The category is 'Embedded - Microcontrollers'
Embedded - Microcontrollers (5951)
- All Manufacturers
- Connectivity
- Core Size
- Data Converters
- ECCN Code
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Number of I/Os
- Number of Terminations
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- ECCN Code:
3A991.A.2
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Data Converters | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Memory Types | Mfr | Moisture Sensitivity Levels | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | RAM(byte) | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | ROM(word) | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Usage Level | Watchdog Timers | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Max Power Dissipation | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Access Time | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Seated Height-Max | Number of Timers/Counters | Address Bus Width | Core Architecture | EEPROM Size | On Chip Program ROM Width | CPU Family | Max Frequency | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Number of Programmable I/O | Format | Integrated Cache | RAM (words) | Number of ADC Channels | Number of Serial I/Os | Number of External Interrupts | On Chip Data RAM Width | Number of DMA Channels | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No DSPIC33FJ128MC204-E/ML | Microchip Technology | Datasheet | 12 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 44-VQFN Exposed Pad | 44 | A/D 9x10b/12b | 35 | 43690 | Yes | -40°C~125°C TA | Tube | 2009 | Automotive, AEC-Q100, dsPIC™ 33F | e3 | yes | Active | 1 (Unlimited) | 44 | 3A991.A.2 | Matte Tin (Sn) - annealed | QUAD | 260 | 3.3V | 40MHz | 40 | DSPIC33FJ128MC204 | 44 | 3.3V | 3.6V | I2C, IrDA, LIN, SPI, UART, USART | 128kB | Internal | 8K x 8 | 3V~3.6V | MICROCONTROLLER | dsPIC | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT | FLASH | 16-Bit | 128KB 128K x 8 | I2C, IrDA, LINbus, SPI, UART/USART | 16 | YES | YES | 16b | YES | YES | 5 | 24 | YES | YES | FLOATING-POINT | NO | 4096 | 2 | 3 | 16 | 8 | 1mm | 8mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No S9S12XS128J1VAE | NXP USA Inc. | Datasheet | 129 |
| Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 64-LQFP | YES | A/D 8x12b | 59 | 8192 | 131072 | Automotive grade | -40°C~105°C TA | Tray | 2004 | HCS12X | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.5mm | 40 | S-PQFP-G64 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 40MHz | 8K x 8 | 1.72V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | 16 | YES | NO | YES | YES | CPU12 | AEC-Q100 | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No DSPIC33FJ128GP202T-I/SO | Microchip Technology | Datasheet | 29 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 28-SOIC (0.295, 7.50mm Width) | 28 | A/D 10x10b/12b | 21 | Yes | -40°C~85°C TA | Tape & Reel (TR) | 2009 | dsPIC™ 33F | e3 | yes | Active | 1 (Unlimited) | 28 | 3A991.A.2 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 250 | 3.3V | 1.27mm | 40MHz | 40 | DSPIC33FJ128GP202 | 28 | 3.3V | 3.6V | I2C, IrDA, LIN, SPI, UART, USART | 128kB | Internal | 8K x 8 | 3V~3.6V | MICROCONTROLLER | dsPIC | AC'97, Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | I2C, IrDA, LINbus, SPI, UART/USART | 16 | YES | YES | 16b | YES | YES | 5 | FLOATING-POINT | 4096 | 17.9mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No PIC24FV32KA302T-I/ML | Microchip Technology | Datasheet | 2560 |
