The category is 'Embedded - Microcontrollers'

  • All Manufacturers
  • Length
  • Max Operating Temperature
  • Max Power Dissipation
  • Min Operating Temperature
  • RAM Size
  • RoHS
  • Speed
  • Base Product Number
  • Composition
  • Connectivity
  • Core Processor
  • Core Size
  • Max Power Dissipation:

    2 W

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Mounting Type

Package / Case

Surface Mount

Number of Pins

Supplier Device Package

Number of Terminals

Base Product Number

Clock Frequency-Max

Data Converters

Ihs Manufacturer

Manufacturer

Manufacturer Part Number

Memory Types

Mfr

Number of I/O Lines

Number of I/Os

Operating Temperature-Max

Operating Temperature-Min

Package

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Product Status

RAM(byte)

Risk Rank

RoHS

Rohs Code

ROM(word)

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom

Watchdog Timers

Operating Temperature

Packaging

Series

Tolerance

Number of Terminations

ECCN Code

Temperature Coefficient

Resistance

Max Operating Temperature

Min Operating Temperature

Composition

Additional Feature

HTS Code

Subcategory

Power Rating

Max Power Dissipation

Technology

Terminal Position

Terminal Form

Terminal Pitch

Reach Compliance Code

JESD-30 Code

Qualification Status

Lead Length

Failure Rate

Power Supplies

Temperature Grade

Interface

Memory Size

Oscillator Type

Speed

RAM Size

Voltage - Supply (Vcc/Vdd)

uPs/uCs/Peripheral ICs Type

Core Processor

Peripherals

Program Memory Type

Core Size

Program Memory Size

Connectivity

Supply Current-Max

Bit Size

Has ADC

DMA Channels

Data Bus Width

PWM Channels

DAC Channels

Seated Height-Max

Number of Timers/Counters

Address Bus Width

EEPROM Size

On Chip Program ROM Width

CPU Family

Max Frequency

External Data Bus Width

ROM Programmability

Features

Length

Width

Radiation Hardening

Lead Free

MB89537APFM-G-546-BNDE1

Mfr Part No

MB89537APFM-G-546-BNDE1

Infineon Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

64-BQFP

64-QFP (14x20)

MB89537

A/D 8x10b

Infineon Technologies

38

Bulk

Obsolete

Compliant

-40°C ~ 85°C (TA)

Tape & Reel (TR)

F²MC-8L MB89530A

10 %

2

350 ppm/°C

20 Ω

275 °C

-65 °C

Wirewound

2 W

External

12.5MHz

1K x 8

2.2V ~ 5.5V

F²MC-8L

POR, PWM, WDT

Mask ROM

8-Bit

32KB (32K x 8)

I²C, Serial I/O, UART/USART

-

16.002 mm

MB90F367TSPMT-GSE1

Mfr Part No

MB90F367TSPMT-GSE1

Infineon Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

48-LQFP

48-LQFP (7x7)

MB90F367

A/D 16x8/10b

Infineon Technologies

36

Tray

Obsolete

Non-Compliant

-40°C ~ 105°C (TA)

Tape & Reel (TR)

F²MC-16LX MB90360

1 %

2

20 ppm/°C

75 Ω

250 °C

-55 °C

Wirewound

2 W

2 W

38.1 mm

0.001 %

Internal

24MHz

3K x 8

3.5V ~ 5.5V

F²MC-16LX

LVD, POR, WDT

FLASH

16-Bit

64KB (64K x 8)

CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART

-

Military, Moisture Resistant

10.3124 mm

2.39 mm

Contains Lead

MB91F469GBPB-GSE1

Mfr Part No

MB91F469GBPB-GSE1

Fujitsu Datasheet

-

-

Min: 1

Mult: 1

YES

320

320

16 MHz

CYPRESS SEMICONDUCTOR CORP

Cypress Semiconductor

MB91F469GBPB-GSE1

FLASH

205

125 °C

-40 °C

PLASTIC/EPOXY

HBGA

BGA-320

BGA320,20X20,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Active

98304

1.86

Compliant

Yes

2162688

5.5 V

3 V

5 V

Yes

EAR99

125 °C

-40 °C

IT ALSO NEED 1.8V NOMINAL SUPPLY VOLTAGE

8542.31.00.01

Microcontrollers

2 W

CMOS

BOTTOM

BALL

1.27 mm

compliant

S-PBGA-B320

Not Qualified

3.3/5 V

AUTOMOTIVE

CAN, I2C, USART

2.1 MB

100 MHz

96 kB

MICROCONTROLLER, RISC

170 mA

32

YES

YES

32 b

NO

NO

2.46 mm

40

28

8

FR60

100 MHz

32

FLASH

27 mm

27 mm

No