The category is 'Embedded - Microcontrollers'
Embedded - Microcontrollers (5951)
- All Manufacturers
- Connectivity
- Core Size
- Data Converters
- ECCN Code
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Number of I/Os
- Number of Terminations
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- ECCN Code:
3A991.A.2
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Data Converters | Number of I/Os | ROM(word) | Usage Level | Watchdog Timers | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Max Power Dissipation | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Memory Size | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Access Time | Has ADC | DMA Channels | Data Bus Width | PWM Channels | Halogen Free | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | EEPROM Size | On Chip Program ROM Width | CPU Family | Screening Level | External Data Bus Width | Number of Programmable I/O | Format | RAM (words) | Number of ADC Channels | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No MCF52232AF50 | NXP USA Inc. | Datasheet | 25 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 80-LQFP | YES | A/D 8x12b | 56 | 131072 | 0°C~70°C TA | Tray | 2004 | MCF5223x | e3 | Active | 3 (168 Hours) | 80 | 3A991.A.2 | MATTE TIN | ALSO OPERATES AT 3V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 40 | MCF52232 | S-PQFP-G80 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 50MHz | 32K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | Ethernet, I2C, SPI, UART/USART | 32 | YES | YES | YES | NO | 1.6mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||
 | Mfr Part No SPC5674FK0MVY3 | NXP USA Inc. | Datasheet | 6920 | - | Min: 1 Mult: 1 | 14 Weeks | Surface Mount | 516-BBGA | YES | A/D 64x12b | 32 | 4194304 | Automotive grade | -40°C~125°C TA | Tray | 2008 | MPC56xx Qorivva | e2 | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | SPC5674 | S-PBGA-B516 | Not Qualified | 1.23.35V | 1.14V | External | 264MHz | 256K x 8 | 1.08V~5.25V | MICROCONTROLLER, RISC | e200z7 | DMA, POR, PWM | 40MHz | FLASH | 32-Bit | 4MB 4M x 8 | CANbus, EBI/EMI, SCI, SPI | 850mA | 32 | YES | YES | YES | NO | 32 | AEC-Q100 | 32 | 2.55mm | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||
 | Mfr Part No SPC560C50L3C6E0Y | STMicroelectronics | Datasheet | 32000 |
| Min: 1 Mult: 1 | 26 Weeks | Surface Mount | 100-LQFP | YES | 100 | A/D 28x10b | 79 | 524288 | Yes | -40°C~125°C TA | Tray | Automotive, AEC-Q100, SPC56 | Active | 3 (168 Hours) | 100 | 3A991.A.2 | 8542.31.00.01 | QUAD | GULL WING | 3.3V | 0.5mm | 64MHz | SPC560C | 100 | 3.6V | 3.3/5V | 3V | CAN, I2C, LIN, SCI, SPI | 512kB | Internal | 48K x 8 | 3V~5.5V | MICROCONTROLLER | e200z0h | DMA, POR, PWM, WDT | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | YES | 32b | YES | NO | 10 | 8 | 1.6mm | 14mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||
 | Mfr Part No PIC24HJ32GP302T-I/MM | Microchip Technology | Datasheet | 2560 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | Surface Mount | 28-VQFN Exposed Pad | 28 | A/D 10x10b/12b | 21 | 32768 | -40°C~85°C TA | Tape & Reel (TR) | 2008 | PIC® 24H | e3 | yes | Active | 1 (Unlimited) | 28 | 3A991.A.2 | Matte Tin (Sn) - annealed | QUAD | 260 | 3.3V | 20MHz | 40 | PIC24HJ32GP302 | 28 | 3.3V | 3.6V | I2C, SPI, UART, USART | 32kB | Internal | 40 MHz | 4K x 8 | 3V~3.6V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 16-Bit | 32KB 11K x 24 | I2C, PMP, SPI, UART/USART | 16 | YES | YES | 16b | YES | NO | 5 | AVR | PIC | 1mm | 6mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||
 | Mfr Part No PIC16F1938T-E/SS | Microchip Technology | Datasheet | 3360 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 28-SSOP (0.209, 5.30mm Width) | YES | A/D 11x10b | 25 | 16384 | -40°C~125°C TA | Tape & Reel (TR) | 2009 | PIC® XLP™ 16F | e3 | yes | Active | 1 (Unlimited) | 28 | 3A991.A.2 | Matte Tin (Sn) - annealed | ALSO OPERATES AT 1.8V MINIMUM SUPPLY FOR 16 MHZ | 8542.31.00.01 | DUAL | GULL WING | 260 | 3.3V | 0.65mm | 32MHz | 40 | PIC16F1938 | 28 | R-PDSO-G28 | Not Qualified | 5.5V | 2/5V | 2.5V | I2C, LIN, SPI, UART, USART | 28kB | Internal | 1K x 8 | 1.8V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, LCD, POR, PWM, WDT | FLASH | 8-Bit | 28KB 16K x 14 | I2C, LINbus, SPI, UART/USART | 8mA | 8 | YES | NO | YES | YES | 256 x 8 | 14 | PIC | 2mm | 10.2mm | 5.3mm | ROHS3 Compliant | |||||||||||||||||||||||
 | Mfr Part No MC56F82733VFM | NXP USA Inc. | Datasheet | 1568 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 6x12b; D/A 2x12b | 26 | 49152 | -40°C~105°C TA | Tray | 2002 | 56F8xxx | Active | 3 (168 Hours) | 32 | 3A991.A.2 | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MC56F82733 | S-XQCC-N32 | Not Qualified | 3.6V | 3.3V | 2.7V | Internal | 100MHz | 4K x 16 | 2.7V~3.6V | MICROCONTROLLER | 56800EX | DMA, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 48KB 24K x 16 | I2C, SCI, SPI | 32 | YES | YES | YES | YES | 5mm | 5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
 | Mfr Part No XC2765X104F80LAAKXUMA1 | Infineon Technologies | Datasheet | - | - | Min: 1 Mult: 1 | 17 Weeks | Surface Mount | Surface Mount | 100-LQFP Exposed Pad | 100 | A/D 16x10b | 75 | Yes | -40°C~125°C TA | Tape & Reel (TR) | 2011 | XC27x5X | Obsolete | 3 (168 Hours) | 100 | 3A991.A.2 | 1W | QUAD | GULL WING | 260 | 80MHz | NOT SPECIFIED | SA*XC2765X | CAN, EBI/EMI, I2C, I2S, LIN, SPI, UART, USART | 832kB | Internal | 50K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | C166SV2 | I2S, POR, PWM, WDT | FLASH | 16/32-Bit | 832KB 832K x 8 | CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI | 32 | YES | NO | YES | Halogen Free | NO | 5 | 24 | 16 | 74 | 1.6mm | 14mm | 14mm | RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||
 | Mfr Part No S9S12XS64J1CAE | NXP USA Inc. | Datasheet | 40 |
| Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 64-LQFP | YES | A/D 8x12b | 44 | 65536 | Automotive grade | -40°C~85°C TA | Tray | 2008 | HCS12X | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.5mm | 40 | S9S12XS64 | S-PQFP-G64 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 40MHz | 4K x 8 | 1.72V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, SCI, SPI | 16 | YES | NO | YES | YES | CPU12 | AEC-Q100 | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||
| Mfr Part No S9S08RN60W1MLH | NXP USA Inc. | Datasheet | 40 |
| Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 64-LQFP | A/D 16x12b | 55 | -40°C~125°C TA | Tray | 2012 | S08 | e3 | Active | 3 (168 Hours) | 3A991.A.2 | MATTE TIN | 8542.31.00.01 | 260 | 40 | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROPROCESSOR | LVD, POR, PWM, WDT | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SPI, UART/USART | 256 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No PIC18F2523T-I/SO | Microchip Technology | Datasheet | 20 |
| Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 28-SOIC (0.295, 7.50mm Width) | 28 | A/D 10x12b | 25 | Yes | -40°C~85°C TA | Tape & Reel (TR) | 2005 | PIC® 18F | e3 | yes | Active | 1 (Unlimited) | 28 | 3A991.A.2 | Matte Tin (Sn) | 1W | DUAL | GULL WING | 250 | 5V | 1.27mm | 40MHz | 40 | PIC18F2523 | 28 | 5.5V | 5V | I2C, SPI, UART, USART | 32kB | Internal | 1.5K x 8 | 4.2V~5.5V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | FLASH | 8-Bit | 32KB 16K x 16 | I2C, SPI, UART/USART | 8 | YES | NO | 8b | YES | NO | 4 | 256 x 8 | 16 | PIC | 2.65mm | 17.9mm | No | ROHS3 Compliant | |||||||||||||||||||||||||
| Mfr Part No MKL26Z128VLH4R | NXP USA Inc. | Datasheet | 987 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D - 16bit; D/A - 12bit | 50 | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis KL2 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | 3.6V | 1.71V | Internal | 48MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No MK12DN512VLH5R | NXP USA Inc. | Datasheet | 27 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 22x16b; D/A 1x12b | 44 | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis K10 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | S-PQFP-G64 | 3.6V | 1.71V | Internal | 50MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | YES | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
 | Mfr Part No MK50DN512ZCLL10 | NXP USA Inc. | Datasheet | 27 |
| Min: 1 Mult: 1 | 15 Weeks | Surface Mount | 100-LQFP | YES | A/D 34x16b; D/A 2x12b | 59 | -40°C~85°C TA | Tray | 2002 | Kinetis K50 | e3 | Not For New Designs | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK50DN512 | S-PQFP-G100 | Not Qualified | 3.6V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 1.7mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
 | Mfr Part No PIC18F4510T-I/ML | Microchip Technology | Datasheet | 39 | - | Min: 1 Mult: 1 | 15 Weeks | Surface Mount | Surface Mount | 44-VQFN Exposed Pad | 44 | A/D 13x10b | 36 | Yes | -40°C~85°C TA | Tape & Reel (TR) | 2005 | PIC® 18F | e3 | yes | Active | 1 (Unlimited) | 44 | 3A991.A.2 | Matte Tin (Sn) | 1W | QUAD | 260 | 5V | 0.65mm | 40MHz | 40 | PIC18F4510 | 44 | 5V | 5V | I2C, SPI, UART, USART | 32kB | Internal | 1.5K x 8 | 4.2V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | FLASH | 8-Bit | 32KB 16K x 16 | I2C, SPI, UART/USART | 8 | 40 μs | YES | NO | 8b | YES | NO | 4 | 16 | PIC | 1mm | 8mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||
| Mfr Part No DSPIC33EP32GP502-E/SS | Microchip Technology | Datasheet | 16 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | Surface Mount | 28-SSOP (0.209, 5.30mm Width) | 28 | A/D 6x10b/12b | 21 | 10922 | Yes | -40°C~125°C TA | Tube | 2012 | Automotive, AEC-Q100, dsPIC™ 33EP | e3 | Active | 1 (Unlimited) | 28 | 3A991.A.2 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 60MHz | 40 | DSPIC33EP32GP502 | 28 | 3.3V | 3.6V | CAN, I2C, IrDA, LIN, SPI, UART, USART | 32kB | Internal | 2K x 16 | 3V~3.6V | MICROCONTROLLER | dsPIC | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 16-Bit | 32KB 10.7K x 24 | CANbus, I2C, IrDA, LINbus, SPI, UART/USART | 16 | YES | YES | 16b | YES | NO | 5 | 24 | FLOATING-POINT | 2048 | 2mm | 10.2mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||
 | Mfr Part No PIC24FJ192GB106-I/MR | Microchip Technology | Datasheet | 25 |
| Min: 1 Mult: 1 | 9 Weeks | Surface Mount | Surface Mount | 64-VFQFN Exposed Pad | 64 | A/D 16x10b | 51 | 196608 | Yes | -40°C~85°C TA | Tube | 2009 | PIC® 24F | e3 | yes | Active | 1 (Unlimited) | 64 | 3A991.A.2 | Matte Tin (Sn) - annealed | QUAD | 260 | 2.5V | 32MHz | 40 | PIC24FJ192GB106 | 64 | I2C, SPI, UART, USART, USB | 192kB | Internal | 16K x 8 | 2V~3.6V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, LVD, POR, PWM, WDT | FLASH | 16-Bit | 192KB 65.5K x 24 | I2C, SPI, UART/USART, USB OTG | 24mA | 16 | YES | NO | 16b | YES | 5 | 8 | PIC | 52 | 16 | 1mm | 9mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||
| Mfr Part No PIC18F4685T-I/ML | Microchip Technology | Datasheet | 799999 |
| Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 44-VQFN Exposed Pad | 44 | A/D 11x10b | 36 | Yes | -40°C~85°C TA | Tape & Reel (TR) | 2007 | PIC® 18F | e3 | yes | Active | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | 1W | QUAD | 260 | 5V | 0.65mm | 40MHz | 40 | PIC18F4685 | 44 | 5V | 5V | CAN, I2C, SPI, UART, USART | 96kB | Internal | 3.25K x 8 | 4.2V~5.5V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | FLASH | 8-Bit | 96KB 48K x 16 | CANbus, I2C, SPI, UART/USART | 8 | 40 μs | YES | NO | 8b | YES | NO | 4 | 1K x 8 | 16 | PIC | 1mm | 8mm | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||
