The category is 'Embedded - Microcontrollers - Application Specific'
- All Manufacturers
- HTS Code
- Ihs Manufacturer
- JESD-30 Code
- Number of Terminals
- Operating Temperature-Max
- Package Body Material
- Package Code
- Package Equivalence Code
- Package Shape
- Package Style
- Qualification Status
- Supply Current-Max
- Supply Current-Max:
150 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Manufacturer Package Code | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | RAM(byte) | Rohs Code | ROM(word) | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Speed | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Bit Size | Seated Height-Max | Address Bus Width | CPU Family | Boundary Scan | Low Power Mode | External Data Bus Width | RAM (words) | Number of Serial I/Os | ROM Programmability | Data Transfer Rate-Max | Communication Protocol | Data Encoding/Decoding Method | Length | Width |
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![]() | Mfr Part No SCN2661BA1F28 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 5.07 MHz | NXP SEMICONDUCTORS | 85 °C | -40 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | 5.25 V | 4.75 V | 5 V | MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | 28 | R-GDIP-T28 | Not Qualified | INDUSTRIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 150 mA | 5.72 mm | 2 | NO | NO | 8 | 0 | 1 | 0.125 MBps | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; BISYNC; X.25; X.75; DDCMP; ADCCP | NRZ | 37.15 mm | 15.24 mm | |||||||||||||||
![]() | Mfr Part No SAB2797B-P | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | INFINEON TECHNOLOGIES AG | 70 °C | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-PDIP-T40 | Not Qualified | COMMERCIAL | 150 mA | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No PDI1394L11D | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | PHILIPS SEMICONDUCTORS | 70 °C | PLASTIC/EPOXY | QFP | QFP, QFP80,.7X.9,32 | QFP80,.7X.9,32 | RECTANGULAR | FLATPACK | Transferred | No | 3.3 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | unknown | R-PQFP-G80 | Not Qualified | COMMERCIAL | 150 mA | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No SCN2661CC1A28 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 5.07 MHz | NXP SEMICONDUCTORS | 70 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-28 | LDCC28,.5SQ | SQUARE | CHIP CARRIER | Obsolete | QLCC | 5.25 V | 4.75 V | 5 V | MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | unknown | 28 | S-PQCC-J28 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 150 mA | 4.57 mm | 2 | NO | NO | 8 | 0 | 1 | 0.125 MBps | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; BISYNC; X.25; X.75; DDCMP; ADCCP | NRZ | 11.5062 mm | 11.5062 mm | ||||||||||||||||
![]() | Mfr Part No SCN2661AC1A28 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 5.07 MHz | NXP SEMICONDUCTORS | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC28,.5SQ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | Obsolete | QLCC | 5.25 V | 4.75 V | 5 V | MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | unknown | 28 | S-PQCC-J28 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 150 mA | 4.57 mm | 2 | NO | NO | 8 | 0 | 1 | 0.125 MBps | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; BISYNC; X.25; X.75; DDCMP; ADCCP | NRZ | 11.5062 mm | 11.5062 mm | ||||||||||||||||
![]() | Mfr Part No SCN2661CA1F28 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 5.07 MHz | NXP SEMICONDUCTORS | 85 °C | -40 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | 5.25 V | 4.75 V | 5 V | MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | 28 | R-GDIP-T28 | Not Qualified | INDUSTRIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 150 mA | 5.72 mm | 2 | NO | NO | 8 | 0 | 1 | 0.125 MBps | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; BISYNC; X.25; X.75; DDCMP; ADCCP | NRZ | 37.15 mm | 15.24 mm | |||||||||||||||
![]() | Mfr Part No STM32W108CBU74 | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | STMICROELECTRONICS | VFQFPN | 3 | 105 °C | -40 °C | UNSPECIFIED | HVQCCN | 7 X 7 MM, ROHS COMPLIANT, VFQFPN-48 | LCC48,.27SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | QFN | 8192 | Yes | 131072 | 1.32 V | 1.18 V | 1.25 V | e3 | Yes | MATTE TIN | 8542.31.00.01 | QUAD | NO LEAD | 260 | 0.5 mm | compliant | 40 | 48 | S-XQCC-N48 | Not Qualified | INDUSTRIAL | 24 MHz | MICROPROCESSOR CIRCUIT | 150 mA | 32 | 1 mm | CORTEX-M3 | FLASH | 7 mm | 7 mm |
SCN2661BA1F28
NXP Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SAB2797B-P
Infineon Technologies AG
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PDI1394L11D
Philips Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SCN2661CC1A28
NXP Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SCN2661AC1A28
NXP Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SCN2661CA1F28
NXP Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
STM32W108CBU74
STMicroelectronics
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
