The category is 'Embedded - Microcontrollers'
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- Base Part Number
- Bit Size
- CPU Family
- Connectivity
- Core Size
- Data Converters
- EEPROM Size
- Factory Lead Time
- HTS Code
- JESD-30 Code
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Base Part Number:
S9S12P32
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | EEPROM Size | CPU Family | Screening Level | External Data Bus Width | Height Seated (Max) | Length | Width | RoHS Status |
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 | Mfr Part No S9S12P32J0VFTR | NXP USA Inc. | Datasheet | 8004 |
| Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 48-TFQFN Exposed Pad | YES | A/D 10x12b | 34 | 32768 | Automotive grade | -40°C~105°C TA | Tape & Reel (TR) | 2006 | HCS12 | Active | 3 (168 Hours) | 48 | 8542.31.00.01 | QUAD | NO LEAD | 5V | 0.5mm | S9S12P32 | S-PQCC-N48 | Not Qualified | 5.5V | 1.83.3/5V | 3.13V | Internal | 32MHz | 2K x 8 | 1.72V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, SCI, SPI | 16 | YES | NO | YES | 4K x 8 | CPU12 | AEC-Q100 | 7mm | 7mm | ROHS3 Compliant | |||||||||
| Mfr Part No S9S12P32J0VFT | NXP USA Inc. | Datasheet | 1040 |
| Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 48-TFQFN Exposed Pad | YES | A/D 10x12b | 34 | 32768 | Automotive grade | -40°C~105°C TA | Tray | 2006 | HCS12 | e3 | Active | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | NO LEAD | 260 | 5V | 0.5mm | 40 | S9S12P32 | S-XQCC-N48 | Not Qualified | 5.5V | 1.83.3/5V | 3.13V | Internal | 32MHz | 2K x 8 | 1.72V~5.5V | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, SCI, SPI | 16 | YES | NO | YES | YES | 4K x 8 | CPU12 | AEC-Q100 | 16 | 1.05mm | 7mm | 7mm | ROHS3 Compliant | ||
| Mfr Part No S9S12P32J0CFT | NXP USA Inc. | Datasheet | 13 |
| Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 48-TFQFN Exposed Pad | YES | A/D 10x12b | 34 | 32768 | Automotive grade | -40°C~85°C TA | Tray | 2010 | HCS12 | Active | 3 (168 Hours) | 48 | 8542.31.00.01 | QUAD | NO LEAD | 0.5mm | S9S12P32 | S-PQCC-N48 | Not Qualified | 1.83.3/5V | Internal | 32MHz | 2K x 8 | 1.72V~5.5V | LVD, POR, PWM, WDT | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, SCI, SPI | 16 | 4K x 8 | CPU12 | AEC-Q100 | ROHS3 Compliant |