The category is 'Embedded - Microcontrollers'
- All Manufacturers
- Bit Size
- HTS Code
- Ihs Manufacturer
- JESD-30 Code
- Number of Terminals
- Operating Temperature-Max
- Package Body Material
- Package Code
- Package Equivalence Code
- Package Shape
- Part Life Cycle Code
- Supply Current-Max
- Supply Current-Max:
76 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mounting Type | Surface Mount | Number of Terminals | ADC Resolution (bit) | Analog Comparators | Approvals | CECC Qualified | Clock Frequency-Max | DAC Resolution (bit) | Data Bus Width (bit) | Degree of protection (IP) | ECCN (US) | Family Name | HTS | I2C | I2S | Ihs Manufacturer | Instruction Set Architecture | Interface Type | Lead Shape | Manufacturer | Manufacturer Part Number | Material of contact surface | Maximum Clock Rate (MHz) | Maximum CPU Frequency (MHz) | Maximum Expanded Memory Size | Maximum Operating Supply Voltage (V) | Maximum Operating Temperature (°C) | Minimum Operating Supply Voltage (V) | Minimum Operating Temperature (°C) | Moisture Sensitivity Levels | Mounting | No. of Timers | Number of ADCs | Number of DAC's | Number of I/O Lines | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Height | Package Length | Package Shape | Package Style | Package Width | Part Life Cycle Code | Part Package Code | PCB changed | Permitted cable outer temperature after assembling without vibration | Permitted cable outer temperature during assembling/handling | Programmability | RAM(byte) | Rated current In | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | ROM(word) | Standard Package Name | Supplier Package | Supplier Temperature Grade | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Timing Range | Typical Operating Supply Voltage (V) | UART | USART | Watchdog | Packaging | JESD-609 Code | Pbfree Code | Part Status | Termination | ECCN Code | Terminal Finish | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Power Supplies | Temperature Grade | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Program Memory Type | Program Memory Size | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Seated Height-Max | Address Bus Width | Coil Voltage | Core Architecture | On Chip Program ROM Width | CPU Family | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Ethernet | USB | Number of Serial I/Os | Number of Timers | ROM Programmability | Number of External Interrupts | On Chip Data RAM Width | Number of DMA Channels | Mode of Operation | SPI | CAN | PWM | Contacts | ADC Channels | Device Core | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No DSPIC33FJ128MC802T-H/SO | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | Production (Last Updated: 2 years ago) | YES | 28 | IP67 | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | DSPIC33FJ128MC802T-H/SO | Gold | 1 | 21 | 150 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP28,.4 | SOP28,.4 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | -30 - 80 | -5 - 80 | 16384 | 4 | 40 | 5.21 | Non-Compliant | Yes | 43690 | 3.6 V | 3 V | 3.3 V | e3 | Yes | 3A001.A.2.A | Matte Tin (Sn) | 8542.31.00.01 | Digital Signal Processors | CMOS | DUAL | GULL WING | 250 | 1.27 mm | compliant | 28 | R-PDSO-G28 | Not Qualified | 3.3 V | AUTOMOTIVE | 20 MHz | MICROCONTROLLER | 76 mA | 16 | YES | YES | YES | YES | 2.65 mm | 24 | DSPIC33 | YES | YES | FLOATING POINT | NO | 8192 | 2 | 5 | FLASH | 3 | 16 | 8 | 17.9 mm | 7.