The category is 'Embedded - Microcontrollers'
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- Package / Case:
208-TFBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Base Product Number | Data Converters | Mfr | Number of I/Os | Package | Product Status | ROM(word) | Usage Level | Watchdog Timers | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Number of Serial I/Os | Number of Timers | ROM Programmability | Number of External Interrupts | Bus Compatibility | On Chip Data RAM Width | Number of DMA Channels | Height Seated (Max) | Length | Width | RoHS Status | Lead Free |
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 | Mfr Part No LPC1778FET208,551 | NXP USA Inc. | Datasheet | 8068 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 208-TFBGA | YES | A/D 8x12b; D/A 1x10b | 165 | 524288 | -40°C~85°C TA | Tray | 2007 | LPC17xx | e1 | Active | 2 (1 Year) | 208 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | NOT SPECIFIED | LPC1778 | 208 | S-PBGA-B208 | Not Qualified | 3.6V | 3.3V | 2.4V | Internal | 120MHz | 96K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | 32 | YES | YES | YES | YES | 26 | 4K x 8 | CORTEX-M3 | 32 | 1.2mm | 15mm | 15mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||
| Mfr Part No LPC2468FET208,551 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 208-TFBGA | YES | A/D 8x10b; D/A 1x10b | 160 | 32768 | -40°C~85°C TA | Tray | 2009 | LPC2400 | e1 | Not For New Designs | 2 (1 Year) | 208 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | NOT SPECIFIED | LPC2468 | 208 | S-PBGA-B208 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 72MHz | 98K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM7® | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 25MHz | FLASH | 16/32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | 32 | YES | YES | YES | YES | 24 | 128 | YES | YES | 32 | FIXED POINT | NO | 16384 | 4 | 4 | 4 | 32 | 1 | 1.2mm | 15mm | 15mm | ROHS3 Compliant | |||||||||||||||||||||
| Mfr Part No LPC1788FET208,551 | NXP USA Inc. | Datasheet | 7710 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 208-TFBGA | YES | A/D 8x12b; D/A 1x10b | 165 | 524288 | -40°C~85°C TA | Tray | 2010 | LPC17xx | e1 | Active | 2 (1 Year) | 208 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | NOT SPECIFIED | LPC1788 | 208 | S-PBGA-B208 | Not Qualified | 3.6V | 3.3V | 2.4V | Internal | 120MHz | 96K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | 32 | YES | YES | YES | YES | 26 | 4K x 8 | CORTEX-M3 | 32 | 1.2mm | 15mm | 15mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||
 | Mfr Part No FIDO1100BGB208IR1 | Analog Devices Inc. | Datasheet | 2222 |
| Min: 1 Mult: 1 | 8 Weeks | PRODUCTION (Last Updated: 2 weeks ago) | Surface Mount | Surface Mount | 208-TFBGA | 208 | A/D 8x10b | 72 | Industrial grade | Yes | -40°C~85°C TA | Tray | fido™ | no | Active | 3 (168 Hours) | 66MHz | FIDO1100 | 208 | 3.3V | CAN, EBI/EMI, Ethernet, GPIO, I2C, SMBus, SPI | Internal | 24K x 8 | 2.25V~3.6V | MICROPROCESSOR CIRCUIT | CPU32 | DMA, POR, WDT | RREM | 32-Bit | 32KB 32K x 8 | CANbus, EBI/EMI, EIA-232, Ethernet, GPIO, HDLC, I2C, SMBus, SPI | 6 | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LPC4078FET208,551 | NXP USA Inc. | Datasheet | 8 | - | Min: 1 Mult: 1 | 18 Weeks | Surface Mount | 208-TFBGA | YES | A/D 8x12b; D/A 1x10b | 165 | 524288 | -40°C~85°C TA | Tray | 2010 | LPC40xx | e1 | Active | 2 (1 Year) | 208 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 3.3V | 0.8mm | LPC4078 | 208 | S-PBGA-B208 | Not Qualified | 3.6V | 3.3V | 2.4V | Internal | 120MHz | 96K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | 32 | YES | YES | YES | 4032 x 8 | CORTEX-M4 | 15mm | 15mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No LPC2470FET208,551 | NXP USA Inc. | Datasheet | 38 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 208-TFBGA | YES | A/D 8x10b; D/A 1x10b | 160 | 0 | -40°C~85°C TA | Tray | 2003 | LPC2400 | e1 | Not For New Designs | 2 (1 Year) | 208 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | NOT SPECIFIED | LPC2470 | 208 | S-PBGA-B208 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 72MHz | 98K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM7® | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | 24MHz | ROMless | 16/32-Bit | CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | 32 | YES | YES | YES | YES | 24 | 32 | MROM | 1.2mm | 15mm | 15mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
| Mfr Part No LPC4088FET208,551 | NXP USA Inc. | Datasheet | 100 |
| Min: 1 Mult: 1 | 18 Weeks | Surface Mount | 208-TFBGA | YES | A/D 8x12b; D/A 1x10b | 165 | 524288 | -40°C~85°C TA | Tray | 2007 | LPC40xx | e1 | Active | 2 (1 Year) | 208 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 3.3V | 0.8mm | LPC4088 | 208 | S-PBGA-B208 | Not Qualified | 3.6V | 3.3V | 2.4V | Internal | 120MHz | 96K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | 32 | YES | YES | YES | 4032 x 8 | CORTEX-M4 | 15mm | 15mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No LPC2478FET208,551 | NXP USA Inc. | Datasheet | 97 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 208-TFBGA | YES | A/D 8x10b; D/A 1x10b | 160 | 524288 | -40°C~85°C TA | Tray | 2003 | LPC2400 | e1 | Not For New Designs | 2 (1 Year) | 208 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | NOT SPECIFIED | LPC2478 | 208 | S-PBGA-B208 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 72MHz | 96K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM7® | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | 25MHz | FLASH | 16/32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | 32 | YES | YES | YES | YES | 24 | 32 | 1.2mm | 15mm | 15mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
| Mfr Part No LPC2460FET208,551 | NXP USA Inc. | Datasheet | 46 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 208-TFBGA | YES | A/D 8x10b; D/A 1x10b | 160 | 0 | -40°C~85°C TA | Tray | 2009 | LPC2400 | e1 | Not For New Designs | 2 (1 Year) | 208 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | NOT SPECIFIED | LPC24*0 | 208 | S-PBGA-B208 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 72MHz | 96K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM7® | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 24MHz | ROMless | 16/32-Bit | CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | 32 | YES | YES | YES | YES | 24 | 32 | MROM | 1.2mm | 15mm | 15mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
| Mfr Part No LPC2420FET208,551 | NXP USA Inc. | Datasheet | 142 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 208-TFBGA | YES | A/D 8x10b; D/A 1x10b | 160 | 0 | -40°C~85°C TA | Tray | 2003 | LPC2400 | e1 | Not For New Designs | 2 (1 Year) | 208 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | NOT SPECIFIED | LPC24*0 | 208 | S-PBGA-B208 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 72MHz | 82K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM7® | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 25MHz | ROMless | 16/32-Bit | EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | 32 | YES | YES | YES | 24 | 32 | 15mm | 15mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
| Mfr Part No LPC3152FET208,551 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 208-TFBGA | YES | A/D 3x10b | 10 | 0 | -40°C~85°C TA | Tray | 2010 | LPC3100 | e1 | Obsolete | 3 (168 Hours) | 208 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.2V | 0.65mm | LPC315* | 208 | S-PBGA-B208 | Not Qualified | 1.3V | 1.21.8/3.3V | 1.1V | External | 180MHz | 192K x 8 | 1.1V~3.6V | MICROCONTROLLER, RISC | ARM9® | DMA, I2S, LCD, PWM, WDT | 25MHz | ROMless | 16/32-Bit | EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG | 32 | YES | YES | YES | YES | FLASH | 1.15mm | 12mm | 12mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No LPC3154FET208,551 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 208-TFBGA | YES | A/D 3x10b | 10 | 0 | -40°C~85°C TA | Tray | 2009 | LPC3100 | e1 | Obsolete | 3 (168 Hours) | 208 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.65mm | NOT SPECIFIED | LPC315* | 208 | S-PBGA-B208 | Not Qualified | 1.3V | 1.21.8/3.3V | 1.1V | External | 180MHz | 192K x 8 | 1.1V~3.6V | MICROCONTROLLER, RISC | ARM9® | DMA, I2S, LCD, PWM, WDT | 25MHz | ROMless | 16/32-Bit | EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG | 32 | YES | YES | YES | YES | FLASH | 1.15mm | 12mm | 12mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
 | Mfr Part No HD6417705BP100BV | Renesas | Datasheet | 1217 |
| Min: 1 Mult: 1 | Surface Mount | 208-TFBGA | 208-TFBGA (12x12) | HD6417705 | A/D 4x10b | Renesas Electronics America Inc | 105 | Tray | Obsolete | -20°C ~ 75°C (TA) | SuperH® SH7700 | Internal | 100MHz | 32K x 8 | 1.4V ~ 1.6V | SH-3 | DMA, POR, PWM, WDT | ROMless | 32-Bit Single-Core | - | EBI/EMI, FIFO, IrDA, SCI, USB | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No HD6417705BP100BV | Rochester Electronics, LLC | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 208-TFBGA | 208-TFBGA (12x12) | A/D 4x10b | 105 | -20°C~75°C TA | Tray | SuperH® SH7700 | Obsolete | 3 (168 Hours) | Internal | 100MHz | 32K x 8 | 1.4V~1.6V | SH-3 | DMA, POR, PWM, WDT | ROMless | 32-Bit | EBI/EMI, FIFO, IrDA, SCI, USB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LPC3152FET208,551 | Rochester Electronics, LLC | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 208-TFBGA | 208-TFBGA (12x12) | A/D 3x10b | 10 | -40°C~85°C TA | Tray | LPC3100 | Obsolete | 3 (168 Hours) | External | 180MHz | 192K x 8 | 1.1V~3.6V | ARM9® | DMA, I2S, LCD, PWM, WDT | ROMless | 16/32-Bit | EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No FIDO1100BGA208IR1 | Analog Devices Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 208-TFBGA | YES | A/D 8x10b | 72 | -40°C~85°C TA | Tray | fido™ | Obsolete | 3 (168 Hours) | 208 | BOTTOM | BALL | 2.5V | 0.5mm | FIDO1100 | S-PBGA-B208 | 2.75V | 2.25V | Internal | 66MHz | 24K x 8 | 2.25V~3.6V | SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS | CPU32 | DMA, POR, WDT | 2.6MHz | RREM | 32-Bit | 32KB 32K x 8 | CANbus, EBI/EMI, EIA-232, Ethernet, GPIO, HDLC, I2C, SMBus, SPI | 16 | SPI; UART | 1.2mm | 10mm | 10mm | ROHS3 Compliant |
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LPC1778FET208,551
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
LPC2468FET208,551
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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LPC1788FET208,551
NXP USA Inc.
Package:Embedded - Microcontrollers
25.154376
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FIDO1100BGB208IR1
Analog Devices Inc.
Package:Embedded - Microcontrollers
141.225853
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LPC4078FET208,551
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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LPC2470FET208,551
NXP USA Inc.
Package:Embedded - Microcontrollers
14.422682
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LPC4088FET208,551
NXP USA Inc.
Package:Embedded - Microcontrollers
15.281918
-
LPC2478FET208,551
NXP USA Inc.
Package:Embedded - Microcontrollers
57.717238
-
LPC2460FET208,551
NXP USA Inc.
Package:Embedded - Microcontrollers
14.817807
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LPC2420FET208,551
NXP USA Inc.
Package:Embedded - Microcontrollers
15.788519
-
LPC3152FET208,551
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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LPC3154FET208,551
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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HD6417705BP100BV
Renesas
Package:Embedded - Microcontrollers
48.855399
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HD6417705BP100BV
Rochester Electronics, LLC
Package:Embedded - Microcontrollers
Price: please inquire
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LPC3152FET208,551
Rochester Electronics, LLC
Package:Embedded - Microcontrollers
Price: please inquire
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FIDO1100BGA208IR1
Analog Devices Inc.
Package:Embedded - Microcontrollers
Price: please inquire