The category is 'Embedded - Microcontrollers'
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LPC82x
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Data Converters | Number of I/Os | RAM(byte) | ROM(word) | Operating Temperature | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Additional Feature | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Program Memory Size | Connectivity | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | On Chip Program ROM Width | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No LPC824M201JHI33Y | NXP USA Inc. | Datasheet | 400 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 12x12b | 29 | 8192 | 32768 | -40°C~105°C TA | Tape & Reel (TR) | 2010 | LPC82x | Active | 3 (168 Hours) | 33 | SEATED HGT-NOM | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | NOT SPECIFIED | 32 | S-PQCC-N33 | 3.6V | 1.8V | Internal | 30MHz | 8K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | NO | 8 | 0.85mm | 5mm | 5mm | ROHS3 Compliant | ||
| Mfr Part No LPC824M201JHI33E | NXP USA Inc. | Datasheet | 40000 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 12x12b | 29 | 32768 | -40°C~105°C TA | Tray | 2005 | LPC82x | Discontinued | 3 (168 Hours) | 33 | SEATED HGT-NOM | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | NOT SPECIFIED | LPC824M201 | 32 | S-PQCC-N33 | 3.6V | 1.8V | Internal | 30MHz | 8K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | NO | 8 | 0.85mm | 5mm | 5mm | ROHS3 Compliant | ||
 | Mfr Part No LPC824M201JDH20J | NXP USA Inc. | Datasheet | 9200 | - | Min: 1 Mult: 1 | 56 Weeks | Surface Mount | 20-TSSOP (0.173, 4.40mm Width) | A/D 5x12b | 16 | -40°C~105°C TA | Cut Tape (CT) | 2010 | LPC82x | Active | 1 (Unlimited) | Internal | 30MHz | 8K x 8 | 1.8V~3.6V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | ROHS3 Compliant | ||||||||||||||||||||||||||||
| Mfr Part No LPC822M101JDH20J | NXP USA Inc. | Datasheet | 4 | - | Min: 1 Mult: 1 | 56 Weeks | Surface Mount | 20-TSSOP (0.173, 4.40mm Width) | YES | A/D 5x12b | 16 | 4096 | -40°C~105°C TA | Cut Tape (CT) | 2010 | LPC82x | Active | 1 (Unlimited) | 20 | DUAL | GULL WING | 260 | 3.3V | 0.65mm | NOT SPECIFIED | 20 | R-PDSO-G20 | 3.6V | 1.8V | Internal | 30MHz | 4K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | NO | 8 | 1.1mm | 6.5mm | 4.4mm | ROHS3 Compliant | ||||
| Mfr Part No LPC822M101JHI33E | NXP USA Inc. | Datasheet | 12344 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 32-VFQFN Exposed Pad | A/D 12x12b | 29 | -40°C~105°C TA | Tray | 2010 | LPC82x | Active | 3 (168 Hours) | LPC822M101 | Internal | 30MHz | 4K x 8 | 1.8V~3.6V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | ROHS3 Compliant | |||||||||||||||||||||||||||
| Mfr Part No LPC822M101JHI33Y | NXP USA Inc. | Datasheet | 7056 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 32-VFQFN Exposed Pad | A/D 12x12b | 29 | -40°C~105°C TA | Tape & Reel (TR) | 2010 | LPC82x | Active | 3 (168 Hours) | Internal | 30MHz | 4K x 8 | 1.8V~3.6V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | ROHS3 Compliant | ||||||||||||||||||||||||||||
 | Mfr Part No LPC824M201JHI33K | NXP USA Inc. | Datasheet | 26400 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 32-VFQFN Exposed Pad | YES | A/D 12x12b | 29 | -40°C~105°C TA | LPC82x | Active | 3 (168 Hours) | 33 | QUAD | NO LEAD | 3.3V | 0.5mm | 3.6V | 1.8V | Internal | 30MHz | 8K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | 5mm | 5mm | ROHS3 Compliant |
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LPC824M201JHI33Y
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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LPC824M201JHI33E
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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LPC824M201JDH20J
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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LPC822M101JDH20J
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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LPC822M101JHI33E
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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LPC822M101JHI33Y
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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LPC824M201JHI33K
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire