The category is 'Embedded - Microcontrollers'
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HC11
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Data Converters | Number of I/Os | ROM(word) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Address Bus Width | EEPROM Size | On Chip Program ROM Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Number of Serial I/Os | ROM Programmability | On Chip Data RAM Width | Height Seated (Max) | Length | Width | RoHS Status |
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 | Mfr Part No MC68711E20CFNE2 | NXP USA Inc. | Datasheet | 32 | - | Min: 1 Mult: 1 | 11 Weeks | Surface Mount | 52-LCC (J-Lead) | YES | A/D 8x8b | 38 | -40°C~85°C TA | Tube | 2005 | HC11 | e3 | Not For New Designs | 3 (168 Hours) | 52 | EAR99 | MATTE TIN | 8542.31.00.01 | QUAD | NO LEAD | 250 | 5V | 1.27mm | 30 | MC68711 | S-PQCC-N52 | 5.5V | 4.5V | Internal | 2MHz | 768 x 8 | 4.5V~5.5V | MICROCONTROLLER | POR, WDT | 8MHz | OTP | 8-Bit | 20KB 20K x 8 | SCI, SPI | 8 | YES | NO | NO | NO | 16 | 512 x 8 | 8 | 5.08mm | 19.125mm | 19.125mm | ROHS3 Compliant | |||||||||||||||
| Mfr Part No MC68HC11E1CFNE3 | NXP USA Inc. | Datasheet | 4000 | - | Min: 1 Mult: 1 | 17 Weeks | Surface Mount | 52-LCC (J-Lead) | YES | A/D 8x8b | 38 | -40°C~85°C TA | Tube | 1999 | HC11 | e3 | Not For New Designs | 3 (168 Hours) | 52 | EAR99 | MATTE TIN | SEATED HT-CALCULATED | 8542.31.00.01 | QUAD | J BEND | 260 | 5V | 1.27mm | 40 | MC68HC11 | S-PQCC-J52 | 5.5V | 4.5V | Internal | 3MHz | 512 x 8 | 4.5V~5.5V | MICROCONTROLLER | POR, WDT | 12MHz | ROMless | 8-Bit | SCI, SPI | 8 | YES | NO | NO | NO | 16 | 512 x 8 | 8 | 5.08mm | 19.125mm | 19.125mm | ROHS3 Compliant | |||||||||||||||
 | Mfr Part No MCHC11F1CFNE3 | NXP USA Inc. | Datasheet | 104 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 68-LCC (J-Lead) | YES | A/D 8x8b | 30 | -40°C~85°C TA | Tube | 1993 | HC11 | e3 | Not For New Designs | 3 (168 Hours) | 68 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | J BEND | 250 | 5V | 1.27mm | 30 | MCHC11 | S-PQCC-J68 | 5.25V | 4.75V | Internal | 3MHz | 1K x 8 | 4.75V~5.25V | MICROCONTROLLER | POR, WDT | 12MHz | ROMless | 8-Bit | SCI, SPI | 8 | YES | NO | NO | NO | 16 | 512 x 8 | 8 | EEPROM | 4.572mm | 24.2062mm | 24.2062mm | ROHS3 Compliant | |||||||||||||||
| Mfr Part No MC68711E20CFNE3 | NXP USA Inc. | Datasheet | 1081 | - | Min: 1 Mult: 1 | Surface Mount | 52-LCC (J-Lead) | YES | A/D 8x8b | 38 | -40°C~85°C TA | Tube | 2005 | HC11 | e3 | Not For New Designs | 3 (168 Hours) | 52 | EAR99 | Matte Tin (Sn) | SEATED HEIGHT CALCULATED | 8542.31.00.01 | QUAD | J BEND | 250 | 5V | 1.27mm | 30 | MC68711 | S-PQCC-J52 | 5.5V | 4.5V | Internal | 3MHz | 768 x 8 | 4.5V~5.5V | MICROCONTROLLER | POR, WDT | 12MHz | OTP | 8-Bit | 20KB 20K x 8 | SCI, SPI | 8 | YES | NO | NO | NO | 16 | 512 x 8 | 8 | 5.08mm | 19.125mm | 19.125mm | ROHS3 Compliant | |||||||||||||||
| Mfr Part No MCHC11F1CFNE2 | NXP USA Inc. | Datasheet | 800 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 68-LCC (J-Lead) | YES | A/D 8x8b | 30 | -40°C~85°C TA | Tube | 1993 | HC11 | e3 | Not For New Designs | 3 (168 Hours) | 68 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | J BEND | 250 | 5V | 1.27mm | 30 | MCHC11 | S-PQCC-J68 | Not Qualified | 5.25V | 4.75V | Internal | 2MHz | 1K x 8 | 4.75V~5.25V | MICROCONTROLLER | POR, WDT | 16MHz | ROMless | 8-Bit | SCI, SPI | 8 | YES | NO | NO | NO | 16 | 512 x 8 | 8 | EEPROM | 24.23mm | 24.23mm | ROHS3 Compliant | |||||||||||||||
| Mfr Part No MC68HC11E0CFNE2 | NXP USA Inc. | Datasheet | 800 | - | Min: 1 Mult: 1 | Surface Mount | 52-LCC (J-Lead) | YES | A/D 8x8b | 38 | -40°C~85°C TA | Tray | 1996 | HC11 | e3 | Not For New Designs | 3 (168 Hours) | 52 | EAR99 | Matte Tin (Sn) | SEATED HEIGHT CALCULATED | 8542.31.00.01 | QUAD | J BEND | 250 | 5V | 1.27mm | 30 | MC68HC11 | S-PQCC-J52 | 5.5V | 4.5V | Internal | 2MHz | 512 x 8 | 4.5V~5.5V | MICROCONTROLLER | POR, WDT | 8MHz | ROMless | 8-Bit | SCI, SPI | 8 | YES | NO | NO | NO | 16 | 8 | 5.08mm | 19.125mm | 19.125mm | ROHS3 Compliant | |||||||||||||||||
| Mfr Part No MCHC11F1CFNE3R | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 68-LCC (J-Lead) | YES | A/D 8x8b | 30 | -40°C~85°C TA | Tape & Reel (TR) | 1993 | HC11 | e3 | Not For New Designs | 3 (168 Hours) | 68 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | J BEND | 250 | 5V | 1.27mm | 30 | MCHC11 | S-PQCC-J68 | 5.25V | 4.75V | Internal | 3MHz | 1K x 8 | 4.75V~5.25V | MICROCONTROLLER | POR, WDT | 12MHz | ROMless | 8-Bit | SCI, SPI | 8 | YES | NO | NO | NO | 16 | 512 x 8 | 8 | 24.23mm | 24.23mm | ROHS3 Compliant | |||||||||||||||||
| Mfr Part No MC68HC11E1CFNE2R | NXP USA Inc. | Datasheet | 842 | - | Min: 1 Mult: 1 | Surface Mount | 52-LCC (J-Lead) | YES | A/D 8x8b | 38 | -40°C~85°C TA | Tape & Reel (TR) | 1999 | HC11 | e3 | Not For New Designs | 3 (168 Hours) | 52 | EAR99 | Matte Tin (Sn) | SEATED HT CALCULATED | 8542.31.00.01 | QUAD | J BEND | 260 | 5V | 1.27mm | 40 | MC68HC11 | S-PQCC-J52 | 5.5V | 4.5V | Internal | 3MHz | 512 x 8 | 4.5V~5.5V | MICROCONTROLLER | POR, WDT | 8MHz | ROMless | 8-Bit | SCI, SPI | 8 | YES | NO | NO | NO | 16 | 512 x 8 | 8 | OTPROM | 5.08mm | 19.125mm | 19.125mm | ROHS3 Compliant | |||||||||||||||
| Mfr Part No MC68711E20CFNE4 | NXP USA Inc. | Datasheet | 703 | - | Min: 1 Mult: 1 | 11 Weeks | Surface Mount | 52-LCC (J-Lead) | YES | A/D 8x8b | 38 | -40°C~85°C TA | Tray | 2005 | HC11 | e3 | Not For New Designs | 3 (168 Hours) | 52 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | NO LEAD | 250 | 5V | 1.27mm | 30 | MC68711 | S-PQCC-N52 | 5.5V | 4.5V | Internal | 4MHz | 768 x 8 | 4.5V~5.5V | MICROCONTROLLER | POR, WDT | 8MHz | OTP | 8-Bit | 20KB 20K x 8 | SCI, SPI | 8 | YES | NO | NO | NO | 16 | 512 x 8 | 8 | 5.08mm | 19.125mm | 19.125mm | ROHS3 Compliant | |||||||||||||||
| Mfr Part No MCHC11F1CFNE4 | NXP USA Inc. | Datasheet | 340 | - | Min: 1 Mult: 1 | 11 Weeks | Surface Mount | 68-LCC (J-Lead) | YES | A/D 8x8b | 30 | -40°C~85°C TA | Tube | 1993 | HC11 | e3 | Not For New Designs | 3 (168 Hours) | 68 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | J BEND | 250 | 5V | 1.27mm | 30 | MCHC11 | S-PQCC-J68 | 5.25V | 4.75V | Internal | 4MHz | 1K x 8 | 4.75V~5.25V | MICROCONTROLLER | POR, WDT | 16MHz | ROMless | 8-Bit | SCI, SPI | 8 | YES | NO | NO | NO | 16 | 512 x 8 | 8 | 24.23mm | 24.23mm | ROHS3 Compliant | |||||||||||||||||
| Mfr Part No MCHC11F1CFNE2R | NXP USA Inc. | Datasheet | 29 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 68-LCC (J-Lead) | YES | A/D 8x8b | 30 | -40°C~85°C TA | Tape & Reel (TR) | 1993 | HC11 | e3 | Not For New Designs | 3 (168 Hours) | 68 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | J BEND | 250 | 5V | 1.27mm | 30 | MCHC11 | S-PQCC-J68 | 5.25V | 4.75V | Internal | 2MHz | 1K x 8 | 4.75V~5.25V | MICROCONTROLLER | POR, WDT | 8MHz | ROMless | 8-Bit | SCI, SPI | 8 | YES | NO | NO | NO | 16 | 512 x 8 | 8 | 24.23mm | 24.23mm | ROHS3 Compliant | |||||||||||||||||
| Mfr Part No MC68HC11E1CFNE3R | NXP USA Inc. | Datasheet | 1480 | - | Min: 1 Mult: 1 | Surface Mount | 52-LCC (J-Lead) | YES | A/D 8x8b | 38 | -40°C~85°C TA | Tape & Reel (TR) | 1999 | HC11 | e3 | Not For New Designs | 3 (168 Hours) | 52 | EAR99 | Matte Tin (Sn) | SEATED HEIGHT CALCULATED | 8542.31.00.01 | QUAD | J BEND | 260 | 5V | 1.27mm | 40 | MC68HC11 | S-PQCC-J52 | 5.5V | 4.5V | Internal | 3MHz | 512 x 8 | 4.5V~5.5V | MICROCONTROLLER | POR, WDT | 12MHz | ROMless | 8-Bit | SCI, SPI | 8 | YES | NO | NO | NO | 16 | 512 x 8 | 8 | 5.08mm | 19.125mm | 19.125mm | ROHS3 Compliant | ||||||||||||||||
 | Mfr Part No MC68HC711D3CFNE2 | NXP USA Inc. | Datasheet | 4000 | - | Min: 1 Mult: 1 | Surface Mount | 44-LCC (J-Lead) | 26 | -40°C~85°C TA | Tube | 2005 | HC11 | Obsolete | 3 (168 Hours) | MC68HC711 | Internal | 2MHz | 192 x 8 | 4.5V~5.5V | POR, WDT | OTP | 8-Bit | 4KB 4K x 8 | SCI, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC68HC11F1CFN4 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 68-LCC (J-Lead) | YES | A/D 8x8b | 30 | -40°C~85°C TA | Tube | HC11 | Obsolete | 3 (168 Hours) | 68 | QUAD | NO LEAD | MC68HC11 | S-PQCC-N68 | Internal | 4MHz | 1K x 8 | 4.75V~5.25V | MICROCONTROLLER | POR, WDT | ROMless | 8-Bit | SCI, SPI | 8 | YES | NO | NO | NO | 16 | 512 x 8 | NO | NO | 8 | FIXED-POINT | NO | 8 | Non-RoHS Compliant | |||||||||||||||||||||||||||
| Mfr Part No MCHC11F1CFNE4R | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 68-LCC (J-Lead) | YES | A/D 8x8b | 30 | -40°C~85°C TA | Tape & Reel (TR) | 1993 | HC11 | e3 | Not For New Designs | 3 (168 Hours) | 68 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | J BEND | 250 | 5V | 1.27mm | 30 | MCHC11 | S-PQCC-J68 | 5.25V | 4.75V | Internal | 4MHz | 1K x 8 | 4.75V~5.25V | MICROCONTROLLER | POR, WDT | 16MHz | ROMless | 8-Bit | SCI, SPI | 8 | YES | NO | NO | NO | 16 | 512 x 8 | 8 | EEPROM | 24.23mm | 24.23mm | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No MC68HC711E9CFNE3 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) | A/D 8x8b | 38 | -40°C~85°C TA | Tube | 1999 | HC11 | Obsolete | 3 (168 Hours) | MC68HC711 | Internal | 3MHz | 512 x 8 | 4.5V~5.5V | HC11 | POR, WDT | OTP | 8-Bit | 12KB 12K x 8 | SCI, SPI | 512 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC68HC711E9CFNE2 | NXP USA Inc. | Datasheet | 1528 | - | Min: 1 Mult: 1 | Surface Mount | 52-LCC (J-Lead) | A/D 8x8b | 38 | -40°C~85°C TA | Tube | 2001 | HC11 | Obsolete | 3 (168 Hours) | MC68HC711 | Internal | 2MHz | 512 x 8 | 4.5V~5.5V | POR, WDT | OTP | 8-Bit | 12KB 12K x 8 | SCI, SPI | 512 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC68HC711E9CFN2 | NXP USA Inc. | Datasheet | 7999 | - | Min: 1 Mult: 1 | Surface Mount | 52-LCC (J-Lead) | YES | A/D 8x8b | 38 | 12000 | -40°C~85°C TA | Tube | 2001 | HC11 | Obsolete | 3 (168 Hours) | 52 | 8542.31.00.01 | QUAD | J BEND | 5V | 1.27mm | MC68HC711 | S-PQCC-J52 | 5.5V | 4.5V | Internal | 2MHz | 512 x 8 | 4.5V~5.5V | MICROCONTROLLER | POR, WDT | 8MHz | OTP | 8-Bit | 12KB 12K x 8 | SCI, SPI | 27mA | 8 | YES | NO | NO | NO | 16 | 512 x 8 | 8 | NO | YES | 8 | FIXED-POINT | NO | 8 | 4.57mm | 19.1262mm | 19.1262mm | Non-RoHS Compliant | |||||||||||||
| Mfr Part No MCHC11F1CFNE5 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 68-LCC (J-Lead) | A/D 8x8b | 30 | -40°C~85°C TA | Tube | HC11 | Obsolete | 3 (168 Hours) | MCHC11 | Internal | 5MHz | 1K x 8 | 4.75V~5.25V | POR, WDT | ROMless | 8-Bit | SCI, SPI | 512 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC68HC711D3CFN2 | NXP USA Inc. | Datasheet | 57 | - | Min: 1 Mult: 1 | Surface Mount | 44-LCC (J-Lead) | YES | 26 | 4000 | -40°C~85°C TA | Tube | HC11 | Obsolete | 1 (Unlimited) | 44 | QUAD | J BEND | 5V | 1.27mm | MC68HC711 | S-PQCC-J44 | 5.5V | 4.5V | Internal | 2MHz | 192 x 8 | 4.5V~5.5V | MICROCONTROLLER | POR, WDT | 8MHz | OTP | 8-Bit | 4KB 4K x 8 | SCI, SPI | NO | NO | NO | NO | 16 | 8 | NO | YES | 8 | FIXED-POINT | NO | 1 | 4.57mm | 17.525mm | 17.525mm | Non-RoHS Compliant |
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MC68711E20CFNE2
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MC68HC11E1CFNE3
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCHC11F1CFNE3
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MC68711E20CFNE3
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCHC11F1CFNE2
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MC68HC11E0CFNE2
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCHC11F1CFNE3R
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MC68HC11E1CFNE2R
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MC68711E20CFNE4
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCHC11F1CFNE4
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCHC11F1CFNE2R
NXP USA Inc.
Package:Embedded - Microcontrollers
36.823322
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MC68HC11E1CFNE3R
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MC68HC711D3CFNE2
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MC68HC11F1CFN4
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCHC11F1CFNE4R
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MC68HC711E9CFNE3
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MC68HC711E9CFNE2
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MC68HC711E9CFN2
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MCHC11F1CFNE5
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MC68HC711D3CFN2
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire