The category is 'Embedded - Microcontrollers'

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  • Operating Temperature:

    -65°C ~ 105°C

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Factory Pack QuantityFactory Pack Quantity

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Contact Finish Thickness - Mating

Contact Finish Thickness - Post

Material Flammability Rating

S912ZVML64AVKH

Mfr Part No

S912ZVML64AVKH

NXP Datasheet

30
In Stock

Min: 1

Mult: 1

Through Hole, Right Angle

Square

NXP Semiconductors

Gold

0.228 (5.80mm)

Brass

160

Polybutylene Terephthalate (PBT)

NXP

--

935425721557

Details

--

-65°C ~ 105°C

Bulk

AMPMODU Mod II

Active

Solder

Header, Breakaway

72

--

2

Push-Pull

Microcontrollers - MCU

Male Pin

--

0.219 (5.56mm)

Board to Board or Cable

All

5A

0.100 (2.54mm)

Green

0.100 (2.54mm)

0.126 (3.20mm)

Unshrouded

Tin

--

16-bit Microcontrollers - MCU

--

16-bit Microcontrollers - MCU

3.90µin (0.099µm)

118.1µin (3.00µm)

UL94 V-0

NUC442JI8AE

Mfr Part No

NUC442JI8AE

Nuvoton Datasheet

80
In Stock

  • 1: $11.742490
  • 10: $11.077821
  • 100: $10.450774
  • 500: $9.859221
  • View all price

Min: 1

Mult: 1

Through Hole

144-LQFP

YES

Square

144-LQFP (20x20)

144

2*12-bit, 16-ch

24 MHz

Gold

0.230 (5.84mm)

Copper Alloy

Y

A/D 16x12b SAR

NUVOTON TECHNOLOGY CORP

Liquid Crystal Polymer (LCP)

Nuvoton Technology Corp

NUC442JI8AE

--

Nuvoton Technology Corporation

114

114

Bulk

LFQFP

LFQFP,

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Active

16

NUC442/472 Series

Active

5.73

Yes

64KB

5.5 V

2.5 V

5 V

12

FS

30VAC

-65°C ~ 105°C

Bulk

AMPMODU Mod II

Obsolete

Solder

Header, Breakaway

36

--

2

Push-Pull

Male Pin

QUAD

GULL WING

--

0.5 mm

0.090 (2.29mm)

Board to Board or Cable

All

compliant

3A

84MHz

0.100 (2.54mm)

Black

0.100 (2.54mm)

0.120 (3.05mm)

Unshrouded

Tin-Lead

0.440 (11.18mm)

512KB

External, Internal

84MHz

64K x 8

2.5V ~ 5.5V

ARM® Cortex®-M4

FLASH

32-Bit

512KB (512K x 8)

32

YES

YES

YES

NO

25

-

16

4

2

HS

16*16-bit

--

2.5~5.5V

20 mm

20 mm

5.00µin (0.127µm)

100.0µin (2.54µm)

UL94 V-0

ATMEGA3290V-8AU/T

Mfr Part No

ATMEGA3290V-8AU/T

Atmel Datasheet

-

-

Min: 1

Mult: 1

Through Hole

Square

Gold

0.230 (5.84mm)

Copper Alloy

Liquid Crystal Polymer (LCP)

--

--

-65°C ~ 105°C

Bulk

AMPMODU Mod II

Active

Solder

Header, Breakaway

20

--

2

Push-Pull

Male Pin

--

0.090 (2.29mm)

Board to Board or Cable

All

3A

0.100 (2.54mm)

Black

0.100 (2.54mm)

0.120 (3.05mm)

Unshrouded

Tin

0.440 (11.18mm)

--

30.0µin (0.76µm)

100.0µin (2.54µm)

UL94 V-0

STM32G051C6U6

Mfr Part No

STM32G051C6U6

STMicroelectronics Datasheet

11232
In Stock

Min: 1

Mult: 1

Through Hole, Right Angle

48-UFQFN Exposed Pad

Square

48-UFQFPN (7x7)

Gold

0.318 (8.08mm)

Copper Alloy

A/D 19x12b SAR; D/A 2x12b

Thermoplastic, Glass Filled

--

STMicroelectronics

MSL 3 - 168 hours

44

Bulk

Active

--

-65°C ~ 105°C

Bulk

AMPMODU Mod II

Active

Solder

Header, Breakaway

5

--

1

Push-Pull

Male Pin

--

0.138 (3.50mm)

