The category is 'Embedded - Microcontrollers'
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- Connectivity
- Core Processor
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- Base Part Number:
MK10DN512
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | ROM(word) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | CPU Family | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No MK10DN512VLK10 | NXP USA Inc. | Datasheet | 768 | - | Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 80-LQFP | YES | A/D 31x16b; D/A 1x12b | 56 | 524288 | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK10DN512 | S-PQFP-G80 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M4 | 1.6mm | 12mm | 12mm | ROHS3 Compliant | |
 | Mfr Part No MK10DN512VLQ10 | NXP USA Inc. | Datasheet | 3158 | - | Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 144-LQFP | YES | A/D 46x16b; D/A 2x12b | 104 | 524288 | -40°C~105°C TA | Tray | 2012 | Kinetis K10 | e3 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK10DN512 | S-PQFP-G144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M4 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |
 | Mfr Part No MK10DN512VMD10 | NXP USA Inc. | Datasheet | 20800 | - | Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 144-LBGA | YES | A/D 46x16b; D/A 2x12b | 104 | 524288 | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e1 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK10DN512 | S-PBGA-B144 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M4 | 1.7mm | 13mm | 13mm | ROHS3 Compliant | |
 | Mfr Part No MK10DN512VMC10 | NXP USA Inc. | Datasheet | 400 | - | Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 121-LFBGA | YES | A/D 42x16b; D/A 2x12b | 90 | 524288 | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e1 | Active | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK10DN512 | S-PBGA-B121 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M4 | 1.52mm | 8mm | 8mm | ROHS3 Compliant | |
| Mfr Part No MK10DN512ZVMD10 | NXP USA Inc. | Datasheet | 2880 | - | Min: 1 Mult: 1 | 15 Weeks | Surface Mount | 144-LBGA | YES | A/D 46x16b; D/A 2x12b | 104 | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e1 | Not For New Designs | 3 (168 Hours) | 144 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3V | 1mm | 40 | MK10DN512 | S-PBGA-B144 | Not Qualified | 3.6V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | 1.7mm | 13mm | 13mm | ROHS3 Compliant | ||||
 | Mfr Part No MK10DN512ZVLL10 | NXP USA Inc. | Datasheet | 924 | - | Min: 1 Mult: 1 | 15 Weeks | Surface Mount | 100-LQFP | YES | A/D 37x16b; D/A 2x12b | 70 | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e3 | Not For New Designs | 3 (168 Hours) | 100 | 3A991.A.2 | MATTE TIN | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK10DN512 | S-PQFP-G100 | Not Qualified | 3.6V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | 1.7mm | 14mm | 14mm | ROHS3 Compliant | ||||
| Mfr Part No MK10DN512ZVLK10 | NXP USA Inc. | Datasheet | 87 | - | Min: 1 Mult: 1 | Surface Mount | 80-LQFP | YES | A/D 37x16b; D/A 1x12b | 56 | -40°C~105°C TA | Tray | 2013 | Kinetis K10 | e3 | Not For New Designs | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK10DN512 | S-PQFP-G80 | Not Qualified | 3.6V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | YES | YES | YES | YES | 12mm | 12mm | ROHS3 Compliant | |||||||
| Mfr Part No MK10DN512ZVLK10R | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 80-LQFP | YES | A/D 31x16b; D/A 1x12b | 56 | -40°C~105°C TA | Tape & Reel (TR) | 2012 | Kinetis K10 | e3 | Not For New Designs | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 40 | MK10DN512 | S-PQFP-G80 | Not Qualified | 3.6V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | 1.6mm | 14mm | 14mm | ROHS3 Compliant | |||||
| Mfr Part No MK10DN512VMC10R | NXP USA Inc. | Datasheet | 8004 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 121-LFBGA | YES | A/D 42x16b; D/A 2x12b | 90 | 524288 | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis K10 | e1 | Active | 3 (168 Hours) | 121 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK10DN512 | S-PBGA-B121 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M4 | 1.52mm | 8mm | 8mm | ROHS3 Compliant | |
| Mfr Part No MK10DN512ZVLL10R | NXP USA Inc. | Datasheet | 4 |
| Min: 1 Mult: 1 | Surface Mount | 100-LQFP | YES | A/D 37x16b; D/A 2x12b | 70 | -40°C~105°C TA | Tray | 2011 | Kinetis K10 | e3 | Not For New Designs | 3 (168 Hours) | 100 | 3A991.A.2 | MATTE TIN | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK10DN512 | S-PQFP-G100 | Not Qualified | 3.6V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | 1.7mm | 14mm | 14mm | ROHS3 Compliant | |||||
| Mfr Part No MK10DN512VLL10 | NXP USA Inc. | Datasheet | 2520 | - | Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 100-LQFP | YES | A/D 37x16b; D/A 1x12b | 70 | 524288 | -40°C~105°C TA | Tray | 2012 | Kinetis K10 | e3 | Active | 3 (168 Hours) | 100 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK10DN512 | S-PQFP-G100 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M4 | 1.7mm | 14mm | 14mm | ROHS3 Compliant | |
| Mfr Part No MK10DN512ZVLQ10 | NXP USA Inc. | Datasheet | 380 | - | Min: 1 Mult: 1 | Surface Mount | 144-LQFP | YES | A/D 46x16b; D/A 2x12b | 104 | -40°C~105°C TA | Tray | 2013 | Kinetis K10 | e3 | Not For New Designs | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3V | 0.5mm | 40 | MK10DN512 | S-PQFP-G144 | Not Qualified | 3.6V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||
| Mfr Part No MK10DN512ZVMC10 | NXP USA Inc. | Datasheet | 100 |
| Min: 1 Mult: 1 | Surface Mount | 121-LFBGA | YES | A/D 42x16b; D/A 2x12b | 90 | -40°C~105°C TA | Tray | 2013 | Kinetis K10 | e1 | Not For New Designs | 3 (168 Hours) | 121 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK10DN512 | S-PBGA-B121 | Not Qualified | 3.6V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | 1.52mm | 8mm | 8mm | ROHS3 Compliant | |||||
| Mfr Part No MK10DN512ZVMC10R | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 121-LFBGA | A/D 42x16b; D/A 2x12b | 90 | -40°C~105°C TA | Tape & Reel (TR) | 2013 | Kinetis K10 | Obsolete | 3 (168 Hours) | MK10DN512 | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | ROHS3 Compliant |
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MK10DN512VLK10
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MK10DN512VLQ10
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MK10DN512VMD10
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
MK10DN512VMC10
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
MK10DN512ZVMD10
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
MK10DN512ZVLL10
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
MK10DN512ZVLK10
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
MK10DN512ZVLK10R
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
MK10DN512VMC10R
NXP USA Inc.
Package:Embedded - Microcontrollers
17.723259
-
MK10DN512ZVLL10R
NXP USA Inc.
Package:Embedded - Microcontrollers
13.417378
-
MK10DN512VLL10
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
MK10DN512ZVLQ10
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
MK10DN512ZVMC10
NXP USA Inc.
Package:Embedded - Microcontrollers
13.941133
-
MK10DN512ZVMC10R
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire