The category is 'Embedded - Microcontrollers'
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- Supply Current-Max:
30 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Analog Supply Voltage | Base Product Number | Clock Frequency-Max | Core | Data Converters | Data RAM Size | Data RAM Type | Dimensions | Factory Pack QuantityFactory Pack Quantity | I/O Voltage | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/O Lines | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Part Package Code | Processing Unit | Processor Series | Product Status | RAM(byte) | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | ROM(word) | Samacsys Description | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Pbfree Code | Part Status | Number of Terminations | ECCN Code | Temperature Coefficient | Resistance | Terminal Finish | Composition | Applications | Power (Watts) | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Failure Rate | Power Supplies | Temperature Grade | Interface | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Program Memory Type | Core Size | Program Memory Size | Connectivity | Supply Current-Max | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Seated Height-Max | Number of Timers/Counters | Address Bus Width | EEPROM Size | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | RAM (words) | Number of ADC Channels | Number of Serial I/Os | Number of Timers | ROM Programmability | Number of External Interrupts | Bus Compatibility | On Chip Data RAM Width | Features | ADC Resolution | Device Core | Height | Height Seated (Max) | Length | Width |
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 | Mfr Part No TMP90C041F | Toshiba America Electronic Components | Datasheet | 400 | - | Min: 1 Mult: 1 | YES | 64 | 12.5 MHz | TOSHIBA CORP | 28 | 70 °C | -20 °C | PLASTIC/EPOXY | QFP | QFP, | RECTANGULAR | FLATPACK | Obsolete | QFP | 0 | 5.5 V | 4.5 V | 5 V | 8542.31.00.01 | QUAD | GULL WING | 1 mm | unknown | 64 | R-PQFP-G64 | Not Qualified | COMMERCIAL | MICROCONTROLLER | 30 mA | 8 | YES | NO | NO | NO | 3.05 mm | 20 | NO | YES | 8 | FIXED POINT | NO | 0 | 2 | 3 | 4 | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No PIC16C73-04I/SP | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 4 MHz | MICROCHIP TECHNOLOGY INC | 22 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, PLASTIC, DIP-28 | DIP28,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | 192 | 4096 | 6 V | 4.5 V | 5 V | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | 28 | R-PDIP-T28 | Not Qualified | INDUSTRIAL | 4 MHz | MICROCONTROLLER, RISC | 30 mA | 8 | YES | NO | YES | NO | 4.572 mm | 14 | PIC | NO | MROM | 34.671 mm | 7.62 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No W78C032C40FL | Winbond | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 40 MHz | NUVOTON TECHNOLOGY CORP | Nuvoton Technology Corp | W78C032C40FL | 32 | 70 °C | PLASTIC/EPOXY | QFP | QFP, QFP44,.52SQ,32 | QFP44,.52SQ,32 | SQUARE | FLATPACK | Active | QFP | 256 | 5.56 | Yes | 0 | 5.5 V | 4.5 V | 5 V | Yes | 3A991.A.2 | 8542.31.00.01 | Microcontrollers | CMOS | QUAD | GULL WING | 0.8 mm | compliant | 44 | S-PQFP-G44 | Not Qualified | 5 V | COMMERCIAL | 40 MHz | MICROCONTROLLER | 30 mA | 8 | NO | NO | NO | NO | 2.7 mm | 16 | 8051 | 8 | 10 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CY8C5267AXI-LP051 | Infineon Technologies | Datasheet | 7329 | - | Min: 1 Mult: 1 | 1 Week | Surface Mount | TQFP-100 | YES | 100-TQFP (14x14) | 100 | 1.8 V | CY8C5267 | 33 MHz | ARM Cortex M3 | A/D 1x12b; D/A 1x8b | 32 kB | SRAM | 14 x 14 x 1.4mm | 900 | 1.8 V | CYPRESS SEMICONDUCTOR CORP | I2C, USB | CY8C5267AXI-LP051 | 67 MHz | 5.5 V | + 85 C | Infineon Technologies | 1.71 V | - 40 C | Yes | 3 | SMD/SMT | 48 | 72 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LFQFP | TQFP-100 | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | TQFP | Active | QFP | Microcontroller | CY8C52LP | Active | 30 | 1.68 | Details | Yes | ARM Microcontrollers - MCU 5.50 V, PSoC 5 CapSense Plus | 1.89 V | 1.71 V | 1.8 V | PSoC | 0.023281 oz | -40°C ~ 85°C (TA) | Tray | CY8C52LPxxx | e4 | 3A991.A.3 | Nickel/Palladium/Gold (Ni/Pd/Au) | Automotive, Capacitive Sensing, Controller, Embedded, Flash, LCD, LED, USB | 8542.31.00.01 | CMOS | QUAD | GULL WING | 260 | 0.5 mm | compliant | 100 | S-PQFP-G100 | Not Qualified | INDUSTRIAL | I2C/SIO/USB | Internal | 67MHz | 32K x 8 | 1.71V ~ 5.5V | MULTIFUNCTION PERIPHERAL | ARM® Cortex®-M3 | CapSense, DMA, LCD, POR, PWM, WDT | Flash | 32-Bit Single-Core | 128 kB | I²C, LINbus, SPI, UART/USART, USB | 30 mA | 32 bit | 1.6 mm | 4 Timer | 2K x 8 | YES | 16384 | 1 Channel | I2C; USB; PS/2 | 12 bit | ARM Cortex M3 | 1.4 mm | 14 mm | 14mm | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No LP80C31BH-1 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Axial | NO | Axial | 40 | 16 MHz | INTEL CORP | Intel Corporation | LP80C31BH-1 | 32 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | 128 | 5.77 | 0 | 5.5 V | 4.5 V | 5 V | -55°C ~ 175°C | Tape & Reel (TR) | CMF | 0.090 Dia x 0.240 L (2.29mm x 6.10mm) | ±0.1% | Active | 2 | ±25ppm/°C | 216.2 Ohms | Metal Film | 0.5W, 1/2W | BOOLEAN PROCESSOR; ON-CIRCUIT EMULATION | 8542.31.00.01 | Microcontrollers | CMOS | DUAL | THROUGH-HOLE | 2.54 mm | unknown | 40 | R-PDIP-T40 | Not Qualified | -- | 5 V | INDUSTRIAL | 16 MHz | MICROCONTROLLER | 30 mA | 8 | NO | NO | NO | NO | 5.08 mm | 16 | 8051 | NO | YES | 8 | FIXED POINT | NO | 128 | 1 | 2 | 2 | 8 | Flame Retardant Coating, Moisture Resistant, Safety | -- | 52.26 mm | 15.24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W78C032C40DL | Winbond | Datasheet | 56 | - | Min: 1 Mult: 1 | NO | 40 | 40 MHz | NUVOTON TECHNOLOGY CORP | Nuvoton Technology Corp | W78C032C40DL | 32 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | 256 | 5.55 | Yes | 0 | 5.5 V | 4.5 V | 5 V | e3 | Yes | 3A991.A.2 | MATTE TIN | 8542.31.00.01 | Microcontrollers | CMOS | DUAL | THROUGH-HOLE | 2.54 mm | compliant | 40 | R-PDIP-T40 | Not Qualified | 5 V | COMMERCIAL | 40 MHz | MICROCONTROLLER | 30 mA | 8 | NO | NO | NO | NO | 5.334 mm | 16 | 8051 | 8 | 52.2 mm | 15.24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No PIC16C64/JW | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 20 MHz | MICROCHIP TECHNOLOGY INC | 33 | 70 °C | CERAMIC, METAL-SEALED COFIRED | WDIP | WDIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE, WINDOW | Obsolete | DIP | 128 | Yes | 2048 | 6 V | 4.5 V | 5 V | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | 40 | R-CDIP-T40 | Not Qualified | COMMERCIAL | 20 MHz | MICROCONTROLLER, RISC | 30 mA | 8 | NO | NO | NO | NO | 5.715 mm | 14 | PIC | NO | UVPROM | 52.07 mm | 15.24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No UPD78P238GJ | Renesas Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 94 | RENESAS ELECTRONICS CORP | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP94,.9SQ,32 | SQUARE | FLATPACK | Obsolete | QFP | 1024 | No | 32768 | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | unknown | 94 | S-PQFP-G94 | Not Qualified | INDUSTRIAL | 12 MHz | 30 mA | 8 | UPD78K2 | UVPROM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No TMP93CS41DF | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 20 MHz | TOSHIBA CORP | 61 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | LFQFP, QFP100,.63SQ,20 | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | 2048 | No | 5.5 V | 4.5 V | 5 V | OPERATES AT 2.7V MINIMUM SUPPLY @ 12.5MHZ | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 0.5 mm | unknown | NOT SPECIFIED | 100 | S-PQFP-G100 | Not Qualified | INDUSTRIAL | 20 MHz | MICROCONTROLLER | 30 mA | 16 | YES | YES | YES | NO | 1.6 mm | 24 | TLCS-900/L | 16 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No HD63C01Y0CP | Hitachi Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 68 | 12 MHz | HITACHI LTD | 53 | 75 °C | -20 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-68 | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | 256 | No | 16384 | 5.5 V | 5 V | 5 V | e0 | TIN LEAD | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | unknown | 68 | S-PQCC-J68 | Not Qualified | COMMERCIAL EXTENDED | 3 MHz | MICROCONTROLLER | 30 mA | 8 | NO | NO | NO | NO | 4.57 mm | 16 | 8 | 6800 | NO | 8 | MROM | 24.2316 mm | 24.2316 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No HD6473927F | Hitachi Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | 10 MHz | HITACHI LTD | 68 | 75 °C | -20 °C | PLASTIC/EPOXY | QFP | QFP, | RECTANGULAR | FLATPACK | Transferred | QFP | 5.5 V | 2.5 V | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | unknown | 80 | R-PQFP-G80 | Not Qualified | COMMERCIAL EXTENDED | MICROCONTROLLER | 30 mA | 8 | YES | NO | YES | YES | 3.1 mm | OTPROM | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TN80C32 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 12 MHz | INTEL CORP | 32 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC44,.7SQ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | 256 | No | 0 | 6 V | 4 V | 5 V | e0 | TIN LEAD | BOOLEAN PROCESSOR; ON-CIRCUIT EMULATION | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | unknown | 44 | S-PQCC-J44 | Not Qualified | INDUSTRIAL | 12 MHz | MICROCONTROLLER | 30 mA | 8 | NO | NO | NO | NO | 4.57 mm | 16 | 8051 | NO | YES | 8 | FIXED POINT | NO | 256 | 1 | 3 | ROM LESS | 2 | 8 | 16.5862 mm | 16.5862 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC68HC08AZ32ACFU | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 16 MHz | NXP SEMICONDUCTORS | 50 | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP-64 | QFP64,.66SQ,32 | SQUARE | FLATPACK | Active | 1024 | 32256 | 5.5 V | 5 V | 5 V | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | compliant | S-PQFP-G64 | Not Qualified | INDUSTRIAL | 8.4 MHz | MICROCONTROLLER | 30 mA | 8 | YES | NO | YES | NO | 2.45 mm | 8 | 68HC08 | NO | MROM | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC908GZ60CFU | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 32 MHz | FREESCALE SEMICONDUCTOR INC | 3 | 37 | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, QFP64,.66SQ,32 | QFP64,.66SQ,32 | SQUARE | FLATPACK | Obsolete | QFP | 2048 | Yes | 61440 | 5.5 V | 5 V | 5 V | e0 | EAR99 | OPERATES AT 3.3V SUPPLY @ 4MHZ | 8542.31.00.01 | QUAD | GULL WING | 240 | 0.8 mm | compliant | 30 | 64 | S-PQFP-G64 | Not Qualified | INDUSTRIAL | 8 MHz | MICROCONTROLLER | 30 mA | 8 | YES | NO | YES | NO | 2.45 mm | 8 | 68HC08 | FLASH | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S87C552-1A68 | YAGEO Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 68 | 12 MHz | PHILIPS COMPONENTS | 48 | 70 °C | PLASTIC/EPOXY | , | SQUARE | CHIP CARRIER | Obsolete | 5.5 V | 4.5 V | 8542.31.00.01 | QUAD | J BEND | unknown | S-PQCC-J68 | Not Qualified | COMMERCIAL | 12 MHz | MICROCONTROLLER | 30 mA | 8 | YES | NO | YES | NO | 16 | 8 | OTPROM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S87C552-1A68 | Philips Semiconductors | Datasheet | 416 | - | Min: 1 Mult: 1 | YES | 68 | PHILIPS SEMICONDUCTORS | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC68,1.0SQ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Transferred | 256 | No | 8192 | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | unknown | S-PQCC-J68 | Not Qualified | COMMERCIAL | 12 MHz | 30 mA | 8 | 8051 | UVPROM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S80C54 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 12 MHz | INTEL CORP | 32 | 70 °C | PLASTIC/EPOXY | QFP | QFP, | SQUARE | FLATPACK | Obsolete | QFP | 16384 | 6 V | 5 V | 5 V | BOOLEAN PROCESSOR; ON-CIRCUIT EMULATION | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | unknown | 44 | S-PQFP-G44 | Not Qualified | COMMERCIAL | 6 MHz | MICROCONTROLLER | 30 mA | 8 | NO | NO | NO | NO | 2.35 mm | 16 | 8 | NO | YES | 8 | FIXED POINT | NO | 256 | 1 | 3 | OTPROM | 2 | 8 | 10 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC908GZ16CFJE | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 32 MHz | NXP SEMICONDUCTORS | 21 | 85 °C | -40 °C | PLASTIC/EPOXY | LQFP | 7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MS-026BBA, LQFP-32 | QFP32,.35SQ,32 | SQUARE | FLATPACK, LOW PROFILE | Active | 1024 | Yes | 16384 | 5.5 V | 5 V | 5 V | 3A991.A.2 | OPERATES AT 3.3V SUPPLY AT 4MHZ | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | compliant | S-PQFP-G32 | Not Qualified | INDUSTRIAL | 8 MHz | MICROCONTROLLER | 30 mA | 8 | YES | NO | YES | NO | 1.6 mm | 8 | 68HC08 | FLASH | 7 mm | 7 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PIC16C64-20/P | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 20 MHz | MICROCHIP TECHNOLOGY INC | 33 | 70 °C | CERAMIC, METAL-SEALED COFIRED | WDIP | WDIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE, WINDOW | Obsolete | DIP | 128 | 2048 | 5.5 V | 4.5 V | 5 V | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | 40 | R-CDIP-T40 | Not Qualified | COMMERCIAL | 20 MHz | MICROCONTROLLER, RISC | 30 mA | 8 | NO | NO | YES | NO | 5.715 mm | 14 | PIC | NO | ISO/TS-16949 | OTPROM | 52.07 mm | 15.24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No P87C51RC | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 12 MHz | INTEL CORP | 32 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | 512 | No | 32768 | 6 V | 5 V | 5 V | e0 | TIN LEAD | ON-CIRCUIT EMULATION | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | 40 | R-PDIP-T40 | Not Qualified | COMMERCIAL | 12 MHz | MICROCONTROLLER | 30 mA | 8 | NO | NO | NO | NO | 5.08 mm | 16 | 8 | 8051 | NO | YES | 8 | FIXED POINT | NO | 512 | 1 | 3 | OTPROM | 2 | 8 | 52.26 mm | 15.24 mm |
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TMP90C041F
Toshiba America Electronic Components
Package:Embedded - Microcontrollers
Price: please inquire
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PIC16C73-04I/SP
Microchip Technology Inc
Package:Embedded - Microcontrollers
Price: please inquire
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W78C032C40FL
Winbond
Package:Embedded - Microcontrollers
Price: please inquire
-
CY8C5267AXI-LP051
Infineon Technologies
Package:Embedded - Microcontrollers
Price: please inquire
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LP80C31BH-1
Intel
Package:Embedded - Microcontrollers
Price: please inquire
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W78C032C40DL
Winbond
Package:Embedded - Microcontrollers
Price: please inquire
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PIC16C64/JW
Microchip Technology Inc
Package:Embedded - Microcontrollers
Price: please inquire
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UPD78P238GJ
Renesas Electronics Corporation
Package:Embedded - Microcontrollers
Price: please inquire
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TMP93CS41DF
Toshiba America Electronic Components
Package:Embedded - Microcontrollers
Price: please inquire
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HD63C01Y0CP
Hitachi Ltd
Package:Embedded - Microcontrollers
Price: please inquire
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HD6473927F
Hitachi Ltd
Package:Embedded - Microcontrollers
Price: please inquire
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TN80C32
Intel Corporation
Package:Embedded - Microcontrollers
Price: please inquire
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MC68HC08AZ32ACFU
NXP Semiconductors
Package:Embedded - Microcontrollers
Price: please inquire
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MC908GZ60CFU
Freescale Semiconductor
Package:Embedded - Microcontrollers
Price: please inquire
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S87C552-1A68
YAGEO Corporation
Package:Embedded - Microcontrollers
Price: please inquire
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S87C552-1A68
Philips Semiconductors
Package:Embedded - Microcontrollers
Price: please inquire
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S80C54
Intel Corporation
Package:Embedded - Microcontrollers
Price: please inquire
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MC908GZ16CFJE
NXP Semiconductors
Package:Embedded - Microcontrollers
Price: please inquire
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PIC16C64-20/P
Microchip Technology Inc
Package:Embedded - Microcontrollers
Price: please inquire
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P87C51RC
Intel Corporation
Package:Embedded - Microcontrollers
Price: please inquire