 | Mfr Part No PIC18F8527T-I/PT | Microchip Technology | Datasheet | 9 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 80-TQFP | 80 | A/D 16x10b | 70 | Yes | -40°C~85°C TA | Tape & Reel (TR) | 2006 | PIC® 18F | e3 | yes | Active | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | 1W | QUAD | GULL WING | 260 | 5V | 40MHz | 40 | PIC18F8527 | 80 | 5V | 5V | EBI/EMI, I2C, SPI, UART, USART | 48kB | Internal | 3.8K x 8 | 4.2V~5.5V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | FLASH | 8-Bit | 48KB 24K x 16 | EBI/EMI, I2C, SPI, UART/USART | 8 | 40 μs | YES | NO | 8b | YES | NO | 5 | 20 | 1K x 8 | 16 | PIC | 1.2mm | 12mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||
 | Mfr Part No S912XEP100J5MAG | NXP USA Inc. | Datasheet | 3200 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 144-LQFP | YES | A/D 24x12b | 119 | 1048576 | -40°C~125°C TA | Tray | 1996 | HCS12X | e3 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.5mm | 40 | S912XEP100 | S-PQFP-G144 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 64K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 16 | YES | YES | YES | 23 | 4K x 8 | CPU12 | 16 | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||
 | Mfr Part No PIC16CE625-20I/SO | Microchip Technology | Datasheet | 6 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 18-SOIC (0.295, 7.50mm Width) | YES | 44 | 13 | Yes | -40°C~85°C TA | Tube | 1999 | PIC® 16C | e3 | yes | Active | 1 (Unlimited) | 18 | 3A991.A.2 | Matte Tin (Sn) - annealed | 1W | DUAL | GULL WING | 260 | 5V | 1.27mm | 20MHz | 40 | PIC16CE625 | 18 | 5.5V | 5V | 4.5V | I2C, SPI, USART | 3.5kB | External | 128 x 8 | 3V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, WDT | OTP | 8-Bit | 3.5KB 2K x 14 | 7.5mA | 8 | 20 μs | NO | NO | 8b | NO | NO | 8 | 128 x 8 | 14 | PIC | 2.64mm | 11.53mm | No | ROHS3 Compliant | Lead Free |
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MCF52232AF50
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
SPC5674FK0MVY3
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
SPC560C50L3C6E0Y
STMicroelectronics
Package:Embedded - Microcontrollers
10.332064
-
PIC24HJ32GP302T-I/MM
Microchip Technology
Package:Embedded - Microcontrollers
6.196313
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PIC16F1938T-E/SS
Microchip Technology
Package:Embedded - Microcontrollers
3.186876
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MC56F82733VFM
NXP USA Inc.
Package:Embedded - Microcontrollers
10.070510
-
XC2765X104F80LAAKXUMA1
Infineon Technologies
Package:Embedded - Microcontrollers
Price: please inquire
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S9S12XS64J1CAE
NXP USA Inc.
Package:Embedded - Microcontrollers
6.833808
-
S9S08RN60W1MLH
NXP USA Inc.
Package:Embedded - Microcontrollers
4.249819
-
PIC18F2523T-I/SO
Microchip Technology
Package:Embedded - Microcontrollers
9.518551
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MKL26Z128VLH4R
NXP USA Inc.
Package:Embedded - Microcontrollers
10.891187
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MK12DN512VLH5R
NXP USA Inc.
Package:Embedded - Microcontrollers
11.422957
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MK50DN512ZCLL10
NXP USA Inc.
Package:Embedded - Microcontrollers
12.448598
-
PIC18F4510T-I/ML
Microchip Technology
Package:Embedded - Microcontrollers
Price: please inquire
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DSPIC33EP32GP502-E/SS
Microchip Technology
Package:Embedded - Microcontrollers
Price: please inquire
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PIC24FJ192GB106-I/MR
Microchip Technology
Package:Embedded - Microcontrollers
4.945071
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PIC18F4685T-I/ML
Microchip Technology
Package:Embedded - Microcontrollers
13.539726
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PIC18F8527T-I/PT
Microchip Technology
Package:Embedded - Microcontrollers
13.805377
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S912XEP100J5MAG
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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PIC16CE625-20I/SO
Microchip Technology
Package:Embedded - Microcontrollers
Price: please inquire