The category is 'Embedded - Microcontrollers - Application Specific'
- All Manufacturers
- ECCN Code
- uPs/uCs/Peripheral ICs Type
- JESD-30 Code
- Terminal Form
- Terminal Position
- Length
- Terminal Pitch
- Width
- HTS Code
- Surface Mount
- Peak Reflow Temperature (Cel)
- Time@Peak Reflow Temperature-Max (s)
- ECCN Code:
3A991.A.2
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of pins | Number of Terminals | Clock Frequency-Max | Connector | Connector pinout layout | Contacts pitch | Electrical mounting | Gross weight | Ihs Manufacturer | Kind of connector | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Spatial orientation | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Type of connector | Operating temperature | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Applications | Additional Feature | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Current rating | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Interface | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Program Memory Type | Supply Current-Max | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Seated Height-Max | Address Bus Width | External Data Bus Width | Rated voltage | Bus Compatibility | Data Transfer Rate-Max | Profile | Controller Series | Drive Interface Standard | Height Seated (Max) | Length | Width | Plating thickness | RoHS Status | Flammability rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No CYPD3135-40LQXI | Cypress Semiconductor Corp | Datasheet | 800 |
| Min: 1 Mult: 1 | 15 Weeks | Surface Mount | 40-UFQFN Exposed Pad | YES | 20 | -40°C~85°C TA | Tray | 2017 | EZ-PD™ CCG3 | yes | Active | 3 (168 Hours) | 40 | 3A991.A.2 | USB Type C | 8542.31.00.01 | 2.7V~5.5V | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | S-XQCC-N40 | I2C, SPI, UART/USART, USB | 8K x 8 | MICROPROCESSOR CIRCUIT | ARM® Cortex®-M0 | FLASH (128kB) | 0.6mm | 6mm | 6mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CYPD2119-24LQXIT | Cypress Semiconductor Corp | Datasheet | 4160 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 24-UFQFN Exposed Pad | 14 | -40°C~85°C TA | Tape & Reel (TR) | 2011 | EZ-PD™ CCG2 | Active | 3 (168 Hours) | 24 | 3A991.A.2 | USB Type C | 8542.31.00.01 | 1.71V~5.5V | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | S-XQCC-N24 | I2C, SPI, UART/USART, USB | 4K x 8 | MICROPROCESSOR CIRCUIT | ARM® Cortex®-M0 | FLASH (32KB) | 0.6mm | 4mm | 4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MM912JS812AMAF | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 18 Weeks | Surface Mount | 100-LQFP Exposed Pad | YES | 6 | -40°C~125°C | Tray | 2011 | e3 | Obsolete | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | Engine Control | 8542.39.00.01 | 4.7V~36V | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MM912JS812 | S-PQFP-G100 | CAN, SCI, SPI | 8K x 8 | MICROPROCESSOR CIRCUIT | S12XS | FLASH (128kB) | HCS12 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MM912JP812AMAF | NXP USA Inc. | Datasheet | 2 | - | Min: 1 Mult: 1 | 18 Weeks | Surface Mount | 100-LQFP Exposed Pad | YES | 8 | -40°C~125°C | Tray | 2012 | e3 | Obsolete | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | Engine Control | 4.7V~36V | QUAD | GULL WING | 260 | 0.5mm | 40 | MM912JP812 | S-PQFP-G100 | CAN, SCI, SPI | 6K x 8 | MICROPROCESSOR CIRCUIT | S12P | FLASH (128kB) | HCS12 | 1.6mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MM912JS812AMAFR2 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 18 Weeks | Surface Mount | 100-LQFP Exposed Pad | YES | 6 | -40°C~125°C | Tape & Reel (TR) | 2011 | e3 | Obsolete | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | Engine Control | 8542.39.00.01 | 4.7V~36V | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | MM912JS812 | S-PQFP-G100 | CAN, SCI, SPI | 8K x 8 | MICROPROCESSOR CIRCUIT | S12XS | FLASH (128kB) | HCS12 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MM912JP812AMAFR2 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 26 Weeks | Surface Mount | 100-LQFP Exposed Pad | YES | 8 | -40°C~125°C | Tape & Reel (TR) | 2012 | e3 | Obsolete | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | Engine Control | 4.7V~36V | QUAD | GULL WING | 260 | 0.5mm | 40 | MM912JP812 | S-PQFP-G100 | CAN, SCI, SPI | 6K x 8 | MICROPROCESSOR CIRCUIT | S12P | FLASH (128kB) | HCS12 | 1.6mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MM912IP812AMAF | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 26 Weeks | Surface Mount | 100-LQFP Exposed Pad | YES | 8 | -40°C~125°C | Tray | 2011 | e3 | Obsolete | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | Engine Control | 4.7V~36V | QUAD | GULL WING | 260 | 0.5mm | 40 | MM912IP812 | S-PQFP-G100 | CAN, SCI, SPI | 6K x 8 | MICROPROCESSOR CIRCUIT | S12P | FLASH (96KB) | HCS12 | 1.6mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYPD4126-40LQXIT | Cypress Semiconductor Corp | Datasheet | 10556 |
| Min: 1 Mult: 1 | 15 Weeks | Surface Mount | 40-UFQFN Exposed Pad | YES | 14 | -40°C~85°C TA | Tape & Reel (TR) | 2018 | EZ-PD™ CCG4 | Active | 3 (168 Hours) | 40 | 3A991.A.2 | USB Type C | 8542.31.00.01 | 2.7V~5.5V | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | S-XQCC-N40 | I2C, SPI, UART/USART, USB | 8K x 8 | MICROPROCESSOR CIRCUIT | ARM® Cortex®-M0 | FLASH (128kB) | 0.6mm | 6mm | 6mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYPD3123-40LQXI | Cypress Semiconductor Corp | Datasheet | - |
| Min: 1 Mult: 1 | 15 Weeks | Surface Mount | 40-UFQFN Exposed Pad | YES | 16 | -40°C~85°C TA | Tray | 2004 | EZ-PD™ CCG3 | Active | 3 (168 Hours) | 40 | 3A991.A.2 | USB Type C | 8542.31.00.01 | 2.7V~21.5V | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | S-XQCC-N40 | I2C, SPI, UART/USART, USB | 8K x 8 | MICROPROCESSOR CIRCUIT | ARM® Cortex®-M0 | FLASH (128kB) | 0.6mm | 6mm | 6mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MM908E626AVPEKR2 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 18 Weeks | Surface Mount | 54-SSOP (0.295, 7.50mm Width) Exposed Pad | 13 | -40°C~115°C | Tape & Reel (TR) | 2003 | e3 | Obsolete | 3 (168 Hours) | 3A991.A.2 | Matte Tin (Sn) | Automotive Mirror Control | 8542.31.00.01 | 8V~18V | 260 | 40 | MM908E626 | SCI, SPI | 512 x 8 | MICROCONTROLLER | HC08 | FLASH (16kB) | 908E | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYPD2120-24LQXI | Cypress Semiconductor Corp | Datasheet | 40 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 24-UFQFN Exposed Pad | YES | 14 | -40°C~85°C TA | Tray | 2011 | EZ-PD™ CCG2 | Active | 3 (168 Hours) | 24 | 3A991.A.2 | USB Type C | 8542.31.00.01 | 1.71V~5.5V | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | S-XQCC-N24 | I2C, SPI, UART/USART, USB | 4K x 8 | MICROPROCESSOR CIRCUIT | ARM® Cortex®-M0 | FLASH (32KB) | 0.6mm | 4mm | 4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MM908E625ACPEKR2 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 18 Weeks | Surface Mount | 54-SSOP (0.295, 7.50mm Width) Exposed Pad | YES | 13 | -40°C~85°C | Tape & Reel (TR) | 2003 | e3 | Obsolete | 3 (168 Hours) | 54 | 3A991.A.2 | Matte Tin (Sn) | Automotive Mirror Control | 8542.31.00.01 | 8V~18V | DUAL | GULL WING | 260 | 12V | 0.65mm | 40 | R-PDSO-G54 | SCI, SPI | 32 MHz | 512 x 8 | MICROCONTROLLER | HC08 | 9.8304MHz | FLASH (16kB) | YES | NO | YES | NO | 908E | 2.45mm | 17.9mm | 7.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MM912IP812AMAFR2 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 26 Weeks | Surface Mount | 100-LQFP Exposed Pad | YES | 8 | -40°C~125°C | Tape & Reel (TR) | 2012 | e3 | Obsolete | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | Engine Control | 4.7V~36V | QUAD | GULL WING | 260 | 0.5mm | 40 | MM912IP812 | S-PQFP-G100 | CAN, SCI, SPI | 6K x 8 | MICROPROCESSOR CIRCUIT | S12P | FLASH (96KB) | HCS12 | 1.6mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MM912KS812AMAFR2 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 100-LQFP Exposed Pad | YES | 6 | -40°C~125°C | Tape & Reel (TR) | 2011 | e3 | Obsolete | 3 (168 Hours) | 100 | 3A991.A.2 | Tin (Sn) | Engine Control | 8542.39.00.01 | 4.7V~36V | QUAD | GULL WING | 260 | 3.3V | 0.5mm | 40 | S-PQFP-G100 | CAN, SCI, SPI | 12K x 8 | MICROPROCESSOR CIRCUIT | S12XS | FLASH (256kB) | HCS12 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYPD3121-40LQXIT | Cypress Semiconductor Corp | Datasheet | - | - | Min: 1 Mult: 1 | 111 Weeks | Surface Mount | Surface Mount | 40-UFQFN Exposed Pad | 16 | -40°C~85°C TA | Tape & Reel (TR) | 2004 | EZ-PD™ CCG3 | Active | 3 (168 Hours) | 40 | 3A991.A.2 | USB Type C | 8542.31.00.01 | 2.7V~21.5V | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | S-XQCC-N40 | I2C, SPI, UART/USART, USB | 8K x 8 | MICROPROCESSOR CIRCUIT | ARM® Cortex®-M0 | FLASH (128kB) | 0.6mm | 6mm | 6mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MM908E624AYPEWR2 | NXP USA Inc. | Datasheet | 33 |
| Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 54-BSSOP (0.295, 7.50mm Width) | YES | 16 | -40°C~125°C | Tape & Reel (TR) | 2003 | e3 | Active | 3 (168 Hours) | 54 | 3A991.A.2 | Matte Tin (Sn) | Automotive Mirror Control | 8542.39.00.01 | 5.5V~18V | DUAL | GULL WING | 260 | 9V | 0.65mm | 40 | MM908E624 | R-PDSO-G54 | Not Qualified | SCI, SPI | 32 MHz | 512 x 8 | MICROCONTROLLER | HC08 | 9.8304MHz | FLASH (16kB) | 8 | YES | NO | YES | NO | 908E | 2.65mm | 17.9mm | 7.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYPD3121-40LQXI | Cypress Semiconductor Corp | Datasheet | 30 |
| Min: 1 Mult: 1 | 15 Weeks | Surface Mount | 40-UFQFN Exposed Pad | YES | 16 | -40°C~85°C TA | Tray | 2004 | EZ-PD™ CCG3 | Active | 3 (168 Hours) | 40 | 3A991.A.2 | USB Type C | 8542.31.00.01 | 2.7V~21.5V | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | 0.5mm | NOT SPECIFIED | S-XQCC-N40 | I2C, SPI, UART/USART, USB | 8K x 8 | MICROPROCESSOR CIRCUIT | ARM® Cortex®-M0 | FLASH (128kB) | 0.6mm | 6mm | 6mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No PCI9056-BA66BIG | PLX Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 66 MHz | PLX TECHNOLOGY INC | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Transferred | BGA | Yes | 2.7 V | 2.3 V | 2.5 V | Yes | 3A991.A.2 | ALSO REQUIRES 3.3V I/O SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1 mm | compliant | 256 | S-PBGA-B256 | Not Qualified | INDUSTRIAL | BUS CONTROLLER, PCI | 180 mA | 1.76 mm | 32 | 32 | I960; MPC850; MPC860; POWERPC 801; POWERPC 401 | 264 MBps | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No PEX8614-BA50BC | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | YES | 324 | 100 MHz | BROADCOM INC | 85 °C | -10 °C | PLASTIC/EPOXY | HBGA | HBGA, BGA324,18X18,40 | BGA324,18X18,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Obsolete | 1.05 V | 0.95 V | 1 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | NOT SPECIFIED | S-PBGA-B324 | OTHER | BUS CONTROLLER, PCI | 1.9 mm | I2C; PCI; SMBUS; SPI; USB | 0.0125 MBps | IEEE 1149.1; IEEE 1149.6 | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No USB3503AI-1-GL-TR | SMSC | Datasheet | - | - | Min: 1 Mult: 1 | gold-plated | YES | 9 | 25 | 52 MHz | socket | 1x9 | 1.27mm | THT | 0.61 g | STANDARD MICROSYSTEMS CORP | female | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | 1.97 X 1.97 MM, 0.40 MM PITCH, ROHS COMPLIANT, WLCSP-25 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Transferred | BGA | straight | 2 V | 1.6 V | 1.8 V | pin strips | -40...163°C | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 0.4 mm | unknown | 1.5A | 25 | S-PBGA-B25 | INDUSTRIAL | BUS CONTROLLER, UNIVERSAL SERIAL BUS | 0.62 mm | 125V | I2C | bronze | 1.97 mm | 1.97 mm | 0.254µm | UL94V-0 |
-
CYPD3135-40LQXI
Cypress Semiconductor Corp
Package:Embedded - Microcontrollers - Application Specific
3.148205
-
CYPD2119-24LQXIT
Cypress Semiconductor Corp
Package:Embedded - Microcontrollers - Application Specific
0.171875
-
MM912JS812AMAF
NXP USA Inc.
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
MM912JP812AMAF
NXP USA Inc.
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
MM912JS812AMAFR2
NXP USA Inc.
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
MM912JP812AMAFR2
NXP USA Inc.
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
MM912IP812AMAF
NXP USA Inc.
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
CYPD4126-40LQXIT
Cypress Semiconductor Corp
Package:Embedded - Microcontrollers - Application Specific
0.362286
-
CYPD3123-40LQXI
Cypress Semiconductor Corp
Package:Embedded - Microcontrollers - Application Specific
1.538537
-
MM908E626AVPEKR2
NXP USA Inc.
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
CYPD2120-24LQXI
Cypress Semiconductor Corp
Package:Embedded - Microcontrollers - Application Specific
1.637138
-
MM908E625ACPEKR2
NXP USA Inc.
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
MM912IP812AMAFR2
NXP USA Inc.
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
MM912KS812AMAFR2
NXP USA Inc.
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
CYPD3121-40LQXIT
Cypress Semiconductor Corp
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
MM908E624AYPEWR2
NXP USA Inc.
Package:Embedded - Microcontrollers - Application Specific
15.448177
-
CYPD3121-40LQXI
Cypress Semiconductor Corp
Package:Embedded - Microcontrollers - Application Specific
5.967551
-
PCI9056-BA66BIG
PLX Technology
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
PEX8614-BA50BC
Broadcom Limited
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
USB3503AI-1-GL-TR
SMSC
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire