHz | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.55mm | 27mm | 27mm | Non-RoHS Compliant | ||
![]() | Mfr Part No MCF5475VR266 | NXP USA Inc. | Datasheet | 768 | - | Min: 1 Mult: 1 | 14 Weeks | Surface Mount | 388-BBGA | YES | 99 | 0°C~70°C TA | Tray | 2001 | MCF547x | e1 | Not For New Designs | 3 (168 Hours) | 388 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5475 | S-PBGA-B388 | Not Qualified | 1.58V | 1.43V | External | 266MHz | 32K x 8 | 1.43V~1.58V | MICROPROCESSOR, RISC | Coldfire V4E | DMA, PWM, WDT | 66.66MHz | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.55mm | 27mm | 27mm | ROHS3 Compliant | ||
![]() | Mfr Part No MCF5475VR200 | NXP USA Inc. | Datasheet | 8000 | - | Min: 1 Mult: 1 | 14 Weeks | Surface Mount | 388-BBGA | 99 | 0°C~70°C TA | Tray | 2001 | MCF547x | e1 | Not For New Designs | 3 (168 Hours) | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | 260 | 40 | MCF5475 | External | 200MHz | 32K x 8 | 1.43V~1.58V | Coldfire V4E | DMA, PWM, WDT | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | ROHS3 Compliant | ||||||||||||||||||||||||
![]() | Mfr Part No MCF5475ZP200 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 388-BBGA | 99 | 0°C~70°C TA | Tray | 2001 | MCF547x | e0 | Obsolete | 3 (168 Hours) | 5A002.A.1 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | 260 | unknown | 40 | MCF5475 | External | 200MHz | 32K x 8 | 1.43V~1.58V | Coldfire V4E | DMA, PWM, WDT | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | Non-RoHS Compliant |
MCF5475ZP266
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MCF5475VR266
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MCF5475VR200
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MCF5475ZP200
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
