The category is 'Embedded - Microcontrollers'
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- Core Processor
- Core Size
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- Oscillator Type
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- Part Status
- Peripherals
- Package / Case:
256-LBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | CPU Family | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | ROM Programmability | Source Url Status Check Date | Height Seated (Max) | Length | Width | RoHS Status |
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 | Mfr Part No MK70FN1M0VMJ15 | NXP USA Inc. | Datasheet | 4000 | - | Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 256-LBGA | YES | A/D 71x16b; D/A 2x12b | 128 | 1048576 | -40°C~105°C TA | Tray | 2011 | Kinetis K70 | Active | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper - with Nickel barrier | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK70FN1M0 | S-PBGA-B256 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 150MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 60MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4F | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||
| Mfr Part No MK70FN1M0VMJ12 | NXP USA Inc. | Datasheet | 7710 | - | Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 256-LBGA | YES | A/D 71x16b; D/A 2x12b | 128 | 1048576 | -40°C~105°C TA | Tray | 2011 | Kinetis K70 | e1 | Active | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 1 V MINIMUM SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK70FN1M0 | S-PBGA-B256 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4F | 1.7mm | 17mm | 17mm | ROHS3 Compliant | ||||||||||||
| Mfr Part No MK61FX512VMJ15 | NXP USA Inc. | Datasheet | 1 | - | Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 256-LBGA | YES | A/D 77x16b; D/A 2x12b | 128 | 524288 | -40°C~105°C TA | Tray | 2002 | Kinetis K60 | e1 | Active | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK61FX512 | S-PBGA-B256 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 150MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 60MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 16K x 8 | CORTEX-M4F | 17mm | 17mm | ROHS3 Compliant | |||||||||||||
| Mfr Part No MCF54418CMJ250 | NXP USA Inc. | Datasheet | 4 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 256-LBGA | YES | A/D 8x12b; D/A 2x12b | 87 | -40°C~85°C TA | Tray | 2006 | MCF5441x | Active | 3 (168 Hours) | 256 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | NOT SPECIFIED | MCF54418 | S-PBGA-B256 | Not Qualified | 1.32V | 1.21.81.8/3.33.3V | 1.14V | Internal | 250MHz | 64K x 8 | 1.14V~1.32V | MICROPROCESSOR | Coldfire V4 | DMA, PWM, WDT | 100MHz | ROMless | 32-Bit | 1-Wire®, CANbus, EBI/EMI, Ethernet, I²C, SmartCard, SPI, SSI, UART/USART, USB, USB OTG | 32 | YES | YES | FIXED POINT | YES | ROHS3 Compliant | |||||||||||||||||||||
| Mfr Part No MCF54415CMJ250 | NXP USA Inc. | Datasheet | 2835 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 256-LBGA | YES | A/D 8x12b; D/A 2x12b | 87 | -40°C~85°C TA | Tray | 2006 | MCF5441x | e2 | Active | 3 (168 Hours) | 256 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MCF54415 | S-PBGA-B256 | Not Qualified | 1.32V | 1.21.81.8/3.33.3V | 1.14V | Internal | 250MHz | 64K x 8 | 1.14V~1.32V | MICROPROCESSOR | Coldfire V4 | DMA, PWM, WDT | 100MHz | ROMless | 32-Bit | 1-Wire®, CANbus, EBI/EMI, Ethernet, I²C, SmartCard, SPI, SSI, UART/USART, USB, USB OTG | 32 | YES | YES | FIXED POINT | YES | ROHS3 Compliant | |||||||||||||||||||
| Mfr Part No MCF5282CVM66 | NXP USA Inc. | Datasheet | 1200 | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | A/D 8x10b | 150 | -40°C~85°C TA | Tray | 2002 | MCF528x | e1 | Not For New Designs | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.5mm | 40 | MCF5282 | S-PBGA-B256 | Not Qualified | 3.6V | 2.7V | External | 66MHz | 64K x 8 | 2.7V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | 1.6mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||
| Mfr Part No MCF5329CVM240 | NXP USA Inc. | Datasheet | 820 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | YES | 94 | -40°C~85°C TA | Tray | 2006 | MCF532x | e1 | Not For New Designs | 3 (168 Hours) | 256 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5329 | S-PBGA-B256 | Not Qualified | 1.6V | 1.4V | External | 240MHz | 32K x 8 | 1.4V~3.6V | MICROPROCESSOR, RISC | Coldfire V3 | DMA, LCD, PWM, WDT | 80MHz | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG | 32 | 24 | YES | YES | 32 | FIXED POINT | YES | 1.6mm | 17mm | 17mm | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No MK70FX512VMJ12 | NXP USA Inc. | Datasheet | 2 | - | Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 256-LBGA | YES | A/D 71x16b; D/A 2x12b | 128 | 524288 | -40°C~105°C TA | Tray | 2002 | Kinetis K70 | e1 | Active | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 1 V MINIMUM SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK70FX512 | S-PBGA-B256 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 16K x 8 | CORTEX-M4F | 1.7mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||
 | Mfr Part No LPC4370FET256E | NXP USA Inc. | Datasheet | 8 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | YES | A/D 16x10b, 6x12b; D/A 1x10b | 164 | 288768 | 0 | -40°C~85°C TA | Tray | 2010 | LPC43xx | Active | 3 (168 Hours) | 256 | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1mm | NOT SPECIFIED | 256 | S-PBGA-B256 | Not Qualified | 3.6V | 2.5/3.3V | 2.2V | Internal | 204MHz | 282K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0/M0 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | 25MHz | ROMless | 32-Bit Tri-Core | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, SSC, UART/USART, USB | 32 | YES | YES | YES | YES | CORTEX-M4F | FLASH | 1.55mm | 17mm | 17mm | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No MCF5328CVM240 | NXP USA Inc. | Datasheet | 1936 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | YES | 94 | -40°C~85°C TA | Tray | 2006 | MCF532x | e1 | Not For New Designs | 3 (168 Hours) | 256 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5328 | S-PBGA-B256 | Not Qualified | 1.6V | 1.4V | External | 240MHz | 32K x 8 | 1.4V~3.6V | MICROPROCESSOR, RISC | Coldfire V3 | DMA, LCD, PWM, WDT | 80MHz | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG | 32 | 24 | YES | YES | 32 | FIXED POINT | YES | 1.6mm | 17mm | 17mm | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No MK70FX512VMJ15 | NXP USA Inc. | Datasheet | 2014 | - | Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 256-LBGA | YES | A/D 71x16b; D/A 2x12b | 128 | 524288 | -40°C~105°C TA | Tray | 2011 | Kinetis K70 | e1 | Active | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK70FX512 | S-PBGA-B256 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 150MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 60MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 16K x 8 | CORTEX-M4F | 17mm | 17mm | ROHS3 Compliant | |||||||||||||
| Mfr Part No MK61FN1M0VMJ12 | NXP USA Inc. | Datasheet | 4 | - | Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 256-LBGA | YES | A/D 77x16b; D/A 2x12b | 128 | 1048576 | -40°C~105°C TA | Tray | 2002 | Kinetis K60 | e1 | Active | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 1 V MINIMUM SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 3V | 1mm | 40 | MK61FN1M0 | S-PBGA-B256 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4 | 1.7mm | 17mm | 17mm | ROHS3 Compliant | ||||||||||||
| Mfr Part No LPC4337JET256,551 | NXP USA Inc. | Datasheet | 1368 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | YES | A/D 8x10b; D/A 1x10b | 164 | 1048576 | -40°C~105°C TA | Tray | 2010 | LPC43xx | e1 | Active | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1mm | NOT SPECIFIED | LPC4337 | 256 | S-PBGA-B256 | Not Qualified | 3.6V | 2.5/3.3V | 2.2V | Internal | 204MHz | 136K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit Dual-Core | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 24 | 16K x 8 | CORTEX-M4 | 32 | 1.55mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||
| Mfr Part No MK61FX512VMJ12 | NXP USA Inc. | Datasheet | 4000 | - | Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 256-LBGA | YES | A/D 77x16b; D/A 2x12b | 128 | 524288 | -40°C~105°C TA | Tray | 2011 | Kinetis K60 | e1 | Active | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 1 V MINIMUM SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 3V | 1mm | 40 | MK61FX512 | S-PBGA-B256 | Not Qualified | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 16K x 8 | CORTEX-M4 | 1.7mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||
| Mfr Part No LPC43S57JET256E | NXP USA Inc. | Datasheet | 1600 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | A/D 8x10b; D/A 1x10b | 164 | -40°C~105°C TA | Tray | 2010 | LPC43xx | Active | 3 (168 Hours) | 260 | NOT SPECIFIED | 256 | Internal | 204MHz | 136K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0 | Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, WDT | FLASH | 32-Bit Dual-Core | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No LPC1857FET256,551 | NXP USA Inc. | Datasheet | 284 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | YES | A/D 8x10b; D/A 1x10b | 164 | 1048576 | -40°C~85°C TA | Tray | 2010 | LPC18xx | e1 | Active | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 1mm | 30 | LPC1857 | 256 | S-PBGA-B256 | Not Qualified | 3.6V | 2.5/3.3V | 2.2V | Internal | 180MHz | 136K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 24 | 16K x 8 | CORTEX-M3 | 32 | 2013-06-14 00:00:00 | 1.55mm | 17mm | 17mm | ROHS3 Compliant | ||||||||||
| Mfr Part No LPC4357JET256,551 | NXP USA Inc. | Datasheet | 1243 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | YES | A/D 8x10b; D/A 1x10b | 164 | 1048576 | -40°C~105°C TA | Tray | 2010 | LPC43xx | e1 | Active | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1mm | NOT SPECIFIED | LPC4357 | 256 | S-PBGA-B256 | Not Qualified | 2.5/3.3V | Internal | 204MHz | 136K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0 | Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT | FLASH | 32-Bit Dual-Core | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 16K x 8 | CORTEX-M4 | 1.55mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||||
| Mfr Part No LPC1850FET256,551 | NXP USA Inc. | Datasheet | 68 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | YES | A/D 8x10b; D/A 1x10b | 164 | 65536 | -40°C~85°C TA | Tray | 2010 | LPC18xx | e1 | Active | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1mm | NOT SPECIFIED | LPC1850 | 256 | S-PBGA-B256 | Not Qualified | 3.6V | 2.5/3.3V | 2.2V | Internal | 180MHz | 200K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | 25MHz | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 24 | CORTEX-M3 | 32 | FLASH | 2013-06-14 00:00:00 | 1.55mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||
| Mfr Part No MCF5274CVM166 | NXP USA Inc. | Datasheet | 5 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 256-LBGA | YES | 69 | -40°C~85°C TA | Tray | 1997 | MCF527x | e1 | Not For New Designs | 3 (168 Hours) | 256 | 5A992 | TIN SILVER COPPER | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5274 | S-PBGA-B256 | Not Qualified | 1.6V | 1.4V | External | 166MHz | 64K x 8 | 1.4V~1.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 83MHz | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | 24 | YES | YES | 32 | FIXED POINT | YES | 1.6mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||
| Mfr Part No MCF5275CVM166 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | YES | 69 | -40°C~85°C TA | Tray | 1997 | MCF527x | e1 | Not For New Designs | 3 (168 Hours) | 256 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5275 | S-PBGA-B256 | Not Qualified | 1.6V | 1.4V | External | 166MHz | 64K x 8 | 1.4V~1.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 83MHz | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | 24 | YES | YES | 32 | FIXED POINT | YES | 1.6mm | 17mm | 17mm | ROHS3 Compliant |
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MK70FN1M0VMJ15
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MK70FN1M0VMJ12
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MK61FX512VMJ15
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCF54418CMJ250
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCF54415CMJ250
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCF5282CVM66
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCF5329CVM240
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MK70FX512VMJ12
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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LPC4370FET256E
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCF5328CVM240
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MK70FX512VMJ15
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MK61FN1M0VMJ12
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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LPC4337JET256,551
NXP USA Inc.
Package:Embedded - Microcontrollers
18.257877
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MK61FX512VMJ12
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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LPC43S57JET256E
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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LPC1857FET256,551
NXP USA Inc.
Package:Embedded - Microcontrollers
27.253645
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LPC4357JET256,551
NXP USA Inc.
Package:Embedded - Microcontrollers
23.962859
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LPC1850FET256,551
NXP USA Inc.
Package:Embedded - Microcontrollers
20.231467
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MCF5274CVM166
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCF5275CVM166
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire