The category is 'Embedded - Microcontrollers'
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- ECCN Code
- HTS Code
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- Core Processor
- Core Size
- ECCN Code:
5A002.A.1
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Clock Frequency-Max | Ihs Manufacturer | Manufacturer Package Code | Number of I/O Lines | Number of I/Os | Package Code | Package Shape | Package Style | Part Life Cycle Code | Supply Voltage-Nom | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Connectivity | Bit Size | Has ADC | DMA Channels | PWM Channels | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Height Seated (Max) | Length | Width | RoHS Status |
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 | Mfr Part No MCF5329CVM240 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | YES | 94 | -40°C~85°C TA | Tray | 2006 | MCF532x | e1 | Not For New Designs | 3 (168 Hours) | 256 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5329 | S-PBGA-B256 | Not Qualified | 1.6V | 1.4V | External | 240MHz | 32K x 8 | 1.4V~3.6V | MICROPROCESSOR, RISC | Coldfire V3 | DMA, LCD, PWM, WDT | 80MHz | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG | 32 | 24 | YES | YES | 32 | FIXED POINT | YES | 1.6mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||
 | Mfr Part No MCF5485CVR200 | NXP USA Inc. | Datasheet | 2278 | - | Min: 1 Mult: 1 | Surface Mount | 388-BBGA | YES | 99 | -40°C~85°C TA | Tray | 2001 | MCF548x | e1 | Not For New Designs | 3 (168 Hours) | 388 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MCF5485 | S-PBGA-B388 | Not Qualified | 3.6V | 3V | External | 200MHz | 32K x 8 | 1.43V~1.58V | MICROPROCESSOR, RISC | Coldfire V4E | DMA, PWM, WDT | 66.67MHz | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | YES | YES | FLOATING POINT | YES | 2.55mm | 27mm | 27mm | ROHS3 Compliant | ||||||||||||||||||
| Mfr Part No MCF5485CZP200 | NXP USA Inc. | Datasheet | 2383 | - | Min: 1 Mult: 1 | 14 Weeks | Surface Mount | 388-BBGA | YES | 99 | -40°C~85°C TA | Tray | 2001 | MCF548x | e0 | Not For New Designs | 3 (168 Hours) | 388 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MCF5485 | S-PBGA-B388 | Not Qualified | 3.6V | 3V | External | 200MHz | 32K x 8 | 1.43V~1.58V | MICROPROCESSOR, RISC | Coldfire V4E | DMA, PWM, WDT | 66.67MHz | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | YES | YES | FLOATING POINT | YES | 2.55mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||
| Mfr Part No MCF5275CVM166 | NXP USA Inc. | Datasheet | 144 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | YES | 69 | -40°C~85°C TA | Tray | 1997 | MCF527x | e1 | Not For New Designs | 3 (168 Hours) | 256 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5275 | S-PBGA-B256 | Not Qualified | 1.6V | 1.4V | External | 166MHz | 64K x 8 | 1.4V~1.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 83MHz | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | 24 | YES | YES | 32 | FIXED POINT | YES | 1.6mm | 17mm | 17mm | ROHS3 Compliant | ||||||||||||||
| Mfr Part No MCF5235CVM150 | NXP USA Inc. | Datasheet | 2019 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 256-LBGA | YES | 97 | -40°C~85°C TA | Tray | 2004 | MCF523x | Not For New Designs | 3 (168 Hours) | 256 | 5A002.A.1 | Tin/Silver/Copper - with Nickel barrier | LOW POWER MODE TAKEN FROM LOW POWER MODE | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5235 | S-PBGA-B256 | Not Qualified | 1.6V | 1.4V | External | 150MHz | 64K x 8 | 1.4V~1.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 75MHz | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | 32 | 24 | YES | YES | 32 | FIXED POINT | YES | 1.6mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||
| Mfr Part No MCF5471VR200 | NXP USA Inc. | Datasheet | 19 |
| Min: 1 Mult: 1 | 14 Weeks | Surface Mount | 388-BBGA | YES | 99 | 0°C~70°C TA | Tray | 2001 | MCF547x | e1 | Not For New Designs | 3 (168 Hours) | 388 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5471 | S-PBGA-B388 | Not Qualified | 1.58V | 1.43V | External | 200MHz | 32K x 8 | 1.43V~1.58V | MICROPROCESSOR, RISC | Coldfire V4E | DMA, PWM, WDT | 66.66MHz | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.55mm | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||
 | Mfr Part No MCF5275LCVM166 | NXP USA Inc. | Datasheet | 20 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 196-LBGA | YES | 61 | -40°C~85°C TA | Tray | 1997 | MCF527x | Not For New Designs | 3 (168 Hours) | 196 | 5A002.A.1 | Tin/Silver/Copper - with Nickel barrier | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5275 | S-PBGA-B196 | Not Qualified | 1.6V | 1.4V | External | 166MHz | 64K x 8 | 1.4V~1.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 83MHz | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | 24 | YES | YES | 32 | FIXED POINT | YES | 1.6mm | 15mm | 15mm | ROHS3 Compliant | |||||||||||||||
| Mfr Part No MCF5475ZP266 | NXP USA Inc. | Datasheet | 25 | - | Min: 1 Mult: 1 | Surface Mount | 388-BBGA | YES | 99 | 0°C~70°C TA | Tray | 2001 | MCF547x | e0 | Not For New Designs | 3 (168 Hours) | 388 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | unknown | 40 | MCF5475 | S-PBGA-B388 | Not Qualified | 1.58V | 1.43V | External | 266MHz | 32K x 8 | 1.43V~1.58V | MICROPROCESSOR, RISC | Coldfire V4E | DMA, PWM, WDT | 66.66MHz | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.55mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||
| Mfr Part No MCF5471ZP200 | NXP USA Inc. | Datasheet | 8000 |
| Min: 1 Mult: 1 | 14 Weeks | Surface Mount | 388-BBGA | YES | 99 | 0°C~70°C TA | Tray | 2001 | MCF547x | e0 | Not For New Designs | 3 (168 Hours) | 388 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | unknown | 40 | MCF5471 | S-PBGA-B388 | Not Qualified | 1.58V | 1.43V | External | 200MHz | 32K x 8 | 1.43V~1.58V | MICROPROCESSOR, RISC | Coldfire V4E | DMA, PWM, WDT | 66.66MHz | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.55mm | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||
| Mfr Part No MCF5483CVR166 | NXP USA Inc. | Datasheet | 25 | - | Min: 1 Mult: 1 | Surface Mount | 388-BBGA | YES | 99 | -40°C~85°C TA | Tray | 2001 | MCF548x | e1 | Not For New Designs | 3 (168 Hours) | 388 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MCF5483 | S-PBGA-B388 | Not Qualified | 3.6V | 3V | External | 166MHz | 32K x 8 | 1.43V~1.58V | MICROPROCESSOR, RISC | Coldfire V4E | DMA, PWM, WDT | 66.67MHz | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | YES | YES | FLOATING POINT | YES | 2.55mm | 27mm | 27mm | ROHS3 Compliant | ||||||||||||||||||
| Mfr Part No MCF5475VR266 | NXP USA Inc. | Datasheet | 768 | - | Min: 1 Mult: 1 | 14 Weeks | Surface Mount | 388-BBGA | YES | 99 | 0°C~70°C TA | Tray | 2001 | MCF547x | e1 | Not For New Designs | 3 (168 Hours) | 388 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5475 | S-PBGA-B388 | Not Qualified | 1.58V | 1.43V | External | 266MHz | 32K x 8 | 1.43V~1.58V | MICROPROCESSOR, RISC | Coldfire V4E | DMA, PWM, WDT | 66.66MHz | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | 32 | YES | YES | 32 | FLOATING POINT | YES | 2.55mm | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||
| Mfr Part No MCF5475VR200 | NXP USA Inc. | Datasheet | 8000 | - | Min: 1 Mult: 1 | 14 Weeks | Surface Mount | 388-BBGA | 99 | 0°C~70°C TA | Tray | 2001 | MCF547x | e1 | Not For New Designs | 3 (168 Hours) | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | 260 | 40 | MCF5475 | External | 200MHz | 32K x 8 | 1.43V~1.58V | Coldfire V4E | DMA, PWM, WDT | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
| Mfr Part No MCF5271CVM150 | NXP USA Inc. | Datasheet | 31 |
| Min: 1 Mult: 1 | 14 Weeks | Surface Mount | 196-LBGA | YES | 97 | -40°C~85°C TA | Tray | 1997 | MCF527x | e1 | Not For New Designs | 3 (168 Hours) | 196 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5271 | S-PBGA-B196 | Not Qualified | 1.6V | 1.4V | External | 150MHz | 64K x 8 | 1.4V~3.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 75MHz | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 32 | 24 | YES | YES | 32 | FIXED POINT | YES | 1.6mm | 15mm | 15mm | ROHS3 Compliant | ||||||||||||||
| Mfr Part No MCF5373LCVM240 | NXP USA Inc. | Datasheet | 36 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 196-LBGA | YES | 62 | -40°C~85°C TA | Tray | 2005 | MCF537x | e1 | Not For New Designs | 3 (168 Hours) | 256 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5373L | S-PBGA-B256 | Not Qualified | 1.6V | 1.4V | External | 240MHz | 32K x 8 | 1.4V~3.6V | MICROPROCESSOR, RISC | Coldfire V3 | DMA, POR, PWM, WDT | 80MHz | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG | 32 | 24 | YES | YES | 32 | FIXED POINT | YES | 1.6mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||
| Mfr Part No MCF5481CVR166 | NXP USA Inc. | Datasheet | 130 |
| Min: 1 Mult: 1 | 14 Weeks | Surface Mount | 388-BBGA | YES | 99 | -40°C~85°C TA | Tray | 2001 | MCF548x | e1 | Not For New Designs | 3 (168 Hours) | 388 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MCF5481 | S-PBGA-B388 | Not Qualified | 3.6V | 3V | External | 166MHz | 32K x 8 | 1.43V~1.58V | MICROPROCESSOR, RISC | Coldfire V4E | DMA, PWM, WDT | 66.67MHz | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | YES | YES | FLOATING POINT | YES | 2.55mm | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||
 | Mfr Part No SCF5235F4CVM150 | NXP USA Inc. | Datasheet | 25 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 97 | -40°C~85°C TA | Bulk | 2004 | MCF523x | e1 | Not For New Designs | 3 (168 Hours) | 256 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | LOW POWER MODE TAKEN FROM LOW POWER MODE | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | S-PBGA-B256 | 1.6V | 1.4V | External | 150MHz | 64K x 8 | 1.4V~1.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 75MHz | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | 32 | 24 | YES | YES | 32 | FIXED POINT | YES | 1.6mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||||
| Mfr Part No MCF5475ZP200 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 388-BBGA | 99 | 0°C~70°C TA | Tray | 2001 | MCF547x | e0 | Obsolete | 3 (168 Hours) | 5A002.A.1 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | 260 | unknown | 40 | MCF5475 | External | 200MHz | 32K x 8 | 1.43V~1.58V | Coldfire V4E | DMA, PWM, WDT | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
 | Mfr Part No ST33G1M2A | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 10 MHz | STMICROELECTRONICS | DICE | 7 | DIE | UNSPECIFIED | UNCASED CHIP | Active | 1.8 V | 5A002.A.1 | 8542.31.00.01 | UPPER | NO LEAD | compliant | 25 MHz | MICROCONTROLLER, RISC | 32 | NO | NO | NO | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MCF5271CVM100 | NXP USA Inc. | Datasheet | 20 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 196-LBGA | YES | 61 | -40°C~85°C TA | Tray | 1997 | MCF527x | e1 | Not For New Designs | 3 (168 Hours) | 196 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5271 | S-PBGA-B196 | Not Qualified | 1.6V | 1.4V | External | 100MHz | 64K x 8 | 1.4V~3.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 75MHz | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 32 | 24 | YES | YES | 32 | FIXED POINT | YES | 1.6mm | 15mm | 15mm | ROHS3 Compliant | ||||||||||||||
| Mfr Part No MCF5235CVM100 | NXP USA Inc. | Datasheet | 226 |
| Min: 1 Mult: 1 | 14 Weeks | Surface Mount | 256-LBGA | YES | 113 | -40°C~85°C TA | Tray | 2004 | MCF523x | e1 | Not For New Designs | 3 (168 Hours) | 256 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | LOW POWER MODE TAKEN FROM LOW POWER MODE | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5235 | S-PBGA-B256 | Not Qualified | 1.6V | 1.4V | External | 100MHz | 64K x 8 | 1.4V~1.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 75MHz | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | 32 | 24 | YES | YES | 32 | FIXED POINT | YES | 1.6mm | 17mm | 17mm | ROHS3 Compliant |
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MCF5329CVM240
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCF5485CVR200
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCF5485CZP200
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCF5275CVM166
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCF5235CVM150
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCF5471VR200
NXP USA Inc.
Package:Embedded - Microcontrollers
77.283429
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MCF5275LCVM166
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCF5475ZP266
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCF5471ZP200
NXP USA Inc.
Package:Embedded - Microcontrollers
79.947041
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MCF5483CVR166
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCF5475VR266
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCF5475VR200
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCF5271CVM150
NXP USA Inc.
Package:Embedded - Microcontrollers
12.446078
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MCF5373LCVM240
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCF5481CVR166
NXP USA Inc.
Package:Embedded - Microcontrollers
62.299053
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SCF5235F4CVM150
NXP USA Inc.
Package:Embedded - Microcontrollers
87.275748
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MCF5475ZP200
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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ST33G1M2A
STMicroelectronics
Package:Embedded - Microcontrollers
Price: please inquire
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MCF5271CVM100
NXP USA Inc.
Package:Embedded - Microcontrollers
31.890023
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MCF5235CVM100
NXP USA Inc.
Package:Embedded - Microcontrollers
39.736154