The category is 'Embedded - Microcontrollers'
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LPC3100
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Data Converters | Number of I/Os | ROM(word) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Connectivity | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | ROM Programmability | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No LPC3130FET180,551 | NXP USA Inc. | Datasheet | - |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 180-TFBGA | YES | A/D 4x10b | 0 | -40°C~85°C TA | Tray | 2008 | LPC3100 | e1 | Not For New Designs | 3 (168 Hours) | 180 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO REQUIRES 1.8V OR 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 40 | LPC313* | 180 | S-PBGA-B180 | Not Qualified | 1.3V | 1.21.8/3.3V | 1V | External | 180MHz | 96K x 8 | 1.1V~3.6V | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, I2S, LCD, PWM, WDT | 25MHz | ROMless | 16/32-Bit | EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG | 32 | YES | YES | YES | NO | FLASH | 1.2mm | 12mm | 12mm | ROHS3 Compliant | |||
| Mfr Part No LPC3131FET180,551 | NXP USA Inc. | Datasheet | 48 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 180-TFBGA | YES | A/D 4x10b | 0 | -40°C~85°C TA | Tray | 2008 | LPC3100 | e1 | Not For New Designs | 3 (168 Hours) | 180 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO REQUIRES 1.8V OR 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 40 | LPC313* | 180 | S-PBGA-B180 | Not Qualified | 1.3V | 1.21.8/3.3V | 1V | External | 180MHz | 192K x 8 | 1.1V~3.6V | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, I2S, LCD, PWM, WDT | 25MHz | ROMless | 16/32-Bit | EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG | 32 | YES | YES | YES | NO | FLASH | 1.2mm | 12mm | 12mm | ROHS3 Compliant | |||
| Mfr Part No LPC3143FET180,551 | NXP USA Inc. | Datasheet | 1600 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 180-TFBGA | YES | A/D 4x10b | 20 | 0 | -40°C~85°C TA | Tray | 2009 | LPC3100 | e1 | Not For New Designs | 3 (168 Hours) | 180 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | LPC314* | 180 | S-PBGA-B180 | Not Qualified | 1.3V | 1.21.8/3.3V | 1.1V | External | 270MHz | 192K x 8 | 1.1V~3.6V | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, I2S, LCD, PWM, WDT | 25MHz | ROMless | 16/32-Bit | EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG | 32 | YES | YES | YES | NO | FLASH | 1.2mm | 12mm | 12mm | ROHS3 Compliant | |||||
| Mfr Part No LPC3141FET180,551 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 180-TFBGA | YES | A/D 4x10b | 20 | 0 | -40°C~85°C TA | Tray | 2009 | LPC3100 | e1 | Obsolete | 3 (168 Hours) | 180 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | LPC314* | 180 | S-PBGA-B180 | Not Qualified | 1.3V | 1.21.8/3.3V | 1.1V | External | 270MHz | 192K x 8 | 1.1V~3.6V | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, I2S, LCD, PWM, WDT | 25MHz | ROMless | 16/32-Bit | EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG | 32 | YES | YES | YES | NO | FLASH | 1.2mm | 12mm | 12mm | ROHS3 Compliant | |||||
 | Mfr Part No LPC3152FET208,551 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 208-TFBGA | YES | A/D 3x10b | 10 | 0 | -40°C~85°C TA | Tray | 2010 | LPC3100 | e1 | Obsolete | 3 (168 Hours) | 208 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.2V | 0.65mm | LPC315* | 208 | S-PBGA-B208 | Not Qualified | 1.3V | 1.21.8/3.3V | 1.1V | External | 180MHz | 192K x 8 | 1.1V~3.6V | MICROCONTROLLER, RISC | ARM9® | DMA, I2S, LCD, PWM, WDT | 25MHz | ROMless | 16/32-Bit | EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG | 32 | YES | YES | YES | YES | FLASH | 1.15mm | 12mm | 12mm | ROHS3 Compliant | ||||||||
| Mfr Part No LPC3154FET208,551 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 208-TFBGA | YES | A/D 3x10b | 10 | 0 | -40°C~85°C TA | Tray | 2009 | LPC3100 | e1 | Obsolete | 3 (168 Hours) | 208 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.65mm | NOT SPECIFIED | LPC315* | 208 | S-PBGA-B208 | Not Qualified | 1.3V | 1.21.8/3.3V | 1.1V | External | 180MHz | 192K x 8 | 1.1V~3.6V | MICROCONTROLLER, RISC | ARM9® | DMA, I2S, LCD, PWM, WDT | 25MHz | ROMless | 16/32-Bit | EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG | 32 | YES | YES | YES | YES | FLASH | 1.15mm | 12mm | 12mm | ROHS3 Compliant | ||||||
 | Mfr Part No LPC3180FEL320/01,5 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 320-LFBGA | YES | A/D 3x10b | 55 | -40°C~85°C TA | Tray | 2006 | LPC3100 | Obsolete | 3 (168 Hours) | 320 | EAR99 | ALSO REQUIRES 1.8V OR 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 0.5mm | 40 | LPC3180 | 320 | S-PBGA-B320 | Not Qualified | 1.3V | 1.1V | External | 208MHz | 64K x 8 | 1.1V~3.3V | MICROCONTROLLER, RISC | ARM9® | DMA, PWM, WDT | 20MHz | ROMless | 16/32-Bit | EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG | 32 | YES | YES | YES | NO | FLASH | 1.3mm | 13mm | 13mm | ROHS3 Compliant | |||||||
| Mfr Part No LPC3152FET208,551 | Rochester Electronics, LLC | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 208-TFBGA | 208-TFBGA (12x12) | A/D 3x10b | 10 | -40°C~85°C TA | Tray | LPC3100 | Obsolete | 3 (168 Hours) | External | 180MHz | 192K x 8 | 1.1V~3.6V | ARM9® | DMA, I2S, LCD, PWM, WDT | ROMless | 16/32-Bit | EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG | ROHS3 Compliant |
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LPC3130FET180,551
NXP USA Inc.
Package:Embedded - Microcontrollers
14.198900
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LPC3131FET180,551
NXP USA Inc.
Package:Embedded - Microcontrollers
14.085672
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LPC3143FET180,551
NXP USA Inc.
Package:Embedded - Microcontrollers
18.130891
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LPC3141FET180,551
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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LPC3152FET208,551
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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LPC3154FET208,551
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
LPC3180FEL320/01,5
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
-
LPC3152FET208,551
Rochester Electronics, LLC
Package:Embedded - Microcontrollers
Price: please inquire