The category is 'Embedded - Microcontrollers'
- All Manufacturers
- Connectivity
- Core Processor
- Core Size
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Number of I/Os
- Operating Temperature
- Oscillator Type
- Package / Case
- Packaging
- Part Status
- Peripherals
- Package / Case:
256-LBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Data Converters | Memory Types | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | EEPROM Size | On Chip Program ROM Width | CPU Family | Max Frequency | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Number of Programmable I/O | Format | Integrated Cache | ROM Programmability | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No LPC43S70FET256E | NXP USA Inc. | Datasheet | 84 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | A/D 3x12b; D/A 1x10b | 164 | -40°C~85°C TA | Tray | 2010 | LPC43xx | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 256 | Internal | 204MHz | 282K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | ROMless | 32-Bit Dual-Core | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MCF5282CVM80 | NXP USA Inc. | Datasheet | 160 | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | A/D 8x10b | 150 | -40°C~85°C TA | Tray | 2002 | MCF528x | e1 | Not For New Designs | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MCF5282 | S-PBGA-B256 | Not Qualified | 3.6V | 2.7V | External | 80MHz | 64K x 8 | 2.7V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 80MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | 32 | YES | YES | YES | NO | 24 | 32 | 1.6mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
| Mfr Part No MCF5233CVM150 | NXP USA Inc. | Datasheet | 167 | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 97 | -40°C~85°C TA | Tray | 1999 | MCF523x | Not For New Designs | 3 (168 Hours) | 256 | 5A992 | Tin/Silver/Copper - with Nickel barrier | LOW POWER MODE TAKEN FROM LOW POWER MODE | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5233 | S-PBGA-B256 | Not Qualified | 1.6V | 1.4V | External | 150MHz | 64K x 8 | 1.4V~1.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 75MHz | ROMless | 32-Bit | CANbus, EBI/EMI, I2C, SPI, UART/USART | 32 | 24 | YES | YES | 32 | FIXED POINT | YES | 1.6mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
 | Mfr Part No LPC43S50FET256,551 | NXP USA Inc. | Datasheet | 87 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | A/D 8x10b; D/A 1x10b | 164 | -40°C~85°C TA | Tray | 2010 | LPC43xx | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 256 | Internal | 204MHz | 264K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0 | Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT | ROMless | 32-Bit Dual-Core | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AT32AP7000-CTUR | Microchip Technology | Datasheet | 1540 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 256-LBGA | 256 | 256-CTBGA (17x17) | D/A 2x16b | ROMless | 160 | -40°C~85°C TA | Tape & Reel (TR) | 2006 | AVR®32 AP7 | Obsolete | 3 (168 Hours) | 85°C | -40°C | 150MHz | AT32AP7000 | EBI/EMI, Ethernet, I2C, MMC, SPI, UART, USART, USB | 1.95V | 1.65V | 32kB | Internal | 150MHz | 32K x 8 | 1.65V~1.95V | AVR | AC'97, DMA, I2S, LCD, POR, PWM, WDT | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, Memory Card, PS/2, SPI, SSC, UART/USART, USB | 32b | 3 | AVR | 150MHz | 160 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No SPC5646CCF0MMJ1 | NXP USA Inc. | Datasheet | 50 |
| Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 256-LBGA | YES | A/D 33x10b, 10x12b | 199 | 3145728 | Automotive grade | -40°C~125°C TA | Bulk | 2007 | MPC56xx Qorivva | Active | 3 (168 Hours) | 256 | 8542.31.00.01 | BOTTOM | BALL | 3.3V | 1mm | SPC5646 | S-PBGA-B256 | Not Qualified | 3.6V | 3.3/5V | 3V | Internal | 80MHz/120MHz | 256K x 8 | 3V~5.5V | MICROCONTROLLER RISC | e200z4d, e200z0h | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 3MB 3M x 8 | CANbus, Ethernet, I2C, LINbus, SCI, SPI | 300mA | 32 | YES | YES | YES | 64K x 8 | AEC-Q100 | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