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No P89C51RB2HBBD | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 33 MHz | NXP SEMICONDUCTORS | 32 | 70 °C | PLASTIC/EPOXY | LQFP | 10 X 10 X 1.40 MM, PLASTIC, LQFP-44 | QFP44,.47SQ,32 | SQUARE | FLATPACK, LOW PROFILE | Obsolete | QFP | 512 | 16384 | 5.5 V | 5 V | 5 V | 3A991.A.2 | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | compliant | 44 | S-PQFP-G44 | Not Qualified | COMMERCIAL | 33 MHz | MICROCONTROLLER | 76 mA | 8 | NO | NO | YES | NO | 1.6 mm | 16 | 8 | 8051 | 8 | FLASH | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No P89C51RB2HBBD | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | PHILIPS SEMICONDUCTORS | 70 °C | PLASTIC/EPOXY | QFP | QFP, QFP44,.47SQ,32 | QFP44,.47SQ,32 | SQUARE | FLATPACK | Transferred | 512 | No | 16384 | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | unknown | S-PQFP-G44 | Not Qualified | COMMERCIAL | 33 MHz | 76 mA | 8 | 8051 | FLASH | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No P89C51RC2HBP | onsemi | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | ON SEMICONDUCTOR | 32 | 70 °C | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | Active | 512 | No | 32768 | 5.5 V | 4.5 V | 5 V | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T40 | Not Qualified | COMMERCIAL | 33 MHz | 76 mA | 8 | NO | NO | YES | NO | 8051 | FLASH | 52 mm | 15.24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No P89C51RC2HBP | SANYO Electric Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | SANYO ELECTRIC CO LTD | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Transferred | 512 | No | 32768 | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T40 | Not Qualified | COMMERCIAL | 33 MHz | 76 mA | 8 | 8051 | FLASH | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No P89C51RD2HBBD | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | PHILIPS SEMICONDUCTORS | 70 °C | PLASTIC/EPOXY | QFP | QFP, QFP44,.47SQ,32 | QFP44,.47SQ,32 | SQUARE | FLATPACK | Transferred | 1024 | No | 65536 | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | unknown | S-PQFP-G44 | Not Qualified | COMMERCIAL | 33 MHz | 76 mA | 8 | 8051 | FLASH | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No P89C51RD2HBBD | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 33 MHz | NXP SEMICONDUCTORS | 32 | 70 °C | PLASTIC/EPOXY | LQFP | 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-389-1, LQFP-44 | QFP44,.47SQ,32 | SQUARE | FLATPACK, LOW PROFILE | Obsolete | QFP | 1024 | 65536 | 5.5 V | 5 V | 5 V | 3A991.A.2 | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | compliant | 44 | S-PQFP-G44 | Not Qualified | COMMERCIAL | 33 MHz | MICROCONTROLLER | 76 mA | 8 | NO | NO | YES | NO | 1.6 mm | 16 | 8 | 8051 | 8 | FLASH | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No DSPIC33FJ32MC302T-E/MM | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 18 Weeks | Production (Last Updated: 2 years ago) | Surface | YES | 28 | CE, CSA, UL | MICROCHIP TECHNOLOGY INC | SSAC | TH2A4130 | 1 | 21 | 125 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | HVQCCN, LCC28,.24SQ,25 | LCC28,.24SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | QFN | 4096 | 40 | 5.19 | Non-Compliant | Yes | 10922 | 3.6 V | 3 V | 3.3 V | 30 | e3 | Yes | 0.250 in Flat Blade | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | Digital Signal Processors | CMOS | QUAD | NO LEAD | 260 | 0.65 mm | compliant | 28 | S-PQCC-N28 | Not Qualified | 3.3 V | AUTOMOTIVE | 40 MHz | MICROCONTROLLER | 76 mA | 16 | YES | YES | YES | YES | 1 mm | 120 VAC | 24 | DSPIC33 | YES | YES | FLOATING POINT | NO | 2048 | 2 | 5 | FLASH | 3 | 16 | 8 | Interval | 1NO | 6 mm | 6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No P89C51RD2HBP | SANYO Electric Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | SANYO ELECTRIC CO LTD | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Transferred | 1024 | No | 65536 | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T40 | Not Qualified | COMMERCIAL | 33 MHz | 76 mA | 8 | 8051 | FLASH | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No P89C51RD2HBP | onsemi | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | ON SEMICONDUCTOR | 70 °C | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | 1024 | No | 65536 | 5 V | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T40 | Not Qualified | COMMERCIAL | 33 MHz | 76 mA | 8 | 8051 | FLASH | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No DSPIC33FJ64GP204T-E/PT | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | Production (Last Updated: 2 years ago) | YES | 44 | 10/12 | 2 | No | 40 MHz | 16 | 16 | 3A991.a.2 | dsPIC33F | 8542.31.00.01 | 1 | 0 | MICROCHIP TECHNOLOGY INC | RISC | I2C/SPI/UART | Gull-wing | Microchip Technology Inc | DSPIC33FJ64GP204T-E/PT | 40 | 40 | 12MB | 3.6 | 125 | 3 | -40 | 3 | Surface Mount | 5 | Dual | Single | 35 | 35 | 125 °C | -40 °C | PLASTIC/EPOXY | TQFP | TQFP, TQFP44,.47SQ,32 | TQFP44,.47SQ,32 | 1 | 10 | SQUARE | FLATPACK, THIN PROFILE | 10 | Active | QFP | 44 | Yes | 40 | 5.2 | Non-Compliant | Yes | QFP | TQFP | Extended | 3.6 V | 3 V | 3.3 V | 3.3 | 2 | 0 | 1 | Tape and Reel | e3 | Yes | Active | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | Digital Signal Processors | CMOS | QUAD | GULL WING | 260 | 0.8 mm | compliant | 44 | S-PQFP-G44 | Not Qualified | 3.3 V | AUTOMOTIVE | 40 MHz | 8KB | MICROCONTROLLER | Flash | 64KB | 76 mA | 16 | YES | YES | YES | 2 | 1.2 mm | dsPIC | FLOATING POINT | 4096 | 0 | 0 | FLASH | 2 | 0 | 4 | 13/13 | dsPIC | 10 mm | 10 mm | RoHS Compliant | |||||||||||||||||||||||||||
 | Mfr Part No DSPIC33FJ32MC304T-E/ML | Microchip Technology | Datasheet | 8000 | - | Min: 1 Mult: 1 | 19 Weeks | YES | 44 | 12 | 2 | No | 40 MHz | 16 | 3A991.a.2 | dsPIC33F | 8542.31.00.01 | MICROCHIP TECHNOLOGY INC | RISC | I2C/SPI/UART | No Lead | Microchip Technology Inc | DSPIC33FJ32MC304T-E/ML | 125 | -40 | 1 | Surface Mount | 5 | 35 | 125 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | 8 X 8 MM, LEAD FREE, PLASTIC, QFN-44 | LCC44,.32SQ,25 | 0.88 | 8 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 8 | Active | QFN | 44 | 40 | 5.19 | Yes | QFN | QFN EP | 3.6 V | 3 V | 3.3 V | 2 | 1 | Tape and Reel | e3 | Yes | Active | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | Digital Signal Processors | CMOS | QUAD | NO LEAD | 260 | 0.65 mm | compliant | 44 | S-PQCC-N44 | Not Qualified | 3.3 V | AUTOMOTIVE | 40 MHz | MICROCONTROLLER | Flash | 76 mA | 16 | YES | YES | YES | NO | 1 mm | dsPIC | FLOATING POINT | 2048 | FLASH | 2 | 8 | 9 | dsPIC | 8 mm | 8 mm | RoHS Compliant |
-
DSPIC33FJ128MC802T-H/SO
Microchip
Package:Embedded - Microcontrollers
Price: please inquire
-
P89C51RB2HBBD
NXP Semiconductors
Package:Embedded - Microcontrollers
Price: please inquire
-
P89C51RB2HBBD
Philips Semiconductors
Package:Embedded - Microcontrollers
Price: please inquire
-
P89C51RC2HBP
onsemi
Package:Embedded - Microcontrollers
Price: please inquire
-
P89C51RC2HBP
SANYO Electric Co Ltd
Package:Embedded - Microcontrollers
Price: please inquire
-
P89C51RD2HBBD
Philips Semiconductors
Package:Embedded - Microcontrollers
Price: please inquire
-
P89C51RD2HBBD
NXP Semiconductors
Package:Embedded - Microcontrollers
Price: please inquire
-
DSPIC33FJ32MC302T-E/MM
Microchip
Package:Embedded - Microcontrollers
Price: please inquire
-
P89C51RD2HBP
SANYO Electric Co Ltd
Package:Embedded - Microcontrollers
Price: please inquire
-
P89C51RD2HBP
onsemi
Package:Embedded - Microcontrollers
Price: please inquire
-
DSPIC33FJ64GP204T-E/PT
Microchip Technology
Package:Embedded - Microcontrollers
Price: please inquire
-
DSPIC33FJ32MC304T-E/ML
Microchip Technology
Package:Embedded - Microcontrollers
Price: please inquire