The category is 'Embedded - Microcontrollers - Application Specific'
- All Manufacturers
- Applications
- Base Part Number
- Core Processor
- Interface
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Number of I/Os
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Program Memory Type
- Package / Case:
144-LFBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Memory Types | Number of I/Os | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Applications | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Power Supplies | Interface | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Program Memory Type | Bit Size | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Number of Serial I/Os | Bus Compatibility | Data Transfer Rate-Max | Number of DMA Channels | Communication Protocol | Controller Series | Height Seated (Max) | Length | Width | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No MEC1609-PZP | Microchip Technology | Datasheet | 10 | - | Min: 1 Mult: 1 | 7 Weeks | Surface Mount | 144-LFBGA | YES | 115 | Automotive grade | 0°C~70°C | Tray | yes | Active | 1 (Unlimited) | 144 | I/O Controller | 3.3V | BOTTOM | BALL | 3.3V | 0.5mm | MEC1609 | S-PBGA-B144 | ACPI, BC-Link, I2C/SMBus, LPC, PECI, PS/2, SPI, VLPC | 16KB | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | ARC-625D | FLASH (192kB) | 16 | YES | YES | TS 16949 | 32 | 8 | I2C; LPC; PCI; SPI | 0.25 MBps | 8 | ASYNC, BIT, BYTE, UART | 1.2mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||
| Mfr Part No MEC1609I-PZP | Microchip Technology | Datasheet | 1536 | - | Min: 1 Mult: 1 | 2 Weeks | Surface Mount | Surface Mount | 144-LFBGA | 144 | FLASH | 115 | Automotive grade | -40°C~85°C | Tube | yes | Active | 1 (Unlimited) | 144 | I/O Controller | 3.3V | BOTTOM | BALL | 3.3V | 0.5mm | MEC1609 | ACPI, BC-Link, I2C/SMBus, LPC, PECI, PS/2, SPI, VLPC | 16KB | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | ARC-625D | FLASH (192kB) | 16 | YES | YES | TS 16949 | 32 | 8 | I2C; LPC; PCI; SPI | 0.25 MBps | 8 | ASYNC, BIT, BYTE, UART | 1.2mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||
 | Mfr Part No CP3SP33SMR/NOPB | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | Copper, Silver, Tin | Surface Mount | Surface Mount | 144-LFBGA | 144 | External Program Memory | 36 | 0 | -40°C~85°C | Tray | e1 | no | Obsolete | 1 (Unlimited) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | Connectivity Processor | 8542.31.00.01 | 3V~3.3V | BOTTOM | BALL | 260 | 1.8V | 0.8mm | NOT SPECIFIED | CP3SP33 | 144 | Not Qualified | 1.8V | ACCESS.bus, Audio, Bluetooth, CAN, EBI/EMI, I2S, Microwire/SPI, UART/USART, USB OTG | 96 MHz | 44K x 8 | MICROPROCESSOR CIRCUIT | CR16C | External Program Memory | 16 | CP3000 | 1.4mm | 10mm | 10mm | ROHS3 Compliant | Contains Lead | ||||||||||||||||||||
 | Mfr Part No ML67Q5250-NNNLAGZ3A | ROHM Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 144-LFBGA | 144 | 144-LFBGA (10x10) | FLASH | 3 | -40°C~85°C | Tray | 2011 | Obsolete | 3 (168 Hours) | 85°C | -40°C | Fingerprint Authentication | 2.25V~3.6V | ML67Q5250 | EBI/EMI, SmartCard, SPI, SSIO, UART/USART, USB | 16K x 8 | ARM7TDMI | FLASH (128kB) | ARM | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No CP3SP33SMRX/NOPB | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LFBGA | YES | 144 | External Program Memory | 36 | 0 | -40°C~85°C | Tape & Reel (TR) | e1 | no | Obsolete | 1 (Unlimited) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | Connectivity Processor | 8542.31.00.01 | 3V~3.3V | BOTTOM | BALL | 260 | 1.8V | 0.8mm | NOT SPECIFIED | CP3SP33 | 144 | Not Qualified | 1.8V | ACCESS.bus, Audio, Bluetooth, CAN, EBI/EMI, I2S, Microwire/SPI, UART/USART, USB OTG | 96 MHz | 44K x 8 | MICROPROCESSOR CIRCUIT | CR16C | External Program Memory | 16 | CP3000 | 1.4mm | 10mm | 10mm | ROHS3 Compliant | Contains Lead |
-
MEC1609-PZP
Microchip Technology
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
MEC1609I-PZP
Microchip Technology
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
CP3SP33SMR/NOPB
Texas Instruments
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
ML67Q5250-NNNLAGZ3A
ROHM Semiconductor
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
CP3SP33SMRX/NOPB
Texas Instruments
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire