The category is 'Embedded - Microcontrollers'
Embedded - Microcontrollers (5951)
- All Manufacturers
- Connectivity
- Core Size
- Data Converters
- ECCN Code
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Number of I/Os
- Number of Terminations
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- ECCN Code:
3A991.A.2
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Data Converters | Number of I/Os | ROM(word) | Usage Level | Watchdog Timers | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Max Power Dissipation | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Memory Size | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Access Time | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | EEPROM Size | On Chip Program ROM Width | CPU Family | Screening Level | External Data Bus Width | Format | RAM (words) | Number of ADC Channels | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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![]() | Mfr Part No MC9S08FL8CBM | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | Through Hole | 32-SDIP (0.400, 10.16mm) | NO | A/D 12x8b | 30 | 8192 | -40°C~85°C TA | Tube | 2006 | S08 | e3 | Active | Not Applicable | 32 | 3A991.A.2 | MATTE TIN | 8542.31.00.01 | DUAL | NOT SPECIFIED | 5V | 1.778mm | NOT SPECIFIED | MC9S08FL8 | R-PDIP-T32 | Not Qualified | 5.5V | 5V | 4.5V | Internal | 20MHz | 768 x 8 | 4.5V~5.5V | MICROCONTROLLER | LVD, PWM, WDT | 20MHz | FLASH | 8-Bit | 8KB 8K x 8 | SCI | 8 | YES | NO | YES | NO | 4.9mm | 28.1mm | 8.89mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No MKL17Z64VFM4R | NXP USA Inc. | Datasheet | 14400 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 32-UFQFN Exposed Pad | YES | A/D 11x16b | 28 | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis KL1 | e3 | Active | 3 (168 Hours) | 32 | 3A991.A.2 | Tin (Sn) | DIFFERENTIAL ANALOG CHANNEL INPUTS: 2-CH 16-BIT | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | 40 | S-XQCC-N32 | 3.6V | 1.71V | Internal | 48MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, I2S, PWM, WDT | 48MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, FlexIO, SPI, UART/USART | 32 | YES | YES | YES | NO | 0.65mm | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No STM32F031F4P6TR | STMicroelectronics | Datasheet | 28000 |
| Min: 1 Mult: 1 | 10 Weeks | ACTIVE (Last Updated: 7 months ago) | Surface Mount | 20-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x12b | 15 | -40°C~85°C TA | Tape & Reel (TR) | STM32F0 | Active | 1 (Unlimited) | 20 | 3A991.A.2 | DUAL | GULL WING | NOT SPECIFIED | 3.3V | 0.65mm | NOT SPECIFIED | STM32F03 | R-PDSO-G20 | 3.6V | 2V | Internal | 48MHz | 4K x 8 | 2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | DMA, I2S, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 16KB 16K x 8 | I2C, IrDA, LINbus, SPI, UART/USART | 32 | YES | YES | YES | NO | 1.2mm | 6.5mm | 4.4mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC9S08AW48CFUE | NXP USA Inc. | Datasheet | 1924 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 64-QFP | YES | A/D 16x10b | 54 | 49152 | -40°C~85°C TA | Tray | 2005 | S08 | e3 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 3V | 0.8mm | 40 | MC9S08AW48 | S-PQFP-G64 | Not Qualified | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 48KB 48K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No DSPIC33FJ64GP802-E/MM | Microchip Technology | Datasheet | 8000 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | Surface Mount | 28-VQFN Exposed Pad | 28 | A/D 10x10b/12b; D/A 2x16b | 21 | Yes | -40°C~125°C TA | Tube | 2009 | Automotive, AEC-Q100, dsPIC™ 33F | e3 | yes | Active | 1 (Unlimited) | 28 | 3A991.A.2 | Matte Tin (Sn) - annealed | QUAD | 260 | 3.3V | 40MHz | 40 | DSPIC33FJ64GP802 | 28 | 3.3V | 3.6V | CAN, I2C, IrDA, LIN, SPI, UART, USART | 64kB | Internal | 16K x 8 | 3V~3.6V | MICROCONTROLLER | dsPIC | Brown-out Detect/Reset, DCI, DMA, I2S, POR, PWM, WDT | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, I2C, IrDA, LINbus, SPI, UART/USART | 16 | YES | YES | 16b | YES | YES | 5 | FLOATING-POINT | 8192 | 1mm | 6mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||
![]() | Mfr Part No MC9S08QE4CTGR | NXP USA Inc. | Datasheet | 4179 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x12b | 12 | 4096 | -40°C~85°C TA | Tape & Reel (TR) | 2009 | S08 | e3 | Active | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | 40 | MC9S08QE4 | R-PDSO-G16 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 256 x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||
![]() | Mfr Part No MK53DN512ZCLQ10 | NXP USA Inc. | Datasheet | 295 |
| Min: 1 Mult: 1 | Surface Mount | 144-LQFP | YES | A/D 41x16b; D/A 2x12b | 94 | -40°C~85°C TA | Tray | 2012 | Kinetis K50 | e3 | Not For New Designs | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MK53DN512 | S-PQFP-G144 | Not Qualified | 3.6V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No DSPIC33EP64MC506-E/PT | Microchip Technology | Datasheet | 548 |
| Min: 1 Mult: 1 | 22 Weeks | Surface Mount | 64-TQFP | YES | 64 | A/D 16x10b/12b | 53 | Yes | -40°C~125°C TA | Tray | 2011 | Automotive, AEC-Q100, dsPIC™ 33EP | e3 | Active | 1 (Unlimited) | 64 | 3A991.A.2 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 60MHz | 40 | DSPIC33EP64MC506 | 64 | 3.3V | 3.6V | CAN, I2C, IrDA, LIN, SPI, UART, USART | 64kB | Internal | 4K x 16 | 3V~3.6V | MICROCONTROLLER | dsPIC | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT | FLASH | 16-Bit | 64KB 22K x 24 | CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART | 16 | YES | YES | 16b | YES | NO | 5 | 24 | FLOATING-POINT | 4096 | 1.2mm | 10mm | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||
![]() | Mfr Part No STM32L011K4T6TR | STMicroelectronics | Datasheet | 13 |
| Min: 1 Mult: 1 | 10 Weeks | ACTIVE (Last Updated: 7 months ago) | Surface Mount | 32-LQFP | YES | A/D 10x12b | 26 | -40°C~85°C TA | Tape & Reel (TR) | STM32L0 | Active | 3 (168 Hours) | 32 | 3A991.A.2 | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3V | 0.8mm | NOT SPECIFIED | STM32L011 | 3.6V | 1.8V | Internal | 32MHz | 2K x 8 | 1.65V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 16KB 16K x 8 | I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | 512 x 8 | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC9S12XEQ384MAG | NXP USA Inc. | Datasheet | 2823 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 144-LQFP | YES | A/D 24x12b | 119 | 393216 | -40°C~125°C TA | Tray | 2001 | HCS12X | e3 | Active | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 1.8V | 0.5mm | 40 | MC9S12XEQ384 | S-PQFP-G144 | Not Qualified | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 24K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 384KB 384K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 32 | YES | NO | YES | NO | 23 | 4K x 8 | CPU12 | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||||||||
![]() | Mfr Part No MPC5566MZP144 | NXP USA Inc. | Datasheet | 1831 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 416-BBGA | YES | A/D 40x12b | 256 | 3145728 | -40°C~125°C TA | Tray | 2007 | MPC55xx Qorivva | e0 | Active | 3 (168 Hours) | 416 | 3A991.A.2 | Tin/Lead (Sn/Pb) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | PC5566 | S-PBGA-B416 | Not Qualified | 1.65V | 1.53.35V | 1.35V | External | 144MHz | 128K x 8 | 1.35V~1.65V | MICROCONTROLLER, RISC | e200z6 | DMA, POR, PWM, WDT | 20MHz | FLASH | 32-Bit | 3MB 3M x 8 | CANbus, EBI/EMI, Ethernet, SCI, SPI | 32 | YES | YES | YES | NO | 24 | 32 | 2.55mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||||
![]() | Mfr Part No MKL25Z32VFM4 | NXP USA Inc. | Datasheet | 693 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 7x16b; D/A 1x12b | 23 | 32768 | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | Active | 3 (168 Hours) | 32 | 3A991.A.2 | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | 40 | MKL25Z32 | S-XQCC-N32 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M0 | 5mm | 5mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No MK10DX128VMC7 | NXP USA Inc. | Datasheet | 974 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 121-LFBGA | YES | A/D 39x16b; D/A 1x12b | 74 | 131072 | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e1 | Active | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK10DX128 | S-PBGA-B121 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 8mm | 8mm | ROHS3 Compliant | |||||||||||||||||||||||||||||
Mfr Part No S9S08RN60W1MLF | NXP USA Inc. | Datasheet | 16 |
| Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 48-LQFP | A/D 16x12b | 39 | -40°C~125°C TA | Tray | 2012 | S08 | e3 | Active | 3 (168 Hours) | 3A991.A.2 | MATTE TIN | 8542.31.00.01 | 260 | 40 | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROPROCESSOR | LVD, POR, PWM, WDT | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SPI, UART/USART | 256 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PIC18F442T-I/PT | Microchip Technology | Datasheet | 4640 |
| Min: 1 Mult: 1 | 6 Weeks | Surface Mount | 44-TQFP | YES | 44 | A/D 8x10b | 34 | 8192 | Yes | -40°C~85°C TA | Tape & Reel (TR) | 2005 | PIC® 18F | e3 | yes | Active | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | ALSO OPERATES AT MIN 2V SUPPLY | 1W | QUAD | GULL WING | 260 | 4.5V | 0.8mm | 40MHz | 40 | PIC18F442 | 44 | 5V | 5V | I2C, SPI, UART, USART | 16kB | External | 768 x 8 | 4.2V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, LVD, POR, PWM, WDT | FLASH | 8-Bit | 16KB 8K x 16 | I2C, SPI, UART/USART | 25mA | 8 | 40 μs | YES | NO | 8b | YES | NO | 4 | 256 x 8 | 16 | PIC | 1.2mm | 10mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||
![]() | Mfr Part No PIC18F66J90T-I/PT | Microchip Technology | Datasheet | 652 |
| Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 64-TQFP | 64 | A/D 12x10b | 51 | 32768 | Yes | -40°C~85°C TA | Tape & Reel (TR) | 2009 | PIC® 18J | e3 | yes | Active | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) - annealed | ITS ALSO OPERATES MINIMUM 2 V AT 8 MHZ | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 48MHz | 40 | PIC18F66J90 | 64 | 3.6V | 2.52.5/3.3V | I2C, SPI, UART, USART | 64kB | Internal | 3.8K x 8 | 2V~3.6V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, LCD, LVD, POR, PWM, WDT | FLASH | 8-Bit | 64KB 32K x 16 | I2C, SPI, UART/USART | 8 | YES | NO | 8b | YES | NO | 4 | 16 | PIC | 1.2mm | 10mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||
![]() | Mfr Part No MC9S08QG8CFKE | NXP USA Inc. | Datasheet | 1600 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 24-VFQFN Exposed Pad | YES | A/D 8x10b | 12 | 8192 | -40°C~85°C TA | Tray | 2003 | S08 | Active | 3 (168 Hours) | 24 | 3A991.A.2 | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 0.5mm | 40 | MC9S08QG8 | S-XQCC-N24 | Not Qualified | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 512 x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1mm | 4mm | 4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No S9S08SG32E1MTJ | NXP USA Inc. | Datasheet | 800 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 20-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x10b | 16 | 32768 | -40°C~125°C TA | Tube | 1999 | S08 | Active | 3 (168 Hours) | 20 | 3A991.A.2 | 8542.31.00.01 | DUAL | GULL WING | 260 | 3V | 0.65mm | NOT SPECIFIED | S9S08SG32 | R-PDSO-G20 | 5.5V | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 8 | 1.2mm | 6.5mm | 4.4mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PIC24F08KL301-I/SO | Microchip Technology | Datasheet | 20 |
| Min: 1 Mult: 1 | 7 Weeks | Surface Mount | 20-SOIC (0.295, 7.50mm Width) | YES | 20 | 18 | 2730 | Yes | -40°C~85°C TA | Tube | 2011 | PIC® XLP™ 24F | e3 | Active | 1 (Unlimited) | 20 | 3A991.A.2 | Matte Tin (Sn) - annealed | ALSO OPERATES 1.8V AT 8MHZ | DUAL | GULL WING | 260 | 3.3V | 1.27mm | 32MHz | 40 | PIC24F08KL301 | 20 | 3.6V | 2/3.3V | 3V | I2C, IrDA, LIN, SPI, UART, USART | 8kB | Internal | 1K x 8 | 1.8V~3.6V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | FLASH | 16-Bit | 8KB 2.75K x 24 | I2C, IrDA, LINbus, SPI, UART/USART | 12mA | 16 | YES | NO | 16b | YES | NO | 4 | 256 x 8 | 24 | PIC | 2.65mm | 12.8mm | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||
![]() | Mfr Part No PIC32MX270F256D-V/TL | Microchip Technology | Datasheet | 30686 |
| Min: 1 Mult: 1 | 17 Weeks | Surface Mount | 44-VFTLA Exposed Pad | YES | 44 | A/D 13x10b | 33 | Automotive grade | Yes | -40°C~105°C TA | Tube | 2014 | Automotive, AEC-Q100, PIC® 32MX | e4 | Active | 3 (168 Hours) | 44 | 3A991.A.2 | Nickel/Palladium/Gold (Ni/Pd/Au) | BOTTOM | BUTT | NOT SPECIFIED | 3.3V | 40MHz | NOT SPECIFIED | PIC32MX270F256D | 3.6V | I2C, I2S, IrDA, LIN, SPI, UART, USART, USB | 256kB | Internal | 64K x 8 | 2.3V~3.6V | MICROCONTROLLER, RISC | MIPS32® M4K™ | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | FLASH | 32-Bit | 256KB 256K x 8 | I2C, IrDA, LINbus, SPI, UART/USART, USB OTG | 32 | YES | YES | 32b | YES | 5 | PIC | 8 | TS 16949 | 13 | 1mm | 6mm | ROHS3 Compliant |
MC9S08FL8CBM
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MKL17Z64VFM4R
NXP USA Inc.
Package:Embedded - Microcontrollers
3.203383
STM32F031F4P6TR
STMicroelectronics
Package:Embedded - Microcontrollers
4.348375
MC9S08AW48CFUE
NXP USA Inc.
Package:Embedded - Microcontrollers
8.041894
DSPIC33FJ64GP802-E/MM
Microchip Technology
Package:Embedded - Microcontrollers
26.706069
MC9S08QE4CTGR
NXP USA Inc.
Package:Embedded - Microcontrollers
3.763758
MK53DN512ZCLQ10
NXP USA Inc.
Package:Embedded - Microcontrollers
18.490041
DSPIC33EP64MC506-E/PT
Microchip Technology
Package:Embedded - Microcontrollers
4.198230
STM32L011K4T6TR
STMicroelectronics
Package:Embedded - Microcontrollers
1.572346
MC9S12XEQ384MAG
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MPC5566MZP144
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
MKL25Z32VFM4
NXP USA Inc.
Package:Embedded - Microcontrollers
5.734948
MK10DX128VMC7
NXP USA Inc.
Package:Embedded - Microcontrollers
14.215160
S9S08RN60W1MLF
NXP USA Inc.
Package:Embedded - Microcontrollers
7.167184
PIC18F442T-I/PT
Microchip Technology
Package:Embedded - Microcontrollers
11.239779
PIC18F66J90T-I/PT
Microchip Technology
Package:Embedded - Microcontrollers
9.838173
MC9S08QG8CFKE
NXP USA Inc.
Package:Embedded - Microcontrollers
3.845828
S9S08SG32E1MTJ
NXP USA Inc.
Package:Embedded - Microcontrollers
5.377649
PIC24F08KL301-I/SO
Microchip Technology
Package:Embedded - Microcontrollers
2.364227
PIC32MX270F256D-V/TL
Microchip Technology
Package:Embedded - Microcontrollers
16.524323
