The category is 'Embedded - Microcontrollers - Application Specific'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Seated Height-Max | Address Bus Width | Primary Clock/Crystal Frequency-Nom | Boundary Scan | Low Power Mode | External Data Bus Width | Output Clock Frequency-Max | Number of Serial I/Os | Bus Compatibility | Data Transfer Rate-Max | Communication Protocol | Data Encoding/Decoding Method | Display Configuration | Length | Width |
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![]() | Mfr Part No SED1522DOA | Epson Electronics America Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 0.021 MHz | S-MOS SYSTEMS | 75 °C | -20 °C | UNSPECIFIED | DIE | DIE, | UNSPECIFIED | UNCASED CHIP | Obsolete | DIE | 5.5 V | 4.5 V | 5 V | 8542.31.00.01 | UPPER | NO LEAD | unknown | 100 | X-XUUC-N100 | Not Qualified | COMMERCIAL EXTENDED | DISPLAY CONTROLLER, DOT MATRIX LCD DRIVER | 1 | 8 | 80 FAMILY; 68 FAMILY | 8 X 69 DOTS | |||||||||||||||||||||||
![]() | Mfr Part No LM8333 | National Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 49 | NATIONAL SEMICONDUCTOR CORP | 1 | 85 °C | -40 °C | UNSPECIFIED | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | Yes | 2.75 V | 2.25 V | e1 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.5 mm | compliant | 40 | S-XBGA-B49 | Not Qualified | INDUSTRIAL | MICROPROCESSOR CIRCUIT | 1.1 mm | 4 mm | 4 mm | ||||||||||||||||||||
![]() | Mfr Part No TDA8005AH/C129 | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU6CG-2SBVA484E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | PLASTIC/EPOXY | FBGA | BGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B484 | OTHER | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | |||||||||||||||||||||
![]() | Mfr Part No TA100T-Y240C2X01-00T-V43 | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU7EG-2LFBVB900E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | 4 | 110 °C | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | OTHER | PROGRAMMABLE SoC | 2.88 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | |||||||||||||||||||||||
![]() | Mfr Part No PCM16C010VJG | National Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | NATIONAL SEMICONDUCTOR CORP | 70 °C | PLASTIC/EPOXY | LFQFP | LFQFP, QFP100,.63SQ,20 | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | No | 5.25 V | 4.75 V | 5 V | e0 | TIN LEAD | 8542.31.00.01 | QUAD | GULL WING | 0.5 mm | unknown | S-PQFP-G100 | Not Qualified | COMMERCIAL | MICROPROCESSOR CIRCUIT | 6.5 mA | 1.6 mm | 14 mm | 14 mm | ||||||||||||||||||||||
![]() | Mfr Part No NRF9161-LACA-R | Nordic Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M-L-ET1310I-DT | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | BROADCOM LTD | , | Active | 8542.31.00.01 | compliant | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU9CG-L1SBVA484I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.742 V | 0.698 V | 0.72 V | e1 | TIN SILVER COPPER | ALSO OPERATES AT 0.85V NOMINAL SUPPLY | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B484 | INDUSTRIAL | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | |||||||||||||||||||
![]() | Mfr Part No XCZU9CG-L1SBVA484I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | XILINX INC | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.742 V | 0.698 V | 0.72 V | ALSO OPERATES AT 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 0.8 mm | unknown | S-PBGA-B484 | INDUSTRIAL | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | |||||||||||||||||||||||
![]() | Mfr Part No IM6102IJL | General Electric Solid State | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | GENERAL ELECTRIC SOLID STATE | 85 °C | -40 °C | CERAMIC | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T40 | Not Qualified | INDUSTRIAL | |||||||||||||||||||||||||||||
![]() | Mfr Part No KS152JB3 | K-micro | Datasheet | - | - | Min: 1 Mult: 1 | KAWASAKI MICROELECTRONICS INC | , | Obsolete | 8542.31.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No KS152JB3 | MegaChips Technology America Corporation | Datasheet | - | - | Min: 1 Mult: 1 | MEGACHIPS CORP | , | Obsolete | 8542.31.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU6EG-2LFFVC900E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | 4 | 110 °C | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B900 | OTHER | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | |||||||||||||||||||||||||
![]() | Mfr Part No PI7C8150MA-33 | Pericom Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | 33 MHz | PERICOM SEMICONDUCTOR CORP | 3 | 85 °C | PLASTIC/EPOXY | QFP | QFP, | SQUARE | FLATPACK | Obsolete | QFP | No | 3.6 V | 3 V | 3.3 V | e0 | EAR99 | TIN LEAD | 8542.31.00.01 | QUAD | GULL WING | 1 mm | compliant | 208 | S-PQFP-G208 | Not Qualified | OTHER | BUS CONTROLLER, PCI | 1.76 mm | 32 | 32 | 17 mm | 17 mm | |||||||||||||||||
![]() | Mfr Part No ICS90C64N | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 20 | INTEGRATED CIRCUIT SYSTEMS INC | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5.5 V | 4.5 V | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T20 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, VIDEO | 30 mA | 14.318 MHz | 75 MHz | ||||||||||||||||||||||
![]() | Mfr Part No ADM6995L | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 128 | 25 MHz | INTEL CORP | PLASTIC/EPOXY | FQFP | PLASTIC, QFP-128 | RECTANGULAR | FLATPACK, FINE PITCH | Contact Manufacturer | 1.9 V | 1.7 V | 1.8 V | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 0.5 mm | compliant | R-PQFP-G128 | Not Qualified | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 3.4 mm | NO | NO | 5 | 12.5 MBps | SYNC, BYTE; ETHERNET | NRZ; NRZI; BIPH-LEVEL (MANCHESTER) | 20 mm | 14 mm | |||||||||||||||||||||
![]() | Mfr Part No ADM6995L | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | YES | 128 | 25 MHz | INFINEON TECHNOLOGIES AG | PLASTIC/EPOXY | FQFP | PLASTIC, QFP-128 | RECTANGULAR | FLATPACK, FINE PITCH | Transferred | QFP | 1.9 V | 1.7 V | 1.8 V | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 0.5 mm | compliant | 128 | R-PQFP-G128 | Not Qualified | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 3.4 mm | NO | NO | 5 | 12.5 MBps | NRZ; NRZI; BIPH-LEVEL(MANCHESTER) | 20 mm | 14 mm | ||||||||||||||||||||
![]() | Mfr Part No TMPZ84C40AP | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | TOSHIBA CORP | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Active | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T40 | Not Qualified | INDUSTRIAL |
SED1522DOA
Epson Electronics America Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
LM8333
National Semiconductor Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
TDA8005AH/C129
Philips Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU6CG-2SBVA484E
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
TA100T-Y240C2X01-00T-V43
Microchip Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU7EG-2LFBVB900E
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PCM16C010VJG
National Semiconductor Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
NRF9161-LACA-R
Nordic Semiconductor
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
M-L-ET1310I-DT
Broadcom Limited
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU9CG-L1SBVA484I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU9CG-L1SBVA484I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
IM6102IJL
General Electric Solid State
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
KS152JB3
K-micro
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
KS152JB3
MegaChips Technology America Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU6EG-2LFFVC900E
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PI7C8150MA-33
Pericom Semiconductor Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
ICS90C64N
Integrated Device Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
ADM6995L
Intel Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
ADM6995L
Infineon Technologies AG
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
TMPZ84C40AP
Toshiba America Electronic Components
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
