The category is 'Embedded - Microcontrollers'
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- Series:
MPC5123
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Type | Core Size | Connectivity | Bit Size | Address Bus Width | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | Height Seated (Max) | Length | Width | RoHS Status |
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 | Mfr Part No SPC5123YVY400B | NXP USA Inc. | Datasheet | 1876 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 516-BBGA Exposed Pad | YES | 147 | Automotive grade | -40°C~85°C TA | Tray | 2002 | MPC5123 | e2 | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 1mm | 40 | S-PBGA-B516 | Not Qualified | 1.47V | 1.43.3V | 1.33V | External | 400MHz | 128K x 8 | 1.08V~3.6V | MICROPROCESSOR, RISC | e300 | DMA, WDT | 35MHz | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, USB OTG | 32 | 32 | YES | YES | AEC-Q100 | 32 | FIXED POINT | YES | 2.55mm | 27mm | 27mm | ROHS3 Compliant | |||
| Mfr Part No MPC5123YVY400B | NXP USA Inc. | Datasheet | 1358 | - | Min: 1 Mult: 1 | 14 Weeks | Surface Mount | 516-BBGA | YES | 147 | -40°C~85°C TA | Tray | 2002 | MPC5123 | e2 | Not For New Designs | 3 (168 Hours) | 516 | 3A991.A.2 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 1mm | 40 | S-PBGA-B516 | Not Qualified | 1.47V | 1.33V | External | 400MHz | 128K x 8 | 1.08V~3.6V | MICROPROCESSOR, RISC | e300 | DMA, WDT | 35MHz | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, USB OTG | 32 | YES | YES | 32 | FIXED POINT | YES | 2.55mm | 27mm | 27mm | ROHS3 Compliant | |||||||
| Mfr Part No MPC5123VY400B | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 516-BBGA | 516-FPBGA (27x27) | 147 | 0°C~70°C TA | Tray | 2006 | MPC5123 | Obsolete | 3 (168 Hours) | MPC5123 | External | 400MHz | 128K x 8 | 1.08V~3.6V | e300 | DMA, WDT | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, USB OTG | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
| Mfr Part No MPC5123VY400B | Rochester Electronics, LLC | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 516-BBGA | 516-FPBGA (27x27) | 147 | 0°C~70°C TA | Tray | MPC5123 | Obsolete | 3 (168 Hours) | External | 400MHz | 128K x 8 | 1.08V~3.6V | e300 | DMA, WDT | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, USB OTG | ROHS3 Compliant |
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SPC5123YVY400B
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MPC5123YVY400B
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MPC5123VY400B
NXP USA Inc.
Package:Embedded - Microcontrollers
Price: please inquire
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MPC5123VY400B
Rochester Electronics, LLC
Package:Embedded - Microcontrollers
Price: please inquire