 | Mfr Part No SPC5748GHK0AMMJ6 | NXP USA Inc. | Datasheet | 80 | - | Min: 1 Mult: 1 | 17 Weeks | Surface Mount | 256-LBGA | YES | A/D 80x10b, 64x12b | 178 | 786432 | 6291456 | Automotive grade | -40°C~125°C TA | Tray | MPC57xx | Active | 3 (168 Hours) | 256 | 5A992 | EEPROM SUP : 32KB-192KB EMULATED, ADC CH(INT AND EXT) BASED ON PACKAGE, SUPPORT CAN FD, 2ND ETHERNET | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | S-PBGA-B256 | 1.32V | 1.08V | Internal | 80MHz/160MHz | 768K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z2, e200z4, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Tri-Core | 6MB 6M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | 32 | YES | YES | NO | NO | 8 | ISO 26262 | 1.7mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
| Mfr Part No LPC43S67JET256E | NXP USA Inc. | Datasheet | 800 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | A/D 16x10b; D/A 1x10b | 164 | -40°C~105°C TA | Bulk | 2010 | LPC43xx | Active | 3 (168 Hours) | 260 | NOT SPECIFIED | 256 | Internal | 204MHz | 154K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | FLASH | 32-Bit Dual-Core | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG | 16K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No SPC5746CSK1MMJ6R | NXP USA Inc. | Datasheet | 16 |
| Min: 1 Mult: 1 | 18 Weeks | Surface Mount | 256-LBGA | YES | A/D 80x10b, 64x12b | 178 | -40°C~125°C TA | Tape & Reel (TR) | MPC57xx | yes | Active | 3 (168 Hours) | 256 | BOTTOM | BALL | 260 | 1.25V | 1mm | 40 | 1.32V | 1.2V | Internal | 80MHz/160MHz | 512K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z2, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 3MB 3M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | 32 | YES | YES | NO | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LPC18S30FET256E | NXP USA Inc. | Datasheet | 37 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | A/D 8x10b; D/A 1x10b | 164 | -40°C~85°C TA | Tray | 2010 | LPC18xx | Active | 3 (168 Hours) | 256 | Internal | 180MHz | 200K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MCF5281CVM80 | NXP USA Inc. | Datasheet | 1678 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 256-LBGA | YES | A/D 8x10b | 142 | -40°C~85°C TA | Tray | 2002 | MCF528x | e1 | Not For New Designs | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MCF5281 | S-PBGA-B256 | Not Qualified | 3.6V | 2.7V | External | 80MHz | 64K x 8 | 2.7V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 80MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | YES | YES | YES | NO | 24 | 32 | 1.6mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
| Mfr Part No MCF5282CVM66J | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256-MAPBGA (17x17) | A/D 8x10b | 150 | -40°C~85°C TA | Tray | 2006 | MCF528x | Obsolete | 3 (168 Hours) | MCF5282 | External | 66MHz | 64K x 8 | 2.7V~3.6V | Coldfire V2 | DMA, LVD, POR, PWM, WDT | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LPC1857JET256,551 | NXP USA Inc. | Datasheet | 189 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | YES | A/D 8x10b; D/A 1x10b | 164 | 1048576 | -40°C~105°C TA | Tray | 2010 | LPC18xx | e1 | Active | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 3.3V | 1mm | LPC1857 | 256 | S-PBGA-B256 | Not Qualified | 3.6V | 2.5/3.3V | 2.2V | Internal | 180MHz | 136K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | 32 | YES | YES | YES | 16K x 8 | CORTEX-M3 | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
 | Mfr Part No MK70FN1M0VMJ12R | NXP USA Inc. | Datasheet | 13 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 256-LBGA | YES | A/D 71x16b; D/A 2x12b | 128 | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis K70 | Active | 3 (168 Hours) | 256 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | S-PBGA-B256 | 3.6V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 1.7mm | 17mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MCF5280CVM80 | NXP USA Inc. | Datasheet | 8000 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 256-LBGA | YES | A/D 8x10b | 142 | -40°C~85°C TA | Tray | 2002 | MCF528x | e1 | Not For New Designs | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MCF5280 | S-PBGA-B256 | Not Qualified | 3.6V | 2.7V | External | 80MHz | 64K x 8 | 2.7V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 80MHz | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | YES | YES | YES | NO | 24 | 32 | FLASH | 1.6mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
| Mfr Part No LPC1837JET256,551 | NXP USA Inc. | Datasheet | 2800 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | YES | A/D 8x10b; D/A 1x10b | 164 | 1048576 | -40°C~105°C TA | Tray | 2010 | LPC18xx | e1 | Active | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 3.3V | 1mm | LPC1837 | 256 | S-PBGA-B256 | Not Qualified | 3.6V | 2.5/3.3V | 2.2V | Internal | 180MHz | 136K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | 32 | YES | YES | YES | 16K x 8 | CORTEX-M3 | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
| Mfr Part No MCF5274VM166 | NXP USA Inc. | Datasheet | 16 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | YES | 69 | 0°C~70°C TA | Tray | 1997 | MCF527x | e1 | Not For New Designs | 3 (168 Hours) | 256 | 5A992 | TIN SILVER COPPER | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5274 | S-PBGA-B256 | Not Qualified | 1.6V | 1.4V | External | 166MHz | 64K x 8 | 1.4V~1.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 83MHz | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | 24 | YES | YES | 32 | FIXED POINT | YES | 1.6mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
| Mfr Part No LPC18S50FET256,551 | NXP USA Inc. | Datasheet | 37 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | A/D 8x10b; D/A 1x10b | 164 | -40°C~85°C TA | Tray | 2010 | LPC18xx | Active | 3 (168 Hours) | 256 | Internal | 180MHz | 200K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LPC18S57JET256E | NXP USA Inc. | Datasheet | 24 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | A/D 8x10b; D/A 1x10b | 164 | -40°C~105°C TA | Tray | 2010 | LPC18xx | Active | 3 (168 Hours) | 260 | NOT SPECIFIED | 256 | Internal | 180MHz | 136K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SPC5748GGK1MMJ6R | NXP USA Inc. | Datasheet | 3751 |
| Min: 1 Mult: 1 | 18 Weeks | Surface Mount | 256-LBGA | YES | A/D 80x10b, 64x12b | 178 | 786432 | 6291456 | Automotive grade | -40°C~125°C TA | Tape & Reel (TR) | 2011 | MPC57xx | yes | Active | 3 (168 Hours) | 256 | EEPROM SUP : 32KB-192KB EMULATED, ADC CH(INT AND EXT) BASED ON PACKAGE, SUPPORT CAN FD, 2ND ETHERNET | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | S-PBGA-B256 | 1.32V | 1.08V | Internal | 80MHz/160MHz | 768K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z2, e200z4, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Tri-Core | 6MB 6M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | 32 | YES | YES | NO | NO | 8 | ISO 26262 | 1.7mm | 17mm | 17mm | ROHS3 Compliant |
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LPC43S70FET256E
NXP USA Inc.
Package:Embedded - Microcontrollers
23.722738
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MCF5282CVM80
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCF5233CVM150
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
LPC43S50FET256,551
NXP USA Inc.
Package:Embedded - Microcontrollers
21.781530
-
AT32AP7000-CTUR
Microchip Technology
Package:Embedded - Microcontrollers
Price: please inquire
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SPC5646CCF0MMJ1
NXP USA Inc.
Package:Embedded - Microcontrollers
54.300780
-
SPC5748GHK0AMMJ6
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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LPC43S67JET256E
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
SPC5746CSK1MMJ6R
NXP USA Inc.
Package:Embedded - Microcontrollers
58.660636
-
LPC18S30FET256E
NXP USA Inc.
Package:Embedded - Microcontrollers
18.416636
-
MCF5281CVM80
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCF5282CVM66J
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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LPC1857JET256,551
NXP USA Inc.
Package:Embedded - Microcontrollers
37.206762
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MK70FN1M0VMJ12R
NXP USA Inc.
Package:Embedded - Microcontrollers
25.116483
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MCF5280CVM80
NXP USA Inc.
Package:Embedded - Microcontrollers
62.053980
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LPC1837JET256,551
NXP USA Inc.
Package:Embedded - Microcontrollers
24.926149
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MCF5274VM166
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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LPC18S50FET256,551
NXP USA Inc.
Package:Embedded - Microcontrollers
20.343519
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LPC18S57JET256E
NXP USA Inc.
Package:Embedded - Microcontrollers
15.109181
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SPC5748GGK1MMJ6R
NXP USA Inc.
Package:Embedded - Microcontrollers
50.172005