| Min: 1 Mult: 1 | 14 Weeks | Tin | Surface Mount | Surface Mount | 28-VQFN Exposed Pad | 28 | A/D 13x12b | 23 | 32768 | Yes | -40°C~85°C TA | Tape & Reel (TR) | 2011 | PIC® XLP™ 24F | e3 | Active | 1 (Unlimited) | 28 | 3A991.A.2 | OPERATES WITH 2 V MINIMUM SUPPLY AT 8 MHZ | QUAD | 260 | 3.3V | 32MHz | 40 | PIC24FV32KA302 | 28 | 3.2V | I2C, IrDA, LIN, SPI, UART, USART | 32kB | Internal | 2K x 8 | 2V~5.5V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | FLASH | 16-Bit | 32KB 11K x 24 | I2C, IrDA, LINbus, SPI, UART/USART | 20mA | 16 | YES | NO | 16b | YES | NO | 5 | 512 x 8 | PIC | 1mm | 6mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No HD6417751RBP240V | Renesas | Datasheet | 2641 | - | Min: 1 Mult: 1 | 1 Week | Surface Mount | Surface Mount | BGA | YES | 256 | 256-BGA (27x27) | 256 | HD6417751 | 34 MHz | - | RENESAS TECHNOLOGY CORP | Renesas Electronics Corporation | HD6417751RBP240V | ROMless | Renesas Electronics America Inc | 3 | 69 | 75 °C | -20 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | BGA | Active | 20 | 4.03 | Yes | 1.6 V | 1.4 V | 1.5 V | -20°C ~ 75°C (TA) | SuperH® SH7750 | e1 | Yes | 3A991.A.2 | TIN SILVER COPPER | 75 °C | -40 °C | 8542.31.00.01 | CMOS | BOTTOM | BALL | 260 | 1.27 mm | unknown | 240 MHz | 256 | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL EXTENDED | CAN, EBI/EMI, I2C, MMC, SCI, SPI, Serial, USB | 1.6 V | 1.4 V | Internal | 240MHz | 32 kB | 1.4V ~ 1.6V | MICROPROCESSOR, RISC | SH-4 | DMA, LCD, POR, WDT | ROMless | 32-Bit Single-Core | - | EBI/EMI, FIFO, SCI, SmartCard | 32 | 240 µs | 32 b | 2.1 mm | 5 | 26 | - | 240 MHz | YES | YES | 32 | 32 | FLOATING POINT | YES | 27 mm | 27 mm | No | RoHS Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC56F82723VFM | NXP USA Inc. | Datasheet | 960 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 6x12b; D/A 2x12b | 26 | 32768 | -40°C~105°C TA | Tray | 2002 | 56F8xxx | Active | 3 (168 Hours) | 32 | 3A991.A.2 | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MC56F82723 | S-XQCC-N32 | Not Qualified | 3.6V | 3.3V | 2.7V | Internal | 100MHz | 3K x 16 | 2.7V~3.6V | MICROCONTROLLER | 56800EX | DMA, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 32KB 16K x 16 | I2C, SCI, SPI | 32 | YES | YES | YES | YES | 5mm | 5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MK50DX256CMC7 | NXP USA Inc. | Datasheet | 1600 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 121-LFBGA | YES | A/D 36x16b; D/A 1x12b | 63 | 262144 | -40°C~85°C TA | Tray | 2012 | Kinetis K50 | e1 | Active | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK50DX256 | S-PBGA-B121 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 8mm | 8mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MK20DX32VFT5 | NXP USA Inc. | Datasheet | 1600 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 48-VFQFN Exposed Pad | YES | A/D 11x16b | 29 | 32768 | -40°C~105°C TA | Tray | 2012 | Kinetis K20 | Active | 3 (168 Hours) | 48 | 3A991.A.2 | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MK20DX32 | S-XQCC-N48 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 1mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No PIC32MX270F256B-V/SS | Microchip Technology | Datasheet | 29 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 28-SSOP (0.209, 5.30mm Width) | YES | 28 | 2.26799g | A/D 9x10b | 19 | Automotive grade | Yes | -40°C~105°C TA | Tube | 2009 | Automotive, AEC-Q100, PIC® 32MX | e3 | Active | 1 (Unlimited) | 28 | 3A991.A.2 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 40MHz | 40 | PIC32MX270F256B | 3.6V | I2C, I2S, IrDA, LIN, SPI, UART, USART, USB | 256kB | Internal | 64K x 8 | 2.3V~3.6V | MICROCONTROLLER, RISC | MIPS32® M4K™ | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | FLASH | 32-Bit | 256KB 256K x 8 | I2C, IrDA, LINbus, SPI, UART/USART, USB OTG | 32 | YES | YES | 32b | YES | 5 | PIC | 8 | TS 16949 | 21 | 10 | 2mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MKL17Z32VFM4R | NXP USA Inc. | Datasheet | 8004 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 32-UFQFN Exposed Pad | YES | A/D 11x16b | 28 | -40°C~105°C TA | Tape & Reel (TR) | Kinetis KL1 | Active | 3 (168 Hours) | 32 | 3A991.A.2 | DIFFERENTIAL ANALOG CHANNEL INPUTS: 2-CH 16-BIT | 8542.31.00.01 | QUAD | NO LEAD | NOT SPECIFIED | 3V | 0.5mm | NOT SPECIFIED | S-XQCC-N32 | 3.6V | 1.71V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, I2S, PWM, WDT | 48MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, FlexIO, SPI, UART/USART | 32 | YES | YES | YES | NO | 0.65mm | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MKL15Z32VLH4 | NXP USA Inc. | Datasheet | 38 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 64-LQFP | YES | A/D 16x16b; D/A 1x12b | 54 | 32768 | -40°C~105°C TA | Tray | 2012 | Kinetis KL1 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 16-BIT ADC AND 12-BIT DAC AVAILABLE | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MKL15Z32 | S-PQFP-G64 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, TSI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M0 | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No SPC56EL70L3CBFSR | STMicroelectronics | Datasheet | 5 |
| Min: 1 Mult: 1 | 26 Weeks | ACTIVE (Last Updated: 7 months ago) | Surface Mount | 100-LQFP | YES | A/D 32x12b | 57 | 524288 | -40°C~125°C TA | Tray | Automotive, AEC-Q100, SPC56xL | Active | 3 (168 Hours) | 100 | 3A991.A.2 | QUAD | GULL WING | NOT SPECIFIED | 3V | 0.5mm | NOT SPECIFIED | SPC56E | 3.63V | 3.3V | Internal | 120MHz | 192K x 8 | 3V~3.63V | MICROCONTROLLER, RISC | e200z4d | DMA, LVD, POR, PWM, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 2MB 2M x 8 | CANbus, LINbus, SCI, SPI, UART/USART | 32 | YES | YES | YES | 16 | 8 | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MKE02Z32VFM4R | NXP USA Inc. | Datasheet | 7 |
| Min: 1 Mult: 1 | 20 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 16x12b; D/A 2x6b | 28 | 4096 | 32768 | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis KE02 | Active | 3 (168 Hours) | 32 | 3A991.A.2 | RAM SIZE CONSIDERED FROM THE MFR WEBSITE | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.8mm | 40 | S-XQCC-N32 | 5.5V | 2.7V | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | YES | NO | 256 x 8 | 8 | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PIC18LF25J11T-I/SS | Microchip Technology | Datasheet | 39 |
