The category is 'Embedded - Microcontrollers'
Embedded - Microcontrollers (5951)
- All Manufacturers
- Connectivity
- Core Size
- Data Converters
- ECCN Code
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Number of I/Os
- Number of Terminations
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- ECCN Code:
3A991.A.2
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Weight | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Watchdog Timers | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Max Power Dissipation | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Memory Size | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Access Time | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | EEPROM Size | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | RAM (words) | Number of ADC Channels | Barrel Shifter | Internal Bus Architecture | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No MK10DX64VFM5 | NXP USA Inc. | Datasheet | 780 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 10x16b | 24 | 65536 | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | Active | 3 (168 Hours) | 32 | 3A991.A.2 | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MK10DX64 | S-XQCC-N32 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 1mm | 5mm | 5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
 | Mfr Part No DSPIC33FJ64GS406-E/PT | Microchip Technology | Datasheet | 8000 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 64-TQFP | YES | 64 | A/D 16x10b | 58 | Yes | -40°C~125°C TA | Tray | 2010 | Automotive, AEC-Q100, dsPIC™ 33F | e3 | yes | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 40MHz | 40 | DSPIC33FJ64GS406 | 64 | 3.3V | 3.6V | I2C, IrDA, LIN, SCI, SPI, UART, USART, USB | 64kB | Internal | 8K x 8 | 3V~3.6V | MICROCONTROLLER | dsPIC | Brown-out Detect/Reset, QEI, POR, PWM, WDT | FLASH | 16-Bit | 64KB 64K x 8 | I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB | 16 | YES | YES | 16b | YES | YES | 5 | PIC | 1.2mm | 10mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
 | Mfr Part No S912XET256J2VAGR | NXP USA Inc. | Datasheet | 289 |
| Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 144-LQFP | YES | A/D 24x12b | 119 | 262144 | -40°C~105°C TA | Tape & Reel (TR) | 2013 | HCS12X | e3 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.5mm | 40 | S912XET256 | S-PQFP-G144 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 16K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 16 | YES | YES | YES | 23 | 4K x 8 | CPU12 | 16 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC9S08MM128CLK | NXP USA Inc. | Datasheet | 20 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 80-LQFP | YES | A/D 8x16b; D/A 1x12b | 46 | 131072 | -40°C~85°C TA | Tray | 2010 | S08 | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 0.5mm | 40 | MC9S08MM128 | S-PQFP-G80 | Not Qualified | 2/3.3V | Internal | 48MHz | 12K x 8 | 1.8V~3.6V | LVD, POR, PWM, WDT | FLASH | 8-Bit | 128KB 128K x 8 | I2C, SCI, SPI, USB | 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No C165L25MHABXQMA1 | Infineon Technologies | Datasheet | - | - | Min: 1 Mult: 1 | Tin | Surface Mount | Surface Mount | 100-BQFP | 100 | 77 | Yes | 0°C~70°C TA | Tray | 1997 | C16xx | e3 | Obsolete | 3 (168 Hours) | 100 | 3A991.A.2 | 1.5W | QUAD | GULL WING | 25MHz | SA*C165 | 5V | EBI/EMI, SPI, UART, USART | 0B | External | 2K x 8 | 4.5V~5.5V | MICROCONTROLLER | C166 | POR, PWM, WDT | ROMless | 16-Bit | EBI/EMI, SPI, UART/USART | 16 | NO | NO | 16b | YES | NO | 5 | 24 | 3.4mm | 20mm | No | RoHS Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No PIC32MX170F256B-V/ML | Microchip Technology | Datasheet | 2640 |
| Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 28-VQFN Exposed Pad | YES | 44 | 369.989626mg | A/D 10x10b | 21 | Automotive grade | Yes | -40°C~105°C TA | Tube | 2014 | Automotive, AEC-Q100, PIC® 32MX | e3 | Active | 1 (Unlimited) | 28 | 3A991.A.2 | Matte Tin (Sn) - annealed | QUAD | NO LEAD | 260 | 3.3V | 40MHz | 40 | PIC32MX170F256B | S-PQCC-N28 | 3.6V | I2C, I2S, IrDA, LIN, SPI, UART, USART, USB | 256kB | Internal | 64K x 8 | 2.3V~3.6V | MICROCONTROLLER, RISC | MIPS32® M4K™ | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | FLASH | 32-Bit | 256KB 256K x 8 | I2C, IrDA, LINbus, SPI, UART/USART | 32 | YES | YES | 32b | YES | 5 | PIC | 8 | TS 16949 | 13 | 1mm | 6mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
 | Mfr Part No MK60DX256ZVMD10 | NXP USA Inc. | Datasheet | 29 |
| Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | A/D 42x16b; D/A 2x12b | 100 | -40°C~105°C TA | Tray | 2002 | Kinetis K60 | e1 | Not For New Designs | 3 (168 Hours) | 144 | 3A991.A.2 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.5mm | 40 | MK60DX256 | S-PBGA-B144 | Not Qualified | 3.6V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 4K x 8 | 1.7mm | 13mm | 13mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MKV10Z64VLH7P | NXP USA Inc. | Datasheet | 8 | - | Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 2x16b; D/A 1x12b | 54 | -40°C~105°C TA | Tray | 2002 | Kinetis KV | Active | 3 (168 Hours) | 64 | 3A991.A.2 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | compliant | NOT SPECIFIED | 3.6V | 1.71V | Internal | 75MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LVD, POR, WDT | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | YES | YES | NO | 10mm | 10mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC56F8146VFVE | NXP USA Inc. | Datasheet | 7 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 144-LQFP | YES | A/D 16x12b | 62 | 131072 | -40°C~105°C TA | Tray | 1998 | 56F8xxx | e3 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 2.5V | 0.5mm | 40 | MC56F8146 | S-PQFP-G144 | Not Qualified | 2.75V | 2.53.3V | 2.25V | External | 40MHz | 4K x 16 | 2.25V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, PWM, WDT | 120MHz | FLASH | 16-Bit | 128KB 64K x 16 | EBI/EMI, SCI, SPI | 16 | 17 | YES | YES | 16 | FIXED POINT | YES | MULTIPLE | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
 | Mfr Part No DSPIC33EP64MC202-I/SO | Microchip Technology | Datasheet | 1 |
| Min: 1 Mult: 1 | 20 Weeks | Surface Mount | 28-SOIC (0.295, 7.50mm Width) | YES | 28 | A/D 6x10b/12b | 21 | Yes | -40°C~85°C TA | Tube | 2011 | dsPIC™ 33EP | e3 | Active | 1 (Unlimited) | 28 | 3A991.A.2 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 250 | 3.3V | 1.27mm | 70MHz | 40 | DSPIC33EP64MC202 | 28 | 3.3V | 3.6V | I2C, IrDA, LIN, SPI, UART, USART | 64kB | Internal | 4K x 16 | 3V~3.6V | MICROCONTROLLER | dsPIC | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT | FLASH | 16-Bit | 64KB 22K x 24 | I2C, IrDA, LINbus, QEI, SPI, UART/USART | 16 | YES | YES | 16b | YES | NO | 5 | 24 | FLOATING-POINT | 4096 | 17.9mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
 | Mfr Part No MC9S08AC48CFDE | NXP USA Inc. | Datasheet | 13 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 8x10b | 38 | 49152 | -40°C~85°C TA | Tray | 2000 | S08 | Active | 3 (168 Hours) | 48 | 3A991.A.2 | 8542.31.00.01 | QUAD | NO LEAD | 260 | 5V | 0.5mm | 40 | MC9S08AC48 | S-XQCC-N48 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 48KB 48K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No PIC18LF2682-I/SP | Microchip Technology | Datasheet | 20 |
| Min: 1 Mult: 1 | 6 Weeks | Through Hole | Through Hole | 28-DIP (0.300, 7.62mm) | 28 | A/D 8x10b | 25 | Yes | -40°C~85°C TA | Tube | PIC® 18F | e3 | yes | Active | 1 (Unlimited) | 28 | 3A991.A.2 | Matte Tin (Sn) | 1W | DUAL | 3V | 40MHz | PIC18LF2682 | 28 | 5.5V | 2.5/5V | 2V | CAN, I2C, SPI, UART, USART | 80kB | Internal | 3.25K x 8 | 2V~5.5V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | FLASH | 8-Bit | 80KB 40K x 16 | CANbus, I2C, SPI, UART/USART | 8 | 40 μs | YES | NO | 8b | YES | NO | 4 | 1K x 8 | 16 | PIC | 5.08mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||
 | Mfr Part No STR751FR0T6 | STMicroelectronics | Datasheet | 5160 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 64-LQFP | 64 | A/D 11x10b | 38 | Yes | -40°C~85°C TA | Tray | STR7 | e4 | Obsolete | 3 (168 Hours) | 64 | 3A991.A.2 | Nickel/Palladium/Gold (Ni/Pd/Au) | ALSO OPERATES AT 3V MINIMUM SUPPLY | 8542.31.00.01 | 444mW | QUAD | GULL WING | 260 | 5V | 0.5mm | 60MHz | STR751 | 64 | 3.3V | 5.5V | CAN, I2C, SPI, SSP, UART, USART, USB | 64kB | Internal | 48 MHz | 16K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | ARM7® | DMA, PWM, WDT | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, SSI, SSP, UART/USART, USB | 32 | 60 μs | YES | YES | 32b | YES | NO | 6 | ARM | 8 | 10mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||
| Mfr Part No S912XET256J2MAGR | NXP USA Inc. | Datasheet | 29 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 144-LQFP | YES | A/D 24x12b | 119 | 16384 | 262144 | -40°C~125°C TA | Tape & Reel (TR) | 1996 | HCS12X | e3 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.5mm | 40 | S-PQFP-G144 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 16K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 16 | YES | YES | YES | 23 | 4K x 8 | CPU12 | 16 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
| Mfr Part No PIC18F2420-E/SP | Microchip Technology | Datasheet | 21 | - | Min: 1 Mult: 1 | 6 Weeks | Through Hole | Through Hole | 28-DIP (0.300, 7.62mm) | 28 | A/D 10x10b | 25 | 8192 | Yes | -40°C~125°C TA | Tube | 2002 | PIC® 18F | e3 | yes | Active | 1 (Unlimited) | 28 | 3A991.A.2 | Matte Tin (Sn) | 1W | DUAL | 5V | 25MHz | PIC18F2420 | 28 | 5V | 5V | I2C, SPI, UART, USART | 16kB | Internal | 768 x 8 | 4.2V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | FLASH | 8-Bit | 16KB 8K x 16 | I2C, SPI, UART/USART | 20mA | 8 | 40 μs | YES | NO | 8b | YES | NO | 4 | 256 x 8 | 16 | PIC | 5.08mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||
 | Mfr Part No MC9S08AC96MLKE | NXP USA Inc. | Datasheet | 16 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 80-LQFP | YES | A/D 16x10b | 69 | 98304 | -40°C~125°C TA | Tray | 2011 | S08 | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 5V | 0.65mm | 40 | MC9S08AC96 | S-PQFP-G80 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 6K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 96KB 96K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No SPC5643LF2MLQ8R | NXP USA Inc. | Datasheet | 16 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 144-LQFP | YES | A/D 32x12b | -40°C~125°C TA | Tape & Reel (TR) | 2007 | MPC56xx Qorivva | Active | 3 (168 Hours) | 144 | 3A991.A.2 | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | SPC5643 | 3.63V | 3V | Internal | 80MHz | 128K x 8 | 3V~5.5V | MICROCONTROLLER | e200z4 | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 1MB 1M x 8 | CANbus, FlexRay, LINbus, SPI, UART/USART | 32 | YES | YES | YES | 32 | 64 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC9S08QA4CPAE | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | Through Hole | 8-DIP (0.300, 7.62mm) | NO | A/D 4x10b | 4 | -40°C~85°C TA | Tube | 2005 | S08 | e3 | Active | Not Applicable | 8 | 3A991.A.2 | Matte Tin (Sn) | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | MC9S08QA4 | R-PDIP-T8 | Not Qualified | 3.6V | 2/3.3V | 1.8V | Internal | 20MHz | 256 x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 4KB 4K x 8 | 8 | YES | NO | YES | NO | 7.62mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No STM32F303VEH6TR | STMicroelectronics | Datasheet | 6 |
| Min: 1 Mult: 1 | 10 Weeks | ACTIVE (Last Updated: 7 months ago) | Surface Mount | 100-UFBGA | YES | A/D 39x12b; D/A 2x12b | 84 | 524288 | -40°C~85°C TA | Tape & Reel (TR) | STM32F3 | Active | 3 (168 Hours) | 100 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | STM32F303 | S-PBGA-B100 | Not Qualified | 3.6V | 2.5/3.3V | 2V | Internal | 72MHz | 80K x 8 | 2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, IrDA, LINbus, SPI, UART/USART, USB | 76.9mA | 32 | YES | YES | YES | 24 | CORTEX-M4F | 32 | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
 | Mfr Part No PIC24HJ128GP502-E/MM | Microchip Technology | Datasheet | 16 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | Surface Mount | 28-VQFN Exposed Pad | 28 | A/D 10x10b/12b | 21 | 131072 | Yes | -40°C~125°C TA | Tube | Automotive, AEC-Q100, PIC® 24H | e3 | yes | Active | 1 (Unlimited) | 28 | 3A991.A.2 | Matte Tin (Sn) - annealed | QUAD | 260 | 3.3V | 40MHz | 40 | PIC24HJ128GP502 | 28 | 3.3V | 3.6V | CAN, I2C, IrDA, LIN, SPI, UART, USART | 128kB | Internal | 8K x 8 | 3V~3.6V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 16-Bit | 128KB 43K x 24 | CANbus, I2C, IrDA, LINbus, PMP, SPI, UART/USART | 76mA | 16 | YES | YES | 16b | YES | NO | 5 | PIC | 1mm | 6mm | No | ROHS3 Compliant |
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MK10DX64VFM5
NXP USA Inc.
Package:Embedded - Microcontrollers
5.056424
-
DSPIC33FJ64GS406-E/PT
Microchip Technology
Package:Embedded - Microcontrollers
Price: please inquire
-
S912XET256J2VAGR
NXP USA Inc.
Package:Embedded - Microcontrollers
17.615002
-
MC9S08MM128CLK
NXP USA Inc.
Package:Embedded - Microcontrollers
10.476178
-
C165L25MHABXQMA1
Infineon Technologies
Package:Embedded - Microcontrollers
Price: please inquire
-
PIC32MX170F256B-V/ML
Microchip Technology
Package:Embedded - Microcontrollers
5.931580
-
MK60DX256ZVMD10
NXP USA Inc.
Package:Embedded - Microcontrollers
16.463131
-
MKV10Z64VLH7P
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
MC56F8146VFVE
NXP USA Inc.
Package:Embedded - Microcontrollers
43.217790
-
DSPIC33EP64MC202-I/SO
Microchip Technology
Package:Embedded - Microcontrollers
2.755768
-
MC9S08AC48CFDE
NXP USA Inc.
Package:Embedded - Microcontrollers
6.940788
-
PIC18LF2682-I/SP
Microchip Technology
Package:Embedded - Microcontrollers
11.907338
-
STR751FR0T6
STMicroelectronics
Package:Embedded - Microcontrollers
Price: please inquire
-
S912XET256J2MAGR
NXP USA Inc.
Package:Embedded - Microcontrollers
18.406513
-
PIC18F2420-E/SP
Microchip Technology
Package:Embedded - Microcontrollers
Price: please inquire
-
MC9S08AC96MLKE
NXP USA Inc.
Package:Embedded - Microcontrollers
8.743413
-
SPC5643LF2MLQ8R
NXP USA Inc.
Package:Embedded - Microcontrollers
40.108825
-
MC9S08QA4CPAE
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
STM32F303VEH6TR
STMicroelectronics
Package:Embedded - Microcontrollers
11.596790
-
PIC24HJ128GP502-E/MM
Microchip Technology
Package:Embedded - Microcontrollers
5.348312