The category is 'Embedded - Microcontrollers'
Embedded - Microcontrollers (1117)
- All Manufacturers
- Bit Size
- Core Size
- Factory Lead Time
- Length
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Number of I/Os
- Number of Terminations
- Operating Temperature
- Oscillator Type
- Packaging
- Power Supplies
- Power Supplies:
3.3V
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Max Power Dissipation | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Number of Bits | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | Density | EEPROM Size | On Chip Program ROM Width | CPU Family | Low Power Mode | Screening Level | Number of A/D Converters | External Data Bus Width | Format | Integrated Cache | RAM (words) | Number of ADC Channels | Number of Timers | ROM Programmability | Number of I2C Channels | On Chip Data RAM Width | Number of GPIO | Number of SPI Channels | Source Url Status Check Date | Height | Height Seated (Max) | Length | Width | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
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 | Mfr Part No PIC18F67J50T-I/PT | Microchip Technology | Datasheet | 8004 |
| Min: 1 Mult: 1 | 13 Weeks | Tin | Surface Mount | Surface Mount | 64-TQFP | 64 | A/D 8x10b | 49 | -40°C~85°C TA | Tape & Reel (TR) | 2007 | PIC® 18J | e3 | yes | Active | 3 (168 Hours) | 64 | 3A991.A.2 | ALSO OPERATES AT 2V MINIMUM SUPPLY AT 8 MHZ | 1W | QUAD | GULL WING | 260 | 3V | 48MHz | 40 | PIC18F67J50 | 64 | 3.6V | 3.3V | I2C, SPI, UART, USART, USB | 128kB | Internal | 3.8K x 8 | 2V~3.6V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, LVD, POR, PWM, WDT | FLASH | 8-Bit | 128KB 64K x 16 | I2C, SPI, UART/USART, USB | 8 | YES | NO | 8b | YES | NO | 5 | 16 | PIC | 1.2mm | 10mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MC56F8025VLDR | NXP USA Inc. | Datasheet | 27 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 44-LQFP | YES | A/D 8x12b; D/A 2x12b | 35 | 16384 | -40°C~105°C TA | Tape & Reel (TR) | 1998 | 56F8xxx | e3 | Active | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.8mm | 40 | MC56F8025 | S-PQFP-G44 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 32MHz | 2K x 16 | 3V~3.6V | MICROCONTROLLER | 56800E | POR, PWM, WDT | 8MHz | FLASH | 16-Bit | 32KB 16K x 16 | I2C, LINbus, SCI, SPI | 16 | YES | NO | YES | YES | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No PIC24FJ32MC102-I/SS | Microchip Technology | Datasheet | 23 | - | Min: 1 Mult: 1 | 9 Weeks | Surface Mount | 28-SSOP (0.209, 5.30mm Width) | YES | 28 | A/D 8x10b | 21 | 32768 | -40°C~85°C TA | Tube | 2012 | PIC® 24F | e3 | Active | 1 (Unlimited) | 28 | 3A991.A.2 | Matte Tin (Sn) - annealed | 8542.31.00.01 | DUAL | GULL WING | 260 | 3.3V | 0.65mm | 40 | PIC24FJ32MC102 | Not Qualified | 3.6V | 3.3V | 3V | I2C, IrDA, LIN, SPI, UART, USART | Internal | 16 MIPs | 1K x 16 | 3V~3.6V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, Motor Control PWM, POR, PWM, WDT | 32MHz | FLASH | 16-Bit | 32KB 11K x 24 | I2C, IrDA, LINbus, SPI, UART/USART | 16 | YES | NO | 16b | YES | NO | 8 | PIC | YES | NO | 1024 | 5 | 16 | 2mm | 10.2mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LPC2361FBD100,551 | NXP USA Inc. | Datasheet | 144 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 100-LQFP | YES | A/D 6x10b; D/A 1x10b | 70 | 65536 | -40°C~85°C TA | Tray | 2003 | LPC2300 | e3 | Not For New Designs | 3 (168 Hours) | 100 | EAR99 | Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | NOT SPECIFIED | LPC2361 | 100 | S-PQFP-G100 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 72MHz | 34K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM7® | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 25MHz | FLASH | 16/32-Bit | 64KB 64K x 8 | CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG | 32 | YES | YES | YES | YES | 1.6mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LPC1751FBD80 | NXP Semiconductors / Freescale | Datasheet | 79 | - | Min: 1 Mult: 1 | LQFP | YES | 80 | 52 | 8192 | e3 | yes | 2 (1 Year) | 80 | SMD/SMT | Tin (Sn) | 85°C | -40°C | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 100MHz | 30 | 80 | Not Qualified | 3.3V | INDUSTRIAL | CAN, I2C, SPI, SSP, UART, USB | 3.6V | 2.4V | 32kB | 8kB | MICROCONTROLLER, RISC | DMA | 32 | YES | YES | YES | 4 | 256 kb | 6 | FLASH | 52 | 12mm | 12mm | No SVHC | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No R5F56104VDFP#V0 | Renesas Electronics America | Datasheet | 5 |
| Min: 1 Mult: 1 | 20 Weeks | Surface Mount | 100-LQFP | YES | 144 | A/D 16x10b; D/A 2x10b | 117 | 786432 | -40°C~85°C TA | Tray | 2013 | RX600 | yes | Active | 3 (168 Hours) | 144 | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | 100MHz | NOT SPECIFIED | R5F5610 | 144 | Not Qualified | 3.6V | 3.3V | 3V | EBI/EMI, I2C, SCI | 768kB | External | 128K x 8 | 3V~3.6V | MICROCONTROLLER | RX | DMA, POR, PWM, WDT | FLASH | 32-Bit | 768KB 768K x 8 | EBI/EMI, I2C, SCI | 100mA | 32 | YES | YES | YES | YES | 24 | RX | 16 | 1.7mm | 20mm | 20mm | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No R5F61653RN50FPV | Renesas Electronics America | Datasheet | 536 | - | Min: 1 Mult: 1 | 20 Weeks | Surface Mount | 120-LQFP | YES | 120 | A/D 8x10b; D/A 2x8b | 75 | 393216 | -20°C~75°C TA | Tray | 2005 | H8® H8SX/1600 | yes | Active | 3 (168 Hours) | 120 | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.4mm | 50MHz | NOT SPECIFIED | R5F61653 | 120 | Not Qualified | 3.6V | 3.3V | 3V | EBI/EMI, I2C, IrDA, SCI, USB | 384kB | External | 40K x 8 | 3V~3.6V | MICROCONTROLLER | H8SX | DMA, LVD, POR, PWM, WDT | FLASH | 32-Bit | 384KB 384K x 8 | EBI/EMI, I2C, IrDA, SCI, SmartCard, USB | 85mA | 32 | YES | YES | YES | YES | 21 | 16 | 1.7mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No PIC24EP512GP202-I/SO | Microchip Technology | Datasheet | 12 |
| Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 28-SOIC (0.295, 7.50mm Width) | 28 | A/D 6x10b/12b | 21 | 174762 | -40°C~85°C TA | Tube | 2013 | PIC® 24EP | e3 | Active | 3 (168 Hours) | 28 | 3A001.A.3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 1.27mm | 70MHz | 40 | PIC24EP512GP202 | Not Qualified | 3.6V | 3.3V | 3V | I2C, IrDA, LIN, SPI, UART, USART | 512kB | Internal | 24K x 16 | 3V~3.6V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 16-Bit | 512KB 170K x 24 | I2C, IrDA, LINbus, SPI, UART/USART | 16 | YES | YES | 16b | YES | NO | 5 | 24 | PIC | 17.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LPC11A04UK,118 | NXP USA Inc. | Datasheet | 27 |
| Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 20-UFBGA, WLCSP | YES | A/D 8x10b; D/A 1x10b | 18 | 8192 | 32768 | -40°C~85°C TA | Tape & Reel (TR) | 2008 | LPC11Axx | Active | 1 (Unlimited) | 20 | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | 20 | S-PBGA-B20 | Not Qualified | 3.6V | 3.3V | 2.6V | Internal | 50MHz | 8K x 8 | 2.6V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART | 32 | YES | YES | YES | YES | 4K x 8 | CORTEX-M0 | 2013-06-14 00:00:00 | 0.65mm | 2.55mm | 2.55mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No PIC24EP512GU810-I/BG | Microchip Technology | Datasheet | 2400 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 121-TFBGA | YES | 121 | A/D 32x10b/12b | 83 | -40°C~85°C TA | Tray | 2012 | PIC® 24EP | e1 | Active | 3 (168 Hours) | 121 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 0.8mm | 60MHz | NOT SPECIFIED | PIC24EP512GU810 | 121 | Not Qualified | 3.6V | 3.3V | 3V | CAN, I2C, IrDA, LIN, SPI, UART, USART, USB | 536kB | Internal | 24K x 16 | 3V~3.6V | MICROCONTROLLER | 16 | PIC | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 16-Bit | 512KB 170K x 24 | CANbus, I2C, IrDA, LINbus, SPI, UART/USART, USB OTG | 16 | YES | YES | 16b | YES | 9 | PIC | 1 | 32 | 2 | 4 | 1.2mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LPC2365FBD100,551 | NXP USA Inc. | Datasheet | 46 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 100-LQFP | YES | A/D 6x10b; D/A 1x10b | 70 | 262144 | -40°C~85°C TA | Tray | 2003 | LPC2300 | e3 | Not For New Designs | 3 (168 Hours) | 100 | EAR99 | Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | NOT SPECIFIED | LPC2365 | 100 | S-PQFP-G100 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 72MHz | 58K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM7® | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 25MHz | FLASH | 16/32-Bit | 256KB 256K x 8 | Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART | 32 | YES | YES | YES | YES | 16 | 1.6mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No SPC56EL54L3CBFSR | STMicroelectronics | Datasheet | 40000 |
| Min: 1 Mult: 1 | 26 Weeks | ACTIVE (Last Updated: 7 months ago) | Surface Mount | 100-LQFP | YES | A/D 32x12b | 16 | 786432 | -40°C~125°C TA | Tray | Automotive, AEC-Q100, SPC56xL | Active | 3 (168 Hours) | 100 | 3A991.A.2 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | SPC56E | S-PQFP-G100 | Not Qualified | 3.63V | 3.3V | 3V | Internal | 120MHz | 96K x 8 | 3V~3.63V | MICROCONTROLLER | e200z4d | DMA, LVD, POR, PWM, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 768KB 768K x 8 | CANbus, LINbus, SCI, SPI, UART/USART | 311.6mA | 32 | YES | YES | YES | 32 | 64 | 14mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No DSPIC33EP512GM304-E/ML | Microchip Technology | Datasheet | 356 | - | Min: 1 Mult: 1 | 23 Weeks | Surface Mount | 44-VQFN Exposed Pad | YES | 44 | A/D 18x10b/12b | 35 | 524288 | Automotive grade | -40°C~125°C TA | Tube | 2013 | Automotive, AEC-Q100, dsPIC™ 33EP | e3 | Active | 1 (Unlimited) | 44 | 3A001.A.3 | Matte Tin (Sn) - annealed | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3.3V | 0.65mm | 40 | DSPIC33EP512GM304 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 60 MIPs | 48K x 8 | 3V~3.6V | MICROCONTROLLER | dsPIC | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 60MHz | FLASH | 16-Bit | 512KB 170K x 24 | I2C, IrDA, LINbus, QEI, SPI, UART/USART | 50mA | 16 | YES | YES | YES | NO | 8 | TS 16949 | FLOATING-POINT | 24576 | 1mm | 8mm | 8mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LPC1786FBD208,551 | NXP USA Inc. | Datasheet | 8 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 208-LQFP | YES | A/D 8x12b; D/A 1x10b | 165 | 262144 | -40°C~85°C TA | Tray | 2007 | LPC17xx | e3 | Active | 2 (1 Year) | 208 | EAR99 | Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | NOT SPECIFIED | LPC1786 | 208 | S-PQFP-G208 | Not Qualified | 3.6V | 3.3V | 2.4V | Internal | 120MHz | 80K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | 32 | YES | YES | YES | YES | 26 | 4K x 8 | CORTEX-M3 | 32 | 1.6mm | 28mm | 28mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LPC2478FET208,551 | NXP USA Inc. | Datasheet | 157 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 208-TFBGA | YES | A/D 8x10b; D/A 1x10b | 160 | 524288 | -40°C~85°C TA | Tray | 2003 | LPC2400 | e1 | Not For New Designs | 2 (1 Year) | 208 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | NOT SPECIFIED | LPC2478 | 208 | S-PBGA-B208 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 72MHz | 96K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM7® | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | 25MHz | FLASH | 16/32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | 32 | YES | YES | YES | YES | 24 | 32 | 1.2mm | 15mm | 15mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LPC1774FBD144,551 | NXP USA Inc. | Datasheet | 57 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 144-LQFP | YES | A/D 8x12b; D/A 1x10b | 109 | 131072 | -40°C~85°C TA | Tray | 2010 | LPC17xx | e3 | Active | 2 (1 Year) | 144 | EAR99 | Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | 260 | 3.3V | 0.5mm | NOT SPECIFIED | LPC1774 | 144 | S-PQFP-G144 | Not Qualified | 3.6V | 3.3V | 2.4V | Internal | 120MHz | 40K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | 32 | YES | YES | YES | YES | 16 | 2K x 8 | CORTEX-M3 | 8 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No DSPIC33EP256GM710-I/PT | Microchip Technology | Datasheet | 2400 | - | Min: 1 Mult: 1 | 22 Weeks | Surface Mount | 100-TQFP | YES | A/D 49x10b/12b | 85 | 262144 | Automotive grade | -40°C~85°C TA | Tray | 2013 | dsPIC™ 33EP | e3 | Active | 3 (168 Hours) | 100 | 3A001.A.3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.4mm | 40 | DSPIC33EP256GM710 | S-PQFP-G100 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 70 MIPs | 32K x 8 | 3V~3.6V | MICROCONTROLLER | dsPIC | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 60MHz | FLASH | 16-Bit | 256KB 85.5K x 24 | CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART | 16 | YES | YES | YES | NO | 8 | TS 16949 | FLOATING-POINT | 16384 | 1.2mm | 12mm | 12mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LPC2460FET208,551 | NXP USA Inc. | Datasheet | 46 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 208-TFBGA | YES | A/D 8x10b; D/A 1x10b | 160 | 0 | -40°C~85°C TA | Tray | 2009 | LPC2400 | e1 | Not For New Designs | 2 (1 Year) | 208 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | NOT SPECIFIED | LPC24*0 | 208 | S-PBGA-B208 | Not Qualified | 3.6V | 3.3V | 3V | Internal | 72MHz | 96K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM7® | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 24MHz | ROMless | 16/32-Bit | CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | 32 | YES | YES | YES | YES | 24 | 32 | MROM | 1.2mm | 15mm | 15mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LPC1347FBD48,151 | NXP USA Inc. | Datasheet | 2110 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 48-LQFP | YES | A/D 8x12b | 40 | 65536 | -40°C~85°C TA | Tray | 2010 | LPC13xx | e3 | Active | 1 (Unlimited) | 48 | Tin (Sn) | QUAD | GULL WING | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | LPC1347 | 48 | S-PQFP-G48 | Not Qualified | 3.6V | 3.3V | 2V | Internal | 72MHz | 12K x 8 | 2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART, USB | 32 | YES | NO | NO | NO | 4K x 8 | CORTEX-M3 | 2013-06-14 00:00:00 | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LPC11E68JBD100E | NXP USA Inc. | Datasheet | 8 |
| Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 100-LQFP | YES | A/D 12x12b | 80 | 262144 | -40°C~105°C TA | Tray | 2010 | LPC11Exx | Active | 3 (168 Hours) | 100 | QUAD | GULL WING | 3.3V | 0.5mm | LPC11E68 | 100 | S-PQFP-G100 | Not Qualified | 3.6V | 3.3V | 2.4V | Internal | 50MHz | 36K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART | 32 | YES | YES | YES | 4K x 8 | CORTEX-M0 | 14mm | 14mm | ROHS3 Compliant |
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PIC18F67J50T-I/PT
Microchip Technology
Package:Embedded - Microcontrollers
14.873836
-
MC56F8025VLDR
NXP USA Inc.
Package:Embedded - Microcontrollers
26.625674
-
PIC24FJ32MC102-I/SS
Microchip Technology
Package:Embedded - Microcontrollers
Price: please inquire
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LPC2361FBD100,551
NXP USA Inc.
Package:Embedded - Microcontrollers
12.188072
-
LPC1751FBD80
NXP Semiconductors / Freescale
Package:Embedded - Microcontrollers
Price: please inquire
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R5F56104VDFP#V0
Renesas Electronics America
Package:Embedded - Microcontrollers
16.580480
-
R5F61653RN50FPV
Renesas Electronics America
Package:Embedded - Microcontrollers
Price: please inquire
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PIC24EP512GP202-I/SO
Microchip Technology
Package:Embedded - Microcontrollers
2.648968
-
LPC11A04UK,118
NXP USA Inc.
Package:Embedded - Microcontrollers
3.237262
-
PIC24EP512GU810-I/BG
Microchip Technology
Package:Embedded - Microcontrollers
13.477692
-
LPC2365FBD100,551
NXP USA Inc.
Package:Embedded - Microcontrollers
12.908657
-
SPC56EL54L3CBFSR
STMicroelectronics
Package:Embedded - Microcontrollers
17.602071
-
DSPIC33EP512GM304-E/ML
Microchip Technology
Package:Embedded - Microcontrollers
Price: please inquire
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LPC1786FBD208,551
NXP USA Inc.
Package:Embedded - Microcontrollers
11.721250
-
LPC2478FET208,551
NXP USA Inc.
Package:Embedded - Microcontrollers
57.858029
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LPC1774FBD144,551
NXP USA Inc.
Package:Embedded - Microcontrollers
13.100699
-
DSPIC33EP256GM710-I/PT
Microchip Technology
Package:Embedded - Microcontrollers
Price: please inquire
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LPC2460FET208,551
NXP USA Inc.
Package:Embedded - Microcontrollers
13.239640
-
LPC1347FBD48,151
NXP USA Inc.
Package:Embedded - Microcontrollers
12.315280
-
LPC11E68JBD100E
NXP USA Inc.
Package:Embedded - Microcontrollers
4.463886