Board to Board or Cable

All

3A

0.100 (2.54mm)

Black

--

0.110 (2.79mm)

Unshrouded

Tin

--

I2C, I2S, SPI, UART, USART

External, Internal

64MHz

18K x 8

1.7V ~ 3.6V

ARM® Cortex®-M0+

Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT

FLASH

32-Bit

32KB (32K x 8)

I²C, IrDA, LINbus, SPI, UART/USART

32bit

-

--

ARM Cortex-M0+

30.0µin (0.76µm)

100.0µin (2.54µm)

UL94 V-0

CY8C6245FNI-S3D11T

Mfr Part No

CY8C6245FNI-S3D11T

Infineon Datasheet

6
In Stock

Min: 1

Mult: 1

Through Hole

49-XBGA, WLCSP

Square

49-WLCSP (2.88x3.1)

CY8C6245

Infineon Technologies

Gold

0.318 (8.08mm)

Copper Alloy

A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b

2000

Thermoplastic

Infineon

--

Infineon Technologies

37

Tape & Reel (TR)

Active

Details

--

-65°C ~ 105°C

Bulk

AMPMODU Mod II

Active

Solder

Header, Breakaway

14

--

2

Push-Pull

Microcontrollers - MCU

Male Pin

--

0.090 (2.29mm)

Board to Board or Cable

All

3A

0.100 (2.54mm)

Black

0.100 (2.54mm)

0.125 (3.18mm)

Unshrouded

Tin-Lead

0.533 (13.55mm)

Serial I2C/SPI/UART

External, Internal

100MHz, 150MHz

256 x 8

1.7V ~ 3.6V

ARM® Cortex®-M0+, ARM® Cortex®-M4F

Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT

FLASH

32-Bit Dual-Core

512 KB

FIFO, I²C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SmartCard, SPI, UART/USART

32 Bit

ARM Microcontrollers - MCU

-

--

ARM Microcontrollers - MCU

ARM Cortex-M4F/ARM Cortex-M0+

15.0µin (0.38µm)

100.0µin (2.54µm)

UL94 V-0

R5F56517FGLK#20

Mfr Part No

R5F56517FGLK#20

Renesas Datasheet

336
In Stock

  • 1: $11.272294
  • 10: $10.634240
  • 100: $10.032301
  • 500: $9.464435
  • View all price

Min: 1

Mult: 1

Through Hole, Right Angle

145-TFLGA

Square

145-TFLGA (7x7)

Renesas Electronics

Gold

0.230 (5.84mm)

Copper Alloy

A/D 29x12b; D/A 2x12b

416

Thermoplastic

Renesas Electronics

--

Renesas Electronics America Inc

111

Tray

Active

Details

This product may require additional documentation to export from the United States.

--

-65°C ~ 105°C

Bulk

AMPMODU Mod II

Discontinued at Digi-Key

Solder

Header, Breakaway

52

--

2

Push-Pull

Microcontrollers - MCU

Male Pin

--

0.238 (6.05mm)

Board to Board or Cable

All

3A

0.100 (2.54mm)

Black

0.100 (2.54mm)

0.120 (3.05mm)

Unshrouded

Tin-Lead

--

External

120MHz

256K x 8

2.7V ~ 3.6V

RXv2

DMA, LVD, POR, PWM, WDT

FLASH

32-Bit

768KB (768K x 8)

CANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB

32-bit Microcontrollers - MCU

-

--

32-bit Microcontrollers - MCU

30.0µin (0.76µm)

100.0µin (2.54µm)

UL94 V-0

TC397XE256F300SBCKXUMA1

Mfr Part No

TC397XE256F300SBCKXUMA1

Infineon Datasheet

-

-

Min: 1

Mult: 1

Through Hole

Square

Gold

0.230 (5.84mm)

Copper Alloy

Liquid Crystal Polymer (LCP)

--

30VAC

-65°C ~ 105°C

Bulk

AMPMODU Mod II

Obsolete

Solder

Header, Breakaway

72

--

2

Push-Pull

Male Pin

--

0.090 (2.29mm)

Board to Board or Cable

All

3A

0.100 (2.54mm)

Black

0.100 (2.54mm)

0.120 (3.05mm)

Unshrouded

Tin-Lead

0.440 (11.18mm)

--

5.00µin (0.127µm)

100.0µin (2.54µm)

UL94 V-0