| Min: 1 Mult: 1 | 16 Weeks | Surface Mount | Surface Mount | 28-SSOP (0.209, 5.30mm Width) | 28 | A/D 10x10b | 16 | Yes | -40°C~85°C TA | Tape & Reel (TR) | 2009 | PIC® XLP™ 18J | e3 | Active | 1 (Unlimited) | 28 | 3A991.A.2 | Matte Tin (Sn) | 1W | DUAL | GULL WING | 260 | 3V | 48MHz | 40 | PIC18LF25J11 | 28 | 3.6V | 2V | I2C, SPI, UART, USART | 32kB | Internal | 3.8K x 8 | 2V~3.6V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 32KB 16K x 16 | I2C, SPI, UART/USART | 8 | YES | YES | 8b | YES | NO | 5 | 16 | PIC | 2mm | 10.2mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No PIC18LF45K22-E/PT | Microchip Technology | Datasheet | 25 |
| Min: 1 Mult: 1 | 6 Weeks | Surface Mount | 44-TQFP | YES | 44 | A/D 30x10b | 35 | 16384 | Yes | -40°C~125°C TA | Tray | 2010 | PIC® XLP™ 18K | e3 | yes | Active | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | ALSO OPERATES 1.8 V MINIMUM SUPPLY AT 16 MHZ | 8542.31.00.01 | 1W | QUAD | GULL WING | 260 | 3V | 0.8mm | 48MHz | 40 | PIC18LF45K22 | 44 | 3.6V | 2/3.3V | I2C, SPI, UART, USART | 32kB | Internal | 1.5K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | FLASH | 8-Bit | 32KB 16K x 16 | I2C, SPI, UART/USART | 12mA | 8 | YES | NO | 8b | YES | YES | 7 | 256 x 8 | 16 | PIC | 36 | 1.2mm | 10mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC68F375BGMZP33 | NXP USA Inc. | Datasheet | 384 | - | Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 217-BBGA | YES | A/D 16x10b | 48 | -40°C~125°C TA | Tray | 1996 | M683xx | e0 | Obsolete | 3 (168 Hours) | 217 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 3.3V | 30 | MC68F375 | S-PBGA-B217 | 3.6V | 3V | Internal | 33MHz | 10K x 8 | 3V~5.25V | MICROCONTROLLER | CPU32 | POR, PWM, WDT | 33.6MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, SPI, UART/USART | 32 | YES | NO | YES | YES | 24 | 16 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No PIC16F1614-E/ML | Microchip Technology | Datasheet | 16 |
| Min: 1 Mult: 1 | 6 Weeks | Surface Mount | 16-VQFN Exposed Pad | YES | A/D 8x10b; D/A 1x8b | 12 | -40°C~125°C TA | Tube | 2011 | PIC® XLP™ 16F | e3 | Active | 1 (Unlimited) | 16 | 3A991.A.2 | Matte Tin (Sn) - annealed | IT ALSO OPERATES AT 16 MHZ IN 2.3V MINIMUM SUPPLY | 8542.31.00.01 | QUAD | NO LEAD | NOT SPECIFIED | 3V | 0.65mm | 32MHz | NOT SPECIFIED | PIC16F1614 | S-PQCC-N16 | 5.5V | 2.5V | I2C, LIN, SPI, UART, USART | 7kB | Internal | 512 x 8 | 2.3V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 7KB 4K x 14 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | YES | YES | 1mm | 4mm | 4mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No PIC16LF1718-E/MV | Microchip Technology | Datasheet | 22 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 28-UFQFN Exposed Pad | YES | 28 | 70.788759mg | A/D 17x10b; D/A 1x5b, 1x8b | 24 | 16384 | Automotive grade | -40°C~125°C TA | Tube | PIC® XLP™ 16F | e3 | Active | 3 (168 Hours) | 28 | 3A991.A.2 | Matte Tin (Sn) | IT ALSO OPERATES AT 16MHZ AT 1.8V MIN SUPPLY | QUAD | NO LEAD | 260 | 3V | 0.4mm | 32MHz | 40 | PIC16LF1718 | 3.6V | I2C, LIN, SPI, UART, USART | 28kB | Internal | 2K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 28KB 16K x 14 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | 8b | YES | 5 | 14 | TS 16949 | 17 | 4mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M30876FJAGP#U5 | Renesas Electronics America | Datasheet | 29 |
| Min: 1 Mult: 1 | 20 Weeks | Surface Mount | Surface Mount | 100-LQFP | 100 | A/D 26x10b; D/A 2x8b | 85 | 524288 | Yes | -20°C~85°C TA | Tray | 2008 | M16C™ M32C/80/87 | yes | Active | 3 (168 Hours) | 100 | 3A991.A.2 | ALSO OPERATES AT 3V MINIMUM SUPPLY AT 24 MHZ; ADC IS 10-CH 10-BIT IN MEMORY EXPANSION AND UP MODE | QUAD | GULL WING | 5V | 0.5mm | 32MHz | M30876 | 100 | 5.5V | 4.2V | CAN, EBI/EMI, I2C, IrDA, UART, USART | 512kB | Internal | 31K x 8 | 3V~5.5V | MICROCONTROLLER | M32C/80 | DMA, POR, PWM, WDT | FLASH | 16/32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IEBus, IrDA, SIO, UART/USART | 32 | 32 μs | YES | YES | 16b | YES | YES | 12 | 24 | 8 | 87 | 1.7mm | 14mm | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PIC16LF1718-E/SS | Microchip Technology | Datasheet | 357 |
| Min: 1 Mult: 1 | 9 Weeks | Surface Mount | Surface Mount | 28-SSOP (0.209, 5.30mm Width) | 28 | 2.26799g | A/D 17x10b; D/A 1x5b, 1x8b | 24 | 16384 | Automotive grade | -40°C~125°C TA | Tube | 2016 | PIC® XLP™ 16F | e3 | Active | 1 (Unlimited) | 28 | 3A991.A.2 | Matte Tin (Sn) | IT ALSO OPERATES AT 16MHZ AT 1.8V MIN SUPPLY | DUAL | GULL WING | 260 | 3V | 32MHz | 40 | PIC16LF1718 | 3.6V | I2C, LIN, SPI, UART, USART | 28kB | Internal | 2K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 28KB 16K x 14 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | 8b | YES | 5 | 14 | TS 16949 | 17 | 2mm | 10.2mm | ROHS3 Compliant |
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DSPIC33FJ128MC204-E/ML
Microchip Technology
Package:Embedded - Microcontrollers
21.496447
-
S9S12XS128J1VAE
NXP USA Inc.
Package:Embedded - Microcontrollers
8.157701
-
DSPIC33FJ128GP202T-I/SO
Microchip Technology
Package:Embedded - Microcontrollers
18.042695
-
PIC24FV32KA302T-I/ML
Microchip Technology
Package:Embedded - Microcontrollers
4.866469
-
HD6417751RBP240V
Renesas
Package:Embedded - Microcontrollers
Price: please inquire
-
MC56F82723VFM
NXP USA Inc.
Package:Embedded - Microcontrollers
4.233225
-
MK50DX256CMC7
NXP USA Inc.
Package:Embedded - Microcontrollers
14.473444
-
MK20DX32VFT5
NXP USA Inc.
Package:Embedded - Microcontrollers
5.371245
-
PIC32MX270F256B-V/SS
Microchip Technology
Package:Embedded - Microcontrollers
6.313828
-
MKL17Z32VFM4R
NXP USA Inc.
Package:Embedded - Microcontrollers
3.594627
-
MKL15Z32VLH4
NXP USA Inc.
Package:Embedded - Microcontrollers
7.972367
-
SPC56EL70L3CBFSR
STMicroelectronics
Package:Embedded - Microcontrollers
31.651511
-
MKE02Z32VFM4R
NXP USA Inc.
Package:Embedded - Microcontrollers
3.422642
-
PIC18LF25J11T-I/SS
Microchip Technology
Package:Embedded - Microcontrollers
3.392808
-
PIC18LF45K22-E/PT
Microchip Technology
Package:Embedded - Microcontrollers
4.306665
-
MC68F375BGMZP33
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
PIC16F1614-E/ML
Microchip Technology
Package:Embedded - Microcontrollers
1.665575
-
PIC16LF1718-E/MV
Microchip Technology
Package:Embedded - Microcontrollers
2.459447
-
M30876FJAGP#U5
Renesas Electronics America
Package:Embedded - Microcontrollers
38.548233
-
PIC16LF1718-E/SS
Microchip Technology
Package:Embedded - Microcontrollers